TH65466A - The method of operation with a laser machine. - Google Patents

Abstract

DC60 (10/03/53) This invention provides a unique laser processing method by the following assembly steps: attachment of a shielding strip 25 to the back surface 3 of wafer 1a; formation of a multiphoton absorption fusion region 13 by projection of a laser beam L such that the focal point P of the laser beam L is placed within substrate 15, with the back surface 21 of wafer 1a serving as the laser beam entry plane; formation of a cut-off point 8 corresponding to this fusion 13 at a predetermined distance or shorter from the laser beam entry plane along the planar cut line 5 of wafer 1a; attachment of a stretching strip 23 to the back surface 21 of wafer 1a; and division into several chip-shaped segments 24 resulting from cutting wafer 1a using the cut-off point 8 as the starting point. By stretching the stretchable film 23, this invention provides a unique laser processing method by incorporating the following steps: attaching the stretch strip 25 to the back surface 3 of wafer 1a; forming a fusion region 13 created by multiphoton absorption by projecting a laser beam L in a manner where the focal point P of the laser beam L is placed within substrate 15, with the back surface 21 of wafer 1a serving as the laser beam entry plane; forming a cut point 8 corresponding to this fusion 13 at a predetermined distance or shorter from the laser beam entry plane along the planar cut line 5 of wafer 1a; attaching the stretch strip 23 to the back surface 21 of wafer 1a and separating it into several chip-shaped components 24 resulting from the cutting of wafer 1a using the cut point 8 as the starting point. By stretching the 23-degree stretchable film.

Claims (9)

1. A Weser-Operated Method for cutting flat-shaped parts with substrates and overlays provided on the substrates. The process of: Attaching the masking film to the front surface on the overlap of the workpiece. Area formation The modifications formed by the absorption of a plural photon. It is created by the act of projecting the back surface of the workpiece with a laser beam in such a way that the convering point of the laser beam is positioned within the workpiece, so that the back surface of the workpiece acts as a side plane. Entry of lever beam, formation at the beginning of the cut, where the cutting starts from this area. Rises corresponding to the modification area at a predetermined or shorter distance from the inward plane of the laser beam along the contour of the planned cut-off line of the workpiece; Attaching the adhesive film to the back surface of the workpiece; And dividing the bearing into a number of parts Which happened due to the results of cutting work Using the starting point of the cut as the starting point By making the film holding it out 2. Method of operation with a waver machine for cutting flat-shaped workpieces that include Substrates and overlays provided on the substrates The steps are to be included in the process of: bonding the film onto the front surface on the side of the overlap of the workpiece; Modification of the modified area formed by the absorption of a plural photon. Up to the devil by action Projection with a laser beam that converges inside the substrate, with the back surface of the target acting. Into the side of the beam to bend the laser beam; The formation at the cutting origin is consistent with this modification area at a predetermined or shorter distance from the laser beam input plane. Along the line of the cut along The plan of the workpiece; Attaching the adhesive film to the back surface of the workpiece; Cutting the workpiece into a number of parts using the cut start area as the starting point by applying external force to the workpiece; And splitting into a number of parts by allowing the film to hold off. 3.Laser-operated method for cutting flat-shaped parts assembled with substrates and overlays provided on the substrates. The steps are included: gluing the film to the front surface on the side of the hidden layer of the workpiece; Modification of the modified area formed by the absorption of a plural photon. Come up by action Projection with a laser beam that converges inside the substrate. By allowing the back surface of the workpiece to function Is the inward plane of the laser beam; The formation at the cutting origin is aligned with this modification area at a predetermined or shorter distance from the input plane of the lever. Along the line of the cut along The plan of the workpiece; Attaching the adhesive film to the back surface of the workpiece; And cutting the workpiece into a number of parts using the starting point of the cut by stretching the adhesive film. And splitting into a number of parts 4. The lever-operated method is used for cutting flat-plate parts that include The semiconductor substrates and the overlays provided on the semiconductor substrates are composed of the procedure of: Attaching the protective film to the front surface on the side of the stacking layer of the workpiece; Formation of the fused area by performing laser beam projections concentrated inside the substrate, where the back surface of the target acts as the inward plane of the laser beam; The formation at the cutting origin is aligned with this fusion area at a predetermined or shorter distance from the laser beam input plane. Along the line of the cut along The plan of the workpiece; Attaching the adhesive film to the back surface of the workpiece; And separation into a number of parts, which arose as a result of cutting. Using the starting point of the cut as the starting point By stretching the adhesive film 5.Laser operation method for cutting the composite flat sheet. The semiconductor substrate and the layer prepared on the semiconductor substrate are combined with the procedure of: bonding the film to the side surface of the overlap of the part. work; Formation of the fused area by the act of projecting a lever beam that converges inside the substrate, where the back surface of the workpiece acts as the inward plane of the laser beam; The formation at the cutting origin is aligned with this aggregate area at a predetermined or shorter distance from the input plane of the lever. Along the line of the cut along The plan of the workpiece; Attaching the adhesive film to the back surface of the workpiece; Cutting into a number of parts Using the starting point of the cut as the starting point By allowing external forces to act on the workpiece; And splitting into a number of parts by stretching the filament. 6. The lever-operated method is used for cutting flat-plate composite parts. Substrate And the overlaid layer provided on the semiconductor substrate The steps are included in the process of: Attaching the protective film to the front surface on the overlap of the workpiece; Formation of the fused area by performing laser beam projections that converge inside the substrate, where the back surface of the target acts as the inward plane of the laser beam; The formation at the cutting origin is coherent to this total casting area at a predetermined or shorter distance from the laser beam input plane. Along the line of the cut along The plan of the workpiece; Attaching the adhesive film to the back surface of the workpiece; And cutting into a number of parts Using the starting point of trimming By stretching the cling film and separating it into a number of parts. 7.Method of operation with a laser in accordance with one of Clause 1 to 6. Where the matte The back of the workpiece has been polished to thin the substrate. Before the formation of the starting area Cut up the workpiece 8.Method of operation with the laser in accordance with any one of Clause 1 to 7. Where the protective film is removed after attaching the adhesive film to the workpiece. 9.Method of operation with a laser in accordance with one of Clause 1 to 7. Where the kum-kan film was eliminated After dividing the workpiece into a number of parts by making Cling film stretched