TR25247A - Lehim eki tesbit edici sistemi - Google Patents
Lehim eki tesbit edici sistemiInfo
- Publication number
- TR25247A TR25247A TR90/1226A TR122690A TR25247A TR 25247 A TR25247 A TR 25247A TR 90/1226 A TR90/1226 A TR 90/1226A TR 122690 A TR122690 A TR 122690A TR 25247 A TR25247 A TR 25247A
- Authority
- TR
- Turkey
- Prior art keywords
- detector system
- solder attachment
- attachment detector
- solder
- detector
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/60—Analysis of geometric attributes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
- G01N23/083—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the radiation being X-rays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
- G01N23/18—Investigating the presence of flaws defects or foreign matter
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30152—Solder
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Theoretical Computer Science (AREA)
- Geometry (AREA)
- Toxicology (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Data Mining & Analysis (AREA)
- Databases & Information Systems (AREA)
- Mathematical Physics (AREA)
- Software Systems (AREA)
- General Engineering & Computer Science (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Image Analysis (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Image Processing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/454,804 US5164994A (en) | 1989-12-21 | 1989-12-21 | Solder joint locator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TR25247A true TR25247A (tr) | 1993-01-01 |
Family
ID=23806172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TR90/1226A TR25247A (tr) | 1989-12-21 | 1990-12-18 | Lehim eki tesbit edici sistemi |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5164994A (tr) |
| EP (1) | EP0433803A1 (tr) |
| JP (1) | JPH04120403A (tr) |
| KR (1) | KR940000029B1 (tr) |
| CA (1) | CA2029540C (tr) |
| IL (1) | IL96335A0 (tr) |
| NO (1) | NO905397L (tr) |
| TR (1) | TR25247A (tr) |
Families Citing this family (56)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5621811A (en) * | 1987-10-30 | 1997-04-15 | Hewlett-Packard Co. | Learning method and apparatus for detecting and controlling solder defects |
| US6067379A (en) * | 1988-12-09 | 2000-05-23 | Cognex Corporation | Method and apparatus for locating patterns in an optical image |
| FR2683647B1 (fr) * | 1991-11-13 | 1994-02-25 | Sodern Etudes Realisa Nucleaires | Dispositif de lecture et d'analyse d'image. |
| US5555316A (en) * | 1992-06-30 | 1996-09-10 | Matsushita Electric Industrial Co., Ltd. | Inspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic component |
| US5991435A (en) * | 1992-06-30 | 1999-11-23 | Matsushita Electric Industrial Co., Ltd. | Inspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic component |
| JP3051279B2 (ja) * | 1993-05-13 | 2000-06-12 | シャープ株式会社 | バンプ外観検査方法およびバンプ外観検査装置 |
| JP3205432B2 (ja) * | 1993-06-10 | 2001-09-04 | 松下電器産業株式会社 | 装着部品検査装置と装着部品検査方法 |
| CA2113752C (en) * | 1994-01-19 | 1999-03-02 | Stephen Michael Rooks | Inspection system for cross-sectional imaging |
| US5500886A (en) * | 1994-04-06 | 1996-03-19 | Thermospectra | X-ray position measuring and calibration device |
| US6084986A (en) * | 1995-02-13 | 2000-07-04 | Eastman Kodak Company | System and method for finding the center of approximately circular patterns in images |
| US6026176A (en) * | 1995-07-25 | 2000-02-15 | Cognex Corporation | Machine vision methods and articles of manufacture for ball grid array inspection |
| US5872870A (en) * | 1996-02-16 | 1999-02-16 | Cognex Corporation | Machine vision methods for identifying extrema of objects in rotated reference frames |
| US5909504A (en) * | 1996-03-15 | 1999-06-01 | Cognex Corporation | Method of testing a machine vision inspection system |
| US6259827B1 (en) | 1996-03-21 | 2001-07-10 | Cognex Corporation | Machine vision methods for enhancing the contrast between an object and its background using multiple on-axis images |
| US6298149B1 (en) | 1996-03-21 | 2001-10-02 | Cognex Corporation | Semiconductor device image inspection with contrast enhancement |
| US5978502A (en) * | 1996-04-01 | 1999-11-02 | Cognex Corporation | Machine vision methods for determining characteristics of three-dimensional objects |
| US5703394A (en) * | 1996-06-10 | 1997-12-30 | Motorola | Integrated electro-optical package |
| US6137893A (en) * | 1996-10-07 | 2000-10-24 | Cognex Corporation | Machine vision calibration targets and methods of determining their location and orientation in an image |
| US5960125A (en) | 1996-11-21 | 1999-09-28 | Cognex Corporation | Nonfeedback-based machine vision method for determining a calibration relationship between a camera and a moveable object |
| US5953130A (en) * | 1997-01-06 | 1999-09-14 | Cognex Corporation | Machine vision methods and apparatus for machine vision illumination of an object |
| US6075881A (en) * | 1997-03-18 | 2000-06-13 | Cognex Corporation | Machine vision methods for identifying collinear sets of points from an image |
| US5974169A (en) * | 1997-03-20 | 1999-10-26 | Cognex Corporation | Machine vision methods for determining characteristics of an object using boundary points and bounding regions |
| EP0980520B1 (de) | 1997-05-05 | 2003-08-06 | Macrotron Process Technologies Gmbh | Verfahren und schaltungsanordnung zur prüfung von lötstellen |
| US6141033A (en) * | 1997-05-15 | 2000-10-31 | Cognex Corporation | Bandwidth reduction of multichannel images for machine vision |
| US6608647B1 (en) | 1997-06-24 | 2003-08-19 | Cognex Corporation | Methods and apparatus for charge coupled device image acquisition with independent integration and readout |
| US5978080A (en) * | 1997-09-25 | 1999-11-02 | Cognex Corporation | Machine vision methods using feedback to determine an orientation, pixel width and pixel height of a field of view |
| US6025854A (en) * | 1997-12-31 | 2000-02-15 | Cognex Corporation | Method and apparatus for high speed image acquisition |
| US6236769B1 (en) | 1998-01-28 | 2001-05-22 | Cognex Corporation | Machine vision systems and methods for morphological transformation of an image with zero or other uniform offsets |
| US6282328B1 (en) | 1998-01-28 | 2001-08-28 | Cognex Corporation | Machine vision systems and methods for morphological transformation of an image with non-uniform offsets |
| US6215915B1 (en) | 1998-02-20 | 2001-04-10 | Cognex Corporation | Image processing methods and apparatus for separable, general affine transformation of an image |
| US6381375B1 (en) | 1998-02-20 | 2002-04-30 | Cognex Corporation | Methods and apparatus for generating a projection of an image |
| US6633663B1 (en) * | 1998-05-05 | 2003-10-14 | International Business Machines Corporation | Method and system for determining component dimensional information |
| US6314201B1 (en) | 1998-10-16 | 2001-11-06 | Agilent Technologies, Inc. | Automatic X-ray determination of solder joint and view delta Z values from a laser mapped reference surface for circuit board inspection using X-ray laminography |
| US6526165B1 (en) * | 1998-11-30 | 2003-02-25 | Cognex Corporation | Methods and apparatuses for refining a geometric description of an object having a plurality of extensions |
| US6687402B1 (en) | 1998-12-18 | 2004-02-03 | Cognex Corporation | Machine vision methods and systems for boundary feature comparison of patterns and images |
