TW200507111A - Method and apparatus for forming silicon oxide film - Google Patents
Method and apparatus for forming silicon oxide filmInfo
- Publication number
- TW200507111A TW200507111A TW093119093A TW93119093A TW200507111A TW 200507111 A TW200507111 A TW 200507111A TW 093119093 A TW093119093 A TW 093119093A TW 93119093 A TW93119093 A TW 93119093A TW 200507111 A TW200507111 A TW 200507111A
- Authority
- TW
- Taiwan
- Prior art keywords
- oxide film
- silicon oxide
- area
- processing
- setting
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6302—Non-deposition formation processes
- H10P14/6304—Formation by oxidation, e.g. oxidation of the substrate
- H10P14/6306—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials
- H10P14/6308—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group IV semiconductors
- H10P14/6309—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group IV semiconductors of silicon in uncombined form, i.e. pure silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6302—Non-deposition formation processes
- H10P14/6322—Formation by thermal treatments
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/69215—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2
Landscapes
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003192063 | 2003-07-04 | ||
| JP2004178669A JP3965167B2 (ja) | 2003-07-04 | 2004-06-16 | 熱処理方法及び熱処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200507111A true TW200507111A (en) | 2005-02-16 |
| TWI357109B TWI357109B (en) | 2012-01-21 |
Family
ID=34277178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093119093A TWI357109B (en) | 2003-07-04 | 2004-06-29 | Method and apparatus for forming silicon oxide fil |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7700156B2 (zh) |
| JP (1) | JP3965167B2 (zh) |
| KR (1) | KR101124869B1 (zh) |
| TW (1) | TWI357109B (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114068323A (zh) * | 2020-08-03 | 2022-02-18 | 长鑫存储技术有限公司 | 氧化层、半导体结构及其制作方法 |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4342895B2 (ja) * | 2003-10-06 | 2009-10-14 | 東京エレクトロン株式会社 | 熱処理方法及び熱処理装置 |
| US20050252449A1 (en) | 2004-05-12 | 2005-11-17 | Nguyen Son T | Control of gas flow and delivery to suppress the formation of particles in an MOCVD/ALD system |
| KR100673242B1 (ko) * | 2005-06-24 | 2007-01-22 | 주식회사 하이닉스반도체 | 플래쉬 메모리 소자의 유전체막 제조방법 |
| RU2372688C2 (ru) * | 2005-07-25 | 2009-11-10 | Государственное Образовательное Учреждение Высшего Профессионального Образования "Дагестанский Государственный Технический Университет" (Дгту) | СПОСОБ ПОЛУЧЕНИЯ ПЛЕНКИ ОКИСЛА КРЕМНИЯ SiO2 |
| US20070240644A1 (en) * | 2006-03-24 | 2007-10-18 | Hiroyuki Matsuura | Vertical plasma processing apparatus for semiconductor process |
| JP4983159B2 (ja) * | 2006-09-01 | 2012-07-25 | 東京エレクトロン株式会社 | 被処理体の酸化方法、酸化装置及び記憶媒体 |
| JP2009010009A (ja) * | 2007-06-26 | 2009-01-15 | Hitachi Kokusai Electric Inc | 基板処理装置及び半導体装置の製造方法 |
| US20090197424A1 (en) * | 2008-01-31 | 2009-08-06 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and method for manufacturing semiconductor device |
| JP5504793B2 (ja) * | 2009-09-26 | 2014-05-28 | 東京エレクトロン株式会社 | 熱処理装置及び冷却方法 |
| KR101121432B1 (ko) * | 2010-04-20 | 2012-03-16 | 엘아이지에이디피 주식회사 | 서셉터 코팅장치 및 코팅방법 |
| WO2012011423A1 (ja) * | 2010-07-22 | 2012-01-26 | 株式会社日立国際電気 | 基板処理装置および半導体装置の製造方法 |
| US9513003B2 (en) * | 2010-08-16 | 2016-12-06 | Purpose Company Limited | Combustion apparatus, method for combustion control, board, combustion control system and water heater |
| JP5562188B2 (ja) * | 2010-09-16 | 2014-07-30 | 株式会社日立国際電気 | 基板処理装置及び半導体装置の製造方法 |
| CN104520975B (zh) * | 2012-07-30 | 2018-07-31 | 株式会社日立国际电气 | 衬底处理装置及半导体器件的制造方法 |
| JP6170847B2 (ja) * | 2013-03-25 | 2017-07-26 | 株式会社日立国際電気 | 断熱構造体、加熱装置、基板処理装置および半導体装置の製造方法 |
| JP2014209558A (ja) * | 2013-03-27 | 2014-11-06 | 東京エレクトロン株式会社 | シリコン酸化膜の形成方法、及び、シリコン酸化膜の形成装置 |
| US9443731B1 (en) * | 2015-02-20 | 2016-09-13 | Tokyo Electron Limited | Material processing to achieve sub-10nm patterning |
| US20170207078A1 (en) * | 2016-01-15 | 2017-07-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Atomic layer deposition apparatus and semiconductor process |
| JP6573578B2 (ja) | 2016-05-31 | 2019-09-11 | 株式会社Kokusai Electric | 半導体装置の製造方法、基板処理装置、およびプログラム |
| JP6484601B2 (ja) * | 2016-11-24 | 2019-03-13 | 株式会社Kokusai Electric | 処理装置及び半導体装置の製造方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4755980A (en) * | 1985-02-19 | 1988-07-05 | Kabushiki Kaisha Toshiba | Optical disk and recording/reproducing device for optical disk |
| US5458685A (en) * | 1992-08-12 | 1995-10-17 | Tokyo Electron Kabushiki Kaisha | Vertical heat treatment apparatus |
| US5502702A (en) * | 1993-08-09 | 1996-03-26 | Yamaha Corporation | Optical disc recording device using basic recording information and projection time control |
| JP3805825B2 (ja) * | 1995-09-19 | 2006-08-09 | 株式会社東芝 | 絶縁膜の形成方法 |
| JPH11186255A (ja) | 1996-11-29 | 1999-07-09 | Sony Corp | シリコン酸化膜の形成方法 |
| TW462093B (en) | 1997-03-05 | 2001-11-01 | Hitachi Ltd | Method for manufacturing semiconductor integrated circuit device having a thin insulative film |
| US6037273A (en) * | 1997-07-11 | 2000-03-14 | Applied Materials, Inc. | Method and apparatus for insitu vapor generation |
| JP3757566B2 (ja) | 1997-08-21 | 2006-03-22 | ソニー株式会社 | シリコン酸化膜の形成方法及び酸化膜成膜装置 |
| JPH1187329A (ja) | 1997-09-08 | 1999-03-30 | Tokyo Electron Ltd | 水蒸気供給システムおよび酸化処理装置 |
| US5935650A (en) * | 1997-10-17 | 1999-08-10 | Lerch; Wilfried | Method of oxidation of semiconductor wafers in a rapid thermal processing (RTP) system |
| JPH11162977A (ja) | 1997-11-28 | 1999-06-18 | Tadahiro Omi | シリコン酸化膜の形成方法 |
| JPH11204511A (ja) | 1998-01-08 | 1999-07-30 | Kokusai Electric Co Ltd | シリコン熱酸化膜の形成装置 |
| JPH11330468A (ja) | 1998-05-20 | 1999-11-30 | Hitachi Ltd | 半導体集積回路装置の製造方法および半導体集積回路装置 |
| JP4277452B2 (ja) * | 2000-02-25 | 2009-06-10 | ソニー株式会社 | 記録装置、再生装置 |
| US6638877B2 (en) * | 2000-11-03 | 2003-10-28 | Texas Instruments Incorporated | Ultra-thin SiO2using N2O as the oxidant |
-
2004
- 2004-06-16 JP JP2004178669A patent/JP3965167B2/ja not_active Expired - Fee Related
- 2004-06-29 TW TW093119093A patent/TWI357109B/zh not_active IP Right Cessation
- 2004-06-30 US US10/879,034 patent/US7700156B2/en not_active Expired - Fee Related
- 2004-07-01 KR KR1020040051214A patent/KR101124869B1/ko not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114068323A (zh) * | 2020-08-03 | 2022-02-18 | 长鑫存储技术有限公司 | 氧化层、半导体结构及其制作方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005045220A (ja) | 2005-02-17 |
| TWI357109B (en) | 2012-01-21 |
| KR101124869B1 (ko) | 2012-03-27 |
| JP3965167B2 (ja) | 2007-08-29 |
| KR20050004077A (ko) | 2005-01-12 |
| US7700156B2 (en) | 2010-04-20 |
| US20050056220A1 (en) | 2005-03-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |