TW200428544A - Ball forming device for wire-bonding device - Google Patents

Ball forming device for wire-bonding device Download PDF

Info

Publication number
TW200428544A
TW200428544A TW093103740A TW93103740A TW200428544A TW 200428544 A TW200428544 A TW 200428544A TW 093103740 A TW093103740 A TW 093103740A TW 93103740 A TW93103740 A TW 93103740A TW 200428544 A TW200428544 A TW 200428544A
Authority
TW
Taiwan
Prior art keywords
circuit
current
voltage
discharge
transformer
Prior art date
Application number
TW093103740A
Other languages
English (en)
Chinese (zh)
Other versions
TWI309866B (2
Inventor
Kuniyuki Takahashi
Kazumasa Sasakura
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200428544A publication Critical patent/TW200428544A/zh
Application granted granted Critical
Publication of TWI309866B publication Critical patent/TWI309866B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning

Landscapes

  • Wire Bonding (AREA)
TW093103740A 2003-04-16 2004-02-17 Ball forming device for wire-bonding device TW200428544A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003111616A JP3813134B2 (ja) 2003-04-16 2003-04-16 ワイヤボンディング装置におけるボール形成装置

Publications (2)

Publication Number Publication Date
TW200428544A true TW200428544A (en) 2004-12-16
TWI309866B TWI309866B (2) 2009-05-11

Family

ID=33472112

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093103740A TW200428544A (en) 2003-04-16 2004-02-17 Ball forming device for wire-bonding device

Country Status (3)

Country Link
JP (1) JP3813134B2 (2)
KR (1) KR100546476B1 (2)
TW (1) TW200428544A (2)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7896218B2 (en) * 2007-06-28 2011-03-01 Western Digital Technologies, Inc. Apparatus and method for conductive metal ball bonding with electrostatic discharge detection
JP5069631B2 (ja) * 2008-07-31 2012-11-07 株式会社フォーエム技術研究所 ワイヤボンダーにおけるボール形成装置
TWI528481B (zh) * 2014-02-13 2016-04-01 新川股份有限公司 球形成裝置、打線裝置以及球形成方法

Also Published As

Publication number Publication date
KR20040090408A (ko) 2004-10-22
JP3813134B2 (ja) 2006-08-23
KR100546476B1 (ko) 2006-01-26
TWI309866B (2) 2009-05-11
JP2004319756A (ja) 2004-11-11

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