| US6381366B1 (en) | 1998-12-18 | 2002-04-30 | Cognex Corporation | Machine vision methods and system for boundary point-based comparison of patterns and images |
| KR100339008B1 (ko) * | 1999-04-12 | 2002-05-31 | 구자홍 | X-선을 이용한 pcb의 단층 검사방법 |
| US6898333B1 (en) | 1999-08-06 | 2005-05-24 | Cognex Corporation | Methods and apparatus for determining the orientation of an object in an image |
| US6813377B1 (en) * | 1999-08-06 | 2004-11-02 | Cognex Corporation | Methods and apparatuses for generating a model of an object from an image of the object |
| GB9918681D0 (en) * | 1999-08-09 | 1999-10-13 | Smithkline Beecham Plc | Novel method |
| GB9923795D0 (en) * | 1999-10-09 | 1999-12-08 | British Aerospace | Micropositioning system |
| US6684402B1 (en) | 1999-12-01 | 2004-01-27 | Cognex Technology And Investment Corporation | Control methods and apparatus for coupling multiple image acquisition devices to a digital data processor |
| US6748104B1 (en) | 2000-03-24 | 2004-06-08 | Cognex Corporation | Methods and apparatus for machine vision inspection using single and multiple templates or patterns |
| US6744913B1 (en) * | 2000-04-18 | 2004-06-01 | Semiconductor Technology & Instruments, Inc. | System and method for locating image features |
| US6459807B1 (en) * | 2000-06-13 | 2002-10-01 | Semiconductor Technologies & Instruments, Inc. | System and method for locating irregular edges in image data |
| US7006669B1 (en) | 2000-12-31 | 2006-02-28 | Cognex Corporation | Machine vision method and apparatus for thresholding images of non-uniform materials |
| US7024031B1 (en) * | 2001-10-23 | 2006-04-04 | August Technology Corp. | System and method for inspection using off-angle lighting |
| US6847900B2 (en) * | 2001-12-17 | 2005-01-25 | Agilent Technologies, Inc. | System and method for identifying solder joint defects |
| JP3974022B2 (ja) * | 2002-11-21 | 2007-09-12 | 富士通株式会社 | 半田付け検査の特徴量算出方法及び装置並びに前記方法を実行するためのプログラム |
| US7773270B2 (en) * | 2004-01-07 | 2010-08-10 | Hewlett-Packard Development Company, L.P. | Image scanner feature detection |
| US7639861B2 (en) | 2005-09-14 | 2009-12-29 | Cognex Technology And Investment Corporation | Method and apparatus for backlighting a wafer during alignment |
| US8111904B2 (en) | 2005-10-07 | 2012-02-07 | Cognex Technology And Investment Corp. | Methods and apparatus for practical 3D vision system |
| US8162584B2 (en) | 2006-08-23 | 2012-04-24 | Cognex Corporation | Method and apparatus for semiconductor wafer alignment |
| US7529336B2 (en) | 2007-05-31 | 2009-05-05 | Test Research, Inc. | System and method for laminography inspection |
| CN104535587A (zh) * | 2014-12-23 | 2015-04-22 | 安徽科鸣三维科技有限公司 | 一种基于机器视觉的pcba焊点检测方法 |
| WO2024049999A1 (en) | 2022-08-31 | 2024-03-07 | Kollmorgen Corporation | Extended pad area to prevent printed circuit board damage |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4415980A (en) * | 1981-03-02 | 1983-11-15 | Lockheed Missiles & Space Co., Inc. | Automated radiographic inspection system |
| US4809308A (en) * | 1986-02-20 | 1989-02-28 | Irt Corporation | Method and apparatus for performing automated circuit board solder quality inspections |
| US4876455A (en) * | 1988-02-25 | 1989-10-24 | Westinghouse Electric Corp. | Fiber optic solder joint inspection system |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4103287A (en) * | 1973-12-17 | 1978-07-25 | Bell Telephone Laboratories, Incorporated | Variable length codes for high quality image encoding |
| US4508452A (en) * | 1975-08-27 | 1985-04-02 | Robotic Vision Systems, Inc. | Arrangement for sensing the characteristics of a surface and determining the position of points thereon |
| US4183013A (en) * | 1976-11-29 | 1980-01-08 | Coulter Electronics, Inc. | System for extracting shape features from an image |
| US4189711A (en) * | 1977-11-08 | 1980-02-19 | Bell Telephone Laboratories, Incorporated | Multilevel processing of image signals |
| US4472056A (en) * | 1980-07-23 | 1984-09-18 | Hitachi, Ltd. | Shape detecting apparatus |
| US4427880A (en) * | 1981-06-29 | 1984-01-24 | Westinghouse Electric Corp. | Non-contact visual proximity sensing apparatus |
| US4445137A (en) * | 1981-09-11 | 1984-04-24 | Machine Intelligence Corporation | Data modifier apparatus and method for machine vision systems |
| US4499597A (en) * | 1982-03-29 | 1985-02-12 | Hughes Aircraft Company | Small-object location utilizing centroid accumulation |
| US4650333A (en) * | 1984-04-12 | 1987-03-17 | International Business Machines Corporation | System for measuring and detecting printed circuit wiring defects |
| JPS61237002A (ja) * | 1985-04-13 | 1986-10-22 | Matsushita Electric Works Ltd | 金属板を心材とする多層プリント基板における孔位置検出装置 |
| US4791676A (en) * | 1985-09-12 | 1988-12-13 | International Business Machines Corporation | Method and means for efficiently handling boundary conditions in connected component labeling |
| US4756696A (en) * | 1985-12-06 | 1988-07-12 | Amp Incorporated | Solder joint inspection feature for surface mount connectors |
| EP0236738A3 (en) * | 1986-02-05 | 1988-12-21 | OMRON Corporation | Input method for reference printed circuit board assembly data to an image processing printed circuit board assembly automatic inspection apparatus |
| JPS62209304A (ja) * | 1986-03-10 | 1987-09-14 | Fujitsu Ltd | 寸法測定方法 |
| JPS62267610A (ja) * | 1986-05-16 | 1987-11-20 | Fuji Electric Co Ltd | 対象パタ−ンの回転角検出方式 |
| US4955062A (en) * | 1986-12-10 | 1990-09-04 | Canon Kabushiki Kaisha | Pattern detecting method and apparatus |
| JPS647176A (en) * | 1987-06-29 | 1989-01-11 | Meidensha Electric Mfg Co Ltd | Outline detection device |
| US4926452A (en) * | 1987-10-30 | 1990-05-15 | Four Pi Systems Corporation | Automated laminography system for inspection of electronics |
| US4910757A (en) * | 1987-11-06 | 1990-03-20 | Hitachi, Ltd. | Method and apparatus for X-ray imaging |
| US4852131A (en) * | 1988-05-13 | 1989-07-25 | Advanced Research & Applications Corporation | Computed tomography inspection of electronic devices |
-
1989
- 1989-12-21 US US07/454,804 patent/US5164994A/en not_active Expired - Lifetime
-
1990
- 1990-11-09 CA CA002029540A patent/CA2029540C/en not_active Expired - Fee Related
- 1990-11-13 IL IL96335A patent/IL96335A0/xx active IP Right Review Request
- 1990-12-07 EP EP90123578A patent/EP0433803A1/en not_active Withdrawn
- 1990-12-13 NO NO90905397A patent/NO905397L/no unknown
- 1990-12-18 TR TR90/1226A patent/TR25247A/tr unknown
- 1990-12-20 KR KR1019900021149A patent/KR940000029B1/ko not_active Expired - Fee Related
- 1990-12-21 JP JP2413356A patent/JPH04120403A/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4415980A (en) * | 1981-03-02 | 1983-11-15 | Lockheed Missiles & Space Co., Inc. | Automated radiographic inspection system |
| US4415980B1 (tr) * | 1981-03-02 | 1987-12-29 | ||
| US4809308A (en) * | 1986-02-20 | 1989-02-28 | Irt Corporation | Method and apparatus for performing automated circuit board solder quality inspections |
| US4876455A (en) * | 1988-02-25 | 1989-10-24 | Westinghouse Electric Corp. | Fiber optic solder joint inspection system |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2029540A1 (en) | 1991-06-22 |
| KR910012993A (ko) | 1991-08-08 |
| NO905397L (no) | 1991-06-24 |
| KR940000029B1 (ko) | 1994-01-05 |
| IL96335A0 (en) | 1991-08-16 |
| EP0433803A1 (en) | 1991-06-26 |
| JPH04120403A (ja) | 1992-04-21 |
| US5164994A (en) | 1992-11-17 |
| NO905397D0 (no) | 1990-12-13 |
| CA2029540C (en) | 1994-05-24 |
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