TW200428477A - Substrate conveying system - Google Patents

Substrate conveying system Download PDF

Info

Publication number
TW200428477A
TW200428477A TW093108418A TW93108418A TW200428477A TW 200428477 A TW200428477 A TW 200428477A TW 093108418 A TW093108418 A TW 093108418A TW 93108418 A TW93108418 A TW 93108418A TW 200428477 A TW200428477 A TW 200428477A
Authority
TW
Taiwan
Prior art keywords
substrate
tunnel
transfer
arm
interface device
Prior art date
Application number
TW093108418A
Other languages
English (en)
Chinese (zh)
Inventor
Yasushi Naito
Original Assignee
Hirata Spinning
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hirata Spinning filed Critical Hirata Spinning
Publication of TW200428477A publication Critical patent/TW200428477A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3216—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3222—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW093108418A 2003-03-28 2004-03-26 Substrate conveying system TW200428477A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003091794 2003-03-28

Publications (1)

Publication Number Publication Date
TW200428477A true TW200428477A (en) 2004-12-16

Family

ID=33127294

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093108418A TW200428477A (en) 2003-03-28 2004-03-26 Substrate conveying system

Country Status (3)

Country Link
JP (1) JPWO2004088742A1 (ja)
TW (1) TW200428477A (ja)
WO (1) WO2004088742A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI382951B (zh) * 2005-06-22 2013-01-21 平田機工股份有限公司 Workpiece handling system

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009012877A (ja) * 2007-06-29 2009-01-22 Ihi Corp 浮上搬送装置
US8282698B2 (en) * 2010-03-24 2012-10-09 Lam Research Corporation Reduction of particle contamination produced by moving mechanisms in a process tool
JP6660246B2 (ja) * 2016-05-02 2020-03-11 株式会社エナテック 乾燥装置、及び塗布システム

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0831506B2 (ja) * 1986-07-17 1996-03-27 松下電器産業株式会社 基板搬送装置
JPS63104440A (ja) * 1986-10-22 1988-05-09 Nippei Toyama Corp 搬送装置
JPH07172578A (ja) * 1993-12-15 1995-07-11 Ebara Corp トンネル搬送装置
JPH07228345A (ja) * 1994-02-14 1995-08-29 Ebara Corp トンネル搬送装置
JPH07231028A (ja) * 1994-02-18 1995-08-29 Ebara Corp 搬送装置および搬送方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI382951B (zh) * 2005-06-22 2013-01-21 平田機工股份有限公司 Workpiece handling system

Also Published As

Publication number Publication date
WO2004088742A1 (ja) 2004-10-14
JPWO2004088742A1 (ja) 2006-07-06

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