SU856757A1 - Machine for ultrasonic grinding - Google Patents

Description

I

The invention relates to ultrasonic processing, in particular to grinding and separating wafers, for example, semiconductor materials, and can be applied in various instruments.

A diamond cutting machine is known in which a diamond is attached to the end of an ultrasonic oscillation concentrator, and the disk tool has a forced rotation.

However, such a machine does not provide high-quality cutting due to insufficient reliability and large material waste.

It is also known a device for cutting hard and brittle materials with a disk tool with an inner cutting edge, provided with a transducer connected to a bending vibration waveguide on which the workpiece is mounted.

A disadvantage of this device is that the processing circuit

does not ensure the preservation of the quality surface of both sides of the part

The purpose of the invention is to increase the productivity of processing while maintaining the quality of the front side of the workpiece.

This goal is achieved by installing a substrate holder on the coordinate table, made in the form of an inverted glass with windows along side surfaces through which a waveguide of flexural vibrations is introduced, pressed against the inner end of the glass with the possibility of sliding.

The drawing shows a structural diagram of the proposed machine.

The machine contains the coordinate table I, the frame 2, mounted on the pindel 3 disk tool 4. The table holder 5, made in the form of a hollow thin-walled glass with windows along the side

The workpiece 6 is fixed at the end of the substrate holder. The ultrasonic transducer 7 with the concentrator is attached to the frame 2 by means of the flange 8. A waveguide 9 of flexural vibrations is attached to the concentrator with a protruding slide 10 at the free end.

For contact with the inner end

1, the substrate holder 5, a waveguide 9 is introduced into a substrate holder through one of its side windows. When this waveguide 9 has a threaded hole

12 in the flexural vibration assembly, which includes a screw 13, screwed into the frame 2, which serves to adjust the pressing force of the support of the waveguide 9 to the substrate holder. Nut

14 and the washer 15 are installed to prevent the screw 13 from being unscrewed by vibration.

The proposed machine works as follows.

Coordinate table 1 is entered from the processing zones to the right, its height position specifies the depth of the cut. Screw

13 set the position of the support for sliding the waveguide 9 in height. The rotation of the spindle 3 is turned on and ultra-oscillations are applied to the part 6. The movement of the coordinate table is set to the left. The substrate holder 5 presses the waveguide 9 down due to the presence of the last lead-in part, which provides the necessary force

clamping the waveguide 9 to the substrate holder 5. The cutting disk 4 cuts the part 6 moving onto it. When the table 1 moves, the support 10 of the waveguide 9 slides along the inner end Ii of the substrate holder 5, and if it is made in the form of a bearing, it rolls along it.

The design of the proposed machine makes it possible to increase the productivity of processing and protect both sides of the plate from direct contact with the waveguide support. When separating the plates, it is most important to protect the face of the part.

Claims (1)

Invention Formula A machine for ultrasonic grinding or plate separation by means of a disk tool mounted on a spindle, equipped with an oscillating system mounted on a frame, and a coordinate table with a substrate holder, which is different in that with the aim of improving processing performance while maintaining the quality of the front side the substrate holder is made in the form of an inverted glass, on the side surface of which there are windows dp entering the waveguide from nbnyh oscillation is urged to the inner end cup slidably.