TW200507111A - Method and apparatus for forming silicon oxide film - Google Patents

Method and apparatus for forming silicon oxide film

Info

Publication number
TW200507111A
TW200507111A TW093119093A TW93119093A TW200507111A TW 200507111 A TW200507111 A TW 200507111A TW 093119093 A TW093119093 A TW 093119093A TW 93119093 A TW93119093 A TW 93119093A TW 200507111 A TW200507111 A TW 200507111A
Authority
TW
Taiwan
Prior art keywords
oxide film
silicon oxide
area
processing
setting
Prior art date
Application number
TW093119093A
Other languages
English (en)
Other versions
TWI357109B (en
Inventor
Kimiya Aoki
Katsushi Suzuki
Asami Shirakawa
Kenji Tago
Keisuke Suzuki
Kazuo Saki
Shinji Mori
Original Assignee
Tokyo Electron Ltd
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Toshiba Kk filed Critical Tokyo Electron Ltd
Publication of TW200507111A publication Critical patent/TW200507111A/zh
Application granted granted Critical
Publication of TWI357109B publication Critical patent/TWI357109B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0431Apparatus for thermal treatment
    • H10P72/0434Apparatus for thermal treatment mainly by convection
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302Non-deposition formation processes
    • H10P14/6304Formation by oxidation, e.g. oxidation of the substrate
    • H10P14/6306Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials
    • H10P14/6308Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group IV semiconductors
    • H10P14/6309Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group IV semiconductors of silicon in uncombined form, i.e. pure silicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302Non-deposition formation processes
    • H10P14/6322Formation by thermal treatments
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69Inorganic materials
    • H10P14/692Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/69215Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2

Landscapes

  • Formation Of Insulating Films (AREA)
TW093119093A 2003-07-04 2004-06-29 Method and apparatus for forming silicon oxide fil TWI357109B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003192063 2003-07-04
JP2004178669A JP3965167B2 (ja) 2003-07-04 2004-06-16 熱処理方法及び熱処理装置

Publications (2)

Publication Number Publication Date
TW200507111A true TW200507111A (en) 2005-02-16
TWI357109B TWI357109B (en) 2012-01-21

Family

ID=34277178

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093119093A TWI357109B (en) 2003-07-04 2004-06-29 Method and apparatus for forming silicon oxide fil

Country Status (4)

Country Link
US (1) US7700156B2 (zh)
JP (1) JP3965167B2 (zh)
KR (1) KR101124869B1 (zh)
TW (1) TWI357109B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114068323A (zh) * 2020-08-03 2022-02-18 长鑫存储技术有限公司 氧化层、半导体结构及其制作方法

