TWI309866B - - Google Patents
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- Publication number
- TWI309866B TWI309866B TW093103740A TW93103740A TWI309866B TW I309866 B TWI309866 B TW I309866B TW 093103740 A TW093103740 A TW 093103740A TW 93103740 A TW93103740 A TW 93103740A TW I309866 B TWI309866 B TW I309866B
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit
- current
- voltage
- discharge
- transformer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H10W72/01551—Changing the shapes of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
Landscapes
- Wire Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003111616A JP3813134B2 (ja) | 2003-04-16 | 2003-04-16 | ワイヤボンディング装置におけるボール形成装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200428544A TW200428544A (en) | 2004-12-16 |
| TWI309866B true TWI309866B (2) | 2009-05-11 |
Family
ID=33472112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093103740A TW200428544A (en) | 2003-04-16 | 2004-02-17 | Ball forming device for wire-bonding device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3813134B2 (2) |
| KR (1) | KR100546476B1 (2) |
| TW (1) | TW200428544A (2) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7896218B2 (en) * | 2007-06-28 | 2011-03-01 | Western Digital Technologies, Inc. | Apparatus and method for conductive metal ball bonding with electrostatic discharge detection |
| JP5069631B2 (ja) * | 2008-07-31 | 2012-11-07 | 株式会社フォーエム技術研究所 | ワイヤボンダーにおけるボール形成装置 |
| TWI528481B (zh) * | 2014-02-13 | 2016-04-01 | 新川股份有限公司 | 球形成裝置、打線裝置以及球形成方法 |
-
2003
- 2003-04-16 JP JP2003111616A patent/JP3813134B2/ja not_active Expired - Lifetime
-
2004
- 2004-02-17 TW TW093103740A patent/TW200428544A/zh not_active IP Right Cessation
- 2004-03-11 KR KR1020040016365A patent/KR100546476B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20040090408A (ko) | 2004-10-22 |
| JP3813134B2 (ja) | 2006-08-23 |
| KR100546476B1 (ko) | 2006-01-26 |
| JP2004319756A (ja) | 2004-11-11 |
| TW200428544A (en) | 2004-12-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |