TW200410376A - Coil-embedded with multi-layer substrate, semiconductor chip, and the manufacturing method thereof - Google Patents

Coil-embedded with multi-layer substrate, semiconductor chip, and the manufacturing method thereof Download PDF

Info

Publication number
TW200410376A
TW200410376A TW092114602A TW92114602A TW200410376A TW 200410376 A TW200410376 A TW 200410376A TW 092114602 A TW092114602 A TW 092114602A TW 92114602 A TW92114602 A TW 92114602A TW 200410376 A TW200410376 A TW 200410376A
Authority
TW
Taiwan
Prior art keywords
coil
multilayer substrate
coils
winding portion
substrate
Prior art date
Application number
TW092114602A
Other languages
English (en)
Chinese (zh)
Inventor
Masahiko Oshimura
Kouichirou Sagawa
Original Assignee
Ajinomoto Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Kk filed Critical Ajinomoto Kk
Publication of TW200410376A publication Critical patent/TW200410376A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H01F27/363—Electric or magnetic shields or screens made of electrically conductive material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/497—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW092114602A 2002-05-29 2003-05-29 Coil-embedded with multi-layer substrate, semiconductor chip, and the manufacturing method thereof TW200410376A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002156261A JP2005347286A (ja) 2002-05-29 2002-05-29 コイル内蔵多層基板、半導体チップ、及びそれらの製造方法

Publications (1)

Publication Number Publication Date
TW200410376A true TW200410376A (en) 2004-06-16

Family

ID=29561465

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092114602A TW200410376A (en) 2002-05-29 2003-05-29 Coil-embedded with multi-layer substrate, semiconductor chip, and the manufacturing method thereof

Country Status (4)

Country Link
JP (1) JP2005347286A (fr)
AU (1) AU2003241820A1 (fr)
TW (1) TW200410376A (fr)
WO (1) WO2003100853A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI597001B (zh) * 2013-05-13 2017-08-21 日東電工股份有限公司 線圈印刷配線基板、受電模組、電池單元及受電通訊模組
CN115206656A (zh) * 2021-04-08 2022-10-18 恒劲科技股份有限公司 电感结构
CN115732168A (zh) * 2021-09-01 2023-03-03 恒劲科技股份有限公司 电子封装件

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5433199B2 (ja) * 2008-10-21 2014-03-05 学校法人慶應義塾 電子回路
KR101575387B1 (ko) * 2009-03-18 2015-12-07 에이저 시스템즈 엘엘시 집적 회로 인덕터 구조체, 전자 시스템 및 집적 회로 인덕터 사이의 자기 커플링 감소 방법
US20120314389A1 (en) * 2011-03-25 2012-12-13 Ibiden Co., Ltd. Wiring board and method for manufacturing same
US9113569B2 (en) * 2011-03-25 2015-08-18 Ibiden Co., Ltd. Wiring board and method for manufacturing same
JP5767495B2 (ja) 2011-03-29 2015-08-19 パナソニック株式会社 可変インダクタ及びこれを用いた半導体装置
JP2013070035A (ja) * 2011-09-22 2013-04-18 Ibiden Co Ltd 多層プリント配線板
US9275950B2 (en) * 2012-05-29 2016-03-01 Taiwan Semiconductor Manufacturing Co., Ltd. Bead for 2.5D/3D chip packaging application
JP5907124B2 (ja) 2013-07-24 2016-04-20 株式会社村田製作所 高周波部品およびフィルタ部品
JP5970714B2 (ja) 2013-10-30 2016-08-17 株式会社村田製作所 電子部品
JP6327639B2 (ja) * 2014-04-18 2018-05-23 日本電信電話株式会社 直交型ソレノイドインダクタ
JP6582401B2 (ja) * 2014-12-01 2019-10-02 富士電機株式会社 信号伝達装置
JP6989465B2 (ja) 2018-09-05 2022-01-05 株式会社東芝 磁気カプラ及び通信システム
JP7219136B2 (ja) * 2019-03-27 2023-02-07 本田技研工業株式会社 半導体装置
KR20230010476A (ko) * 2021-07-12 2023-01-19 삼성전기주식회사 코일 부품
WO2023048105A1 (fr) * 2021-09-21 2023-03-30 ローム株式会社 Puce de transformateur
JP2024064086A (ja) * 2022-10-27 2024-05-14 Tdk株式会社 積層型電子部品
WO2025154346A1 (fr) * 2024-01-19 2025-07-24 国立大学法人 東京大学 Dispositif à semi-conducteur et puce à semi-conducteur