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4342895B2 (ja) * 2003-10-06 2009-10-14 東京エレクトロン株式会社 熱処理方法及び熱処理装置
US20050252449A1 (en) 2004-05-12 2005-11-17 Nguyen Son T Control of gas flow and delivery to suppress the formation of particles in an MOCVD/ALD system
KR100673242B1 (ko) * 2005-06-24 2007-01-22 주식회사 하이닉스반도체 플래쉬 메모리 소자의 유전체막 제조방법
RU2372688C2 (ru) * 2005-07-25 2009-11-10 Государственное Образовательное Учреждение Высшего Профессионального Образования "Дагестанский Государственный Технический Университет" (Дгту) СПОСОБ ПОЛУЧЕНИЯ ПЛЕНКИ ОКИСЛА КРЕМНИЯ SiO2
US20070240644A1 (en) * 2006-03-24 2007-10-18 Hiroyuki Matsuura Vertical plasma processing apparatus for semiconductor process
JP4983159B2 (ja) * 2006-09-01 2012-07-25 東京エレクトロン株式会社 被処理体の酸化方法、酸化装置及び記憶媒体
JP2009010009A (ja) * 2007-06-26 2009-01-15 Hitachi Kokusai Electric Inc 基板処理装置及び半導体装置の製造方法
US20090197424A1 (en) * 2008-01-31 2009-08-06 Hitachi Kokusai Electric Inc. Substrate processing apparatus and method for manufacturing semiconductor device
JP5504793B2 (ja) * 2009-09-26 2014-05-28 東京エレクトロン株式会社 熱処理装置及び冷却方法
KR101121432B1 (ko) * 2010-04-20 2012-03-16 엘아이지에이디피 주식회사 서셉터 코팅장치 및 코팅방법
WO2012011423A1 (ja) * 2010-07-22 2012-01-26 株式会社日立国際電気 基板処理装置および半導体装置の製造方法
US9513003B2 (en) * 2010-08-16 2016-12-06 Purpose Company Limited Combustion apparatus, method for combustion control, board, combustion control system and water heater
JP5562188B2 (ja) * 2010-09-16 2014-07-30 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
CN104520975B (zh) * 2012-07-30 2018-07-31 株式会社日立国际电气 衬底处理装置及半导体器件的制造方法
JP6170847B2 (ja) * 2013-03-25 2017-07-26 株式会社日立国際電気 断熱構造体、加熱装置、基板処理装置および半導体装置の製造方法
JP2014209558A (ja) * 2013-03-27 2014-11-06 東京エレクトロン株式会社 シリコン酸化膜の形成方法、及び、シリコン酸化膜の形成装置
US9443731B1 (en) * 2015-02-20 2016-09-13 Tokyo Electron Limited Material processing to achieve sub-10nm patterning
US20170207078A1 (en) * 2016-01-15 2017-07-20 Taiwan Semiconductor Manufacturing Co., Ltd. Atomic layer deposition apparatus and semiconductor process
JP6573578B2 (ja) 2016-05-31 2019-09-11 株式会社Kokusai Electric 半導体装置の製造方法、基板処理装置、およびプログラム
JP6484601B2 (ja) * 2016-11-24 2019-03-13 株式会社Kokusai Electric 処理装置及び半導体装置の製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4755980A (en) * 1985-02-19 1988-07-05 Kabushiki Kaisha Toshiba Optical disk and recording/reproducing device for optical disk
US5458685A (en) * 1992-08-12 1995-10-17 Tokyo Electron Kabushiki Kaisha Vertical heat treatment apparatus
US5502702A (en) * 1993-08-09 1996-03-26 Yamaha Corporation Optical disc recording device using basic recording information and projection time control
JP3805825B2 (ja) * 1995-09-19 2006-08-09 株式会社東芝 絶縁膜の形成方法
JPH11186255A (ja) 1996-11-29 1999-07-09 Sony Corp シリコン酸化膜の形成方法
TW462093B (en) 1997-03-05 2001-11-01 Hitachi Ltd Method for manufacturing semiconductor integrated circuit device having a thin insulative film
US6037273A (en) * 1997-07-11 2000-03-14 Applied Materials, Inc. Method and apparatus for insitu vapor generation
JP3757566B2 (ja) 1997-08-21 2006-03-22 ソニー株式会社 シリコン酸化膜の形成方法及び酸化膜成膜装置
JPH1187329A (ja) 1997-09-08 1999-03-30 Tokyo Electron Ltd 水蒸気供給システムおよび酸化処理装置
US5935650A (en) * 1997-10-17 1999-08-10 Lerch; Wilfried Method of oxidation of semiconductor wafers in a rapid thermal processing (RTP) system
JPH11162977A (ja) 1997-11-28 1999-06-18 Tadahiro Omi シリコン酸化膜の形成方法
JPH11204511A (ja) 1998-01-08 1999-07-30 Kokusai Electric Co Ltd シリコン熱酸化膜の形成装置
JPH11330468A (ja) 1998-05-20 1999-11-30 Hitachi Ltd 半導体集積回路装置の製造方法および半導体集積回路装置
JP4277452B2 (ja) * 2000-02-25 2009-06-10 ソニー株式会社 記録装置、再生装置
US6638877B2 (en) * 2000-11-03 2003-10-28 Texas Instruments Incorporated Ultra-thin SiO2using N2O as the oxidant

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114068323A (zh) * 2020-08-03 2022-02-18 长鑫存储技术有限公司 氧化层、半导体结构及其制作方法

Also Published As

Publication number Publication date
JP2005045220A (ja) 2005-02-17
TWI357109B (en) 2012-01-21
KR101124869B1 (ko) 2012-03-27
JP3965167B2 (ja) 2007-08-29
KR20050004077A (ko) 2005-01-12
US7700156B2 (en) 2010-04-20
US20050056220A1 (en) 2005-03-17

Similar Documents

Publication Publication Date Title
TW200507111A (en) Method and apparatus for forming silicon oxide film
EP1160838A3 (en) Heat treatment system and method
EP1160847A3 (en) Method of forming oxynitride film and system for carrying out the same
JP2009542000A5 (zh)
KR950027986A (ko) 반도체장치의 제조방법과 제조장치
JP2000208498A5 (zh)
TW200629354A (en) Method for manufacturing semiconductor device and substrate processing apparatus
TWI336906B (zh)
EP2043138A3 (en) Method of processing an object having an oxide film on its surface and apparatus for performing said method
KR20120075379A (ko) 박막 형성 방법, 박막 형성 장치 및 프로그램이 기록된 기록 매체
KR20140118815A (ko) 실리콘 산화막의 형성 방법 및 실리콘 산화막의 형성 장치
CA2324644A1 (en) Process for improved surface properties incorporating compressive heating of reactive gases
KR100964045B1 (ko) 반도체 처리용의 성막 방법 및 장치 및 컴퓨터로 판독 가능한 매체
JP4640800B2 (ja) 被処理体の処理方法、処理装置、薄膜形成方法、薄膜形成装置及びプログラム
US7064084B2 (en) Oxide film forming method
JPS56123377A (en) Plasma cleaning and etching method
WO2003019625A3 (de) Verfahren zur thermischen behandlung eines mehrere schichten aufweisenden substrats
JP2001118839A (ja) 半導体用熱処理装置および半導体基板の熱処理方法
JP4361179B2 (ja) オゾン処理装置及びオゾン処理方法
TW200504865A (en) Surface modification method and surface modification apparatus for interlayer insulating film
TW200503106A (en) Method and apparatus for processing organosiloxane film
WO1992012274A1 (en) Method of forming oxide film
JP2001002495A (ja) 半導体ウェハの製法
JPS6260226A (ja) 高速光酸化・窒化装置
JP2003119558A (ja) 鋼材部品の真空浸炭方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees