TH87938A - Method for improved bonding of polymer materials to copper or copper alloys. - Google Patents
Method for improved bonding of polymer materials to copper or copper alloys.Info
- Publication number
- TH87938A TH87938A TH601004322A TH0601004322A TH87938A TH 87938 A TH87938 A TH 87938A TH 601004322 A TH601004322 A TH 601004322A TH 0601004322 A TH0601004322 A TH 0601004322A TH 87938 A TH87938 A TH 87938A
- Authority
- TH
- Thailand
- Prior art keywords
- copper
- printed circuit
- circuit boards
- polymer materials
- copper alloys
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract 7
- 229910052802 copper Inorganic materials 0.000 title claims abstract 7
- 239000010949 copper Substances 0.000 title claims abstract 7
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract 4
- 238000000034 method Methods 0.000 title abstract 3
- 239000002861 polymer material Substances 0.000 title 1
- 229920000307 polymer substrate Polymers 0.000 claims abstract 3
- 239000000758 substrate Substances 0.000 claims abstract 3
- 239000003054 catalyst Substances 0.000 claims 2
- -1 halide ions Chemical class 0.000 claims 2
- VTLYFUHAOXGGBS-UHFFFAOYSA-N Fe3+ Chemical compound [Fe+3] VTLYFUHAOXGGBS-UHFFFAOYSA-N 0.000 claims 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims 1
- 239000004202 carbamide Substances 0.000 claims 1
- 230000002596 correlated effect Effects 0.000 claims 1
- 229910001447 ferric ion Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 150000007524 organic acids Chemical class 0.000 claims 1
- 235000005985 organic acids Nutrition 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 229910000679 solder Inorganic materials 0.000 abstract 2
- 238000004381 surface treatment Methods 0.000 abstract 2
Abstract
DC60 (02/11/49) สิ่งประดิษฐ์นี้เกี่ยวกับวิธีการบำบัดพื้นผิวหน้าของทองแดงหรือโลหะผสมของทองแดง สำหรับการเกิดพันธะแน่นหนากับซับสเทรทที่เป็นพอลิเมอร์ ตัวอย่างเช่น หน้ากากโลหะบัดกรีที่พบ ในแผงวงจรพิมพ์ที่มีหลายชั้น โดยทั่ว ๆ ไป ซับสเทรทเป็นอุปกรณ์-กึ่งตัวนำ กรอบตะกั่ว หรือ แผงวงจรพิมพ์ สิ่งประดิษฐ์นี้เกี่ยวกับวิธีการบำบัดพื้นผิวหน้าของทองแดงหรือโลหะผสมของทองแดง สำหรับการเกิดพันธะแน่นหนากับซับสเทรทที่เป็นพอลิเมอร์ ตัวอย่างเช่น หน้ากากโลหะบัดกรีที่พบ ในแผงวงจรพิมพ์ที่มีหลายชั้น โดยทั่ว ๆ ไป ซับสเทรทเป็นอุปกรณ์-กึ่งตัวนำ กรอบตะกั่ว หรือ แผงวงจรพิมพ์ DC60 (02/11/49) This invention deals with methods for surface treatment of copper or copper alloys. For the formation of a strong bond with a polymer substrate, for example a solder mask found In multilayer printed circuit boards, substrates are generally devices - semiconductors, lead frames, or printed circuit boards. This invention deals with a method for surface treatment of copper or copper alloys. For the formation of a strong bond with a polymer substrate, for example a solder mask found In general multi-layer printed circuit boards, substrates are semiconductor devices, lead frames, or printed circuit boards.
Claims (1)
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TH87938A true TH87938A (en) | 2007-12-20 |
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