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04237106A (ja) * 1991-01-21 1992-08-25 Nippon Telegr & Teleph Corp <Ntt> 集積化インダクタンス素子及び集積化トランス
JPH0555043A (ja) * 1991-08-22 1993-03-05 Fujitsu Ltd 小型コイルとその製造方法，磁気ヘツドの製造方法及び磁気記憶装置
EP0588503B1 (fr) * 1992-09-10 1998-10-07 National Semiconductor Corporation Circuit intégré d'élément de mémoire magnétique et sa méthode de fabrication
JPH08250333A (ja) * 1995-03-14 1996-09-27 Taiyo Yuden Co Ltd インダクタアレイ
JPH0945866A (ja) * 1995-08-02 1997-02-14 Hitachi Ltd マイクロ波集積回路
JPH10154795A (ja) * 1996-11-19 1998-06-09 Advanced Materials Eng Res Inc 半導体チップにおけるインダクター及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI597001B (zh) * 2013-05-13 2017-08-21 日東電工股份有限公司 線圈印刷配線基板、受電模組、電池單元及受電通訊模組
US9843216B2 (en) 2013-05-13 2017-12-12 Nitto Denko Corporation Coil printed circuit board, power reception module, battery unit and power reception communication module
CN115206656A (zh) * 2021-04-08 2022-10-18 恒劲科技股份有限公司 电感结构
CN115732168A (zh) * 2021-09-01 2023-03-03 恒劲科技股份有限公司 电子封装件

Also Published As

Publication number Publication date
WO2003100853A1 (fr) 2003-12-04
JP2005347286A (ja) 2005-12-15
AU2003241820A1 (en) 2003-12-12

Similar Documents

Publication Publication Date Title
TW200410376A (en) Coil-embedded with multi-layer substrate, semiconductor chip, and the manufacturing method thereof
JP3800540B2 (ja) インダクタンス素子の製造方法と積層電子部品と積層電子部品モジュ−ルとこれらの製造方法
US7212095B2 (en) Inductive element and manufacturing method of the same
CN101136397B (zh) 电子部件模块及其制造方法
KR101580709B1 (ko) 칩 인덕터
TW200405544A (en) Inductance element, multi-layer substrate with embedded inductance element, semiconductor chip, and chip-type inductance element
JP6566455B2 (ja) コイル部品及びその製造方法
CN105225793B (zh) 电感器及其制造方法
CN106328339A (zh) 线圈部件
JP2008171965A (ja) 超小型電力変換装置
CN104700982A (zh) 片式电子组件及其制造方法
US20160284462A1 (en) Coil-embedded integrated circuit substrate and method of manufacturing the same
JP2006032587A (ja) インダクタンス部品およびその製造方法
US10529476B2 (en) Coil component and method for manufacturing the same
KR102194725B1 (ko) 코일 전자부품
JP3436525B2 (ja) 多層基板と電子部品と多層基板の製造方法
JP4835414B2 (ja) 超小型電力変換装置
KR20180116604A (ko) 인덕터 및 그 제조방법
US20220293329A1 (en) Inductor component and electronic component
WO2004021374A1 (fr) Element inducteur variable, substrat multicouches a element inducteur variable incorpore, puce semi-conductrice, et element inducteur variable a puce
JP2004127966A (ja) インダクティブ素子とその製造方法
JP2002222712A (ja) Ｌｃ複合素子
TW200400523A (en) Inductor capacitor serial resonant circuit, board with built-in inductor capacitor serial resonant circuit, and manufacturing method of the same
JP2003282328A (ja) 薄型磁性素子及びその製造方法並びにそれを用いた電源モジュール
JP2005347287A (ja) 多層基板内シールド線、半導体チップ、電子回路素子、及びそれらの製造方法