TW200514237A - Integrated circuit inductor with integrated vias - Google Patents

Integrated circuit inductor with integrated vias

Info

Publication number
TW200514237A
TW200514237A TW093114183A TW93114183A TW200514237A TW 200514237 A TW200514237 A TW 200514237A TW 093114183 A TW093114183 A TW 093114183A TW 93114183 A TW93114183 A TW 93114183A TW 200514237 A TW200514237 A TW 200514237A
Authority
TW
Taiwan
Prior art keywords
integrated
vias
integrated circuit
circuit inductor
continuous vias
Prior art date
Application number
TW093114183A
Other languages
English (en)
Inventor
Robert L Pitts
Greg C Baldwin
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of TW200514237A publication Critical patent/TW200514237A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/497—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0046—Printed inductances with a conductive path having a bridge

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Coils Or Transformers For Communication (AREA)
TW093114183A 2003-05-21 2004-05-20 Integrated circuit inductor with integrated vias TW200514237A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US47226503P 2003-05-21 2003-05-21

Publications (1)

Publication Number Publication Date
TW200514237A true TW200514237A (en) 2005-04-16

Family

ID=33098334

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093114183A TW200514237A (en) 2003-05-21 2004-05-20 Integrated circuit inductor with integrated vias

Country Status (4)

Country Link
US (3) US7400025B2 (zh)
EP (1) EP1480234A3 (zh)
JP (1) JP2004349703A (zh)
TW (1) TW200514237A (zh)

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US9287344B2 (en) * 2010-08-23 2016-03-15 The Hong Kong University Of Science And Technology Monolithic magnetic induction device
US9424970B2 (en) * 2010-11-29 2016-08-23 Taiwan Semiconductor Manufacturing Company, Ltd. High-k transformers extending into multiple dielectric layers
US8754736B2 (en) * 2011-01-24 2014-06-17 International Business Machines Corporation Inductor structure having increased inductance density and quality factor
US20130146345A1 (en) * 2011-12-12 2013-06-13 Kazuki KAJIHARA Printed wiring board and method for manufacturing the same
MY165848A (en) * 2012-03-26 2018-05-17 Silterra Malaysia Sdn Bhd Parallel stacked symmetrical and differential inductor
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US9177709B2 (en) * 2013-09-05 2015-11-03 Globalfoundries Inc. Structure and method for high performance multi-port inductor
US10051741B2 (en) * 2013-11-06 2018-08-14 Qualcomm Incorporated Embedded layered inductor
US9372208B2 (en) 2014-01-02 2016-06-21 International Business Machines Corporation Signal monitoring of through-wafer vias using a multi-layer inductor
US20170148750A1 (en) * 2014-08-07 2017-05-25 Intel Corporation On-die inductor with improved q-factor
US20170040257A1 (en) * 2015-08-04 2017-02-09 International Business Machines Corporation Hybrid subtractive etch/metal fill process for fabricating interconnects
TWI645428B (zh) * 2016-11-25 2018-12-21 瑞昱半導體股份有限公司 積體電感
US10593449B2 (en) 2017-03-30 2020-03-17 International Business Machines Corporation Magnetic inductor with multiple magnetic layer thicknesses
US10607759B2 (en) 2017-03-31 2020-03-31 International Business Machines Corporation Method of fabricating a laminated stack of magnetic inductor
US10597769B2 (en) 2017-04-05 2020-03-24 International Business Machines Corporation Method of fabricating a magnetic stack arrangement of a laminated magnetic inductor
US10396144B2 (en) * 2017-04-24 2019-08-27 International Business Machines Corporation Magnetic inductor stack including magnetic materials having multiple permeabilities
US10347411B2 (en) 2017-05-19 2019-07-09 International Business Machines Corporation Stress management scheme for fabricating thick magnetic films of an inductor yoke arrangement
WO2019059898A1 (en) * 2017-09-20 2019-03-28 Intel Corporation PERIPHERAL INDUCERS
US11380632B2 (en) * 2018-04-27 2022-07-05 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor package device with integrated inductor and manufacturing method thereof
JP7475809B2 (ja) * 2018-12-20 2024-04-30 Tdk株式会社 積層コイル部品
DE112019007552B4 (de) 2019-07-18 2023-05-04 Microchip Technology Incorporated Techniken zum herstellen integrierter induktoren und zugehörige halbleitervorrichtungen, elektronische systeme und verfahren
DE112020006535T5 (de) 2020-01-15 2023-01-12 Microchip Technology Incorporated Techniken zur herstellung von integrierten induktor-kondensator-oszillatoren und zugehörige verfahren, oszillatoren, halbleitervorrichtungen, systems-on-chips und andere systeme
JP7284121B2 (ja) * 2020-03-23 2023-05-30 株式会社東芝 アイソレータ
US11616013B2 (en) * 2020-06-12 2023-03-28 Taiwan Semiconductor Manufacturing Co., Ltd. Extended via semiconductor structure and device
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Also Published As

Publication number Publication date
US20040232556A1 (en) 2004-11-25
US7888227B2 (en) 2011-02-15
US20110133880A1 (en) 2011-06-09
JP2004349703A (ja) 2004-12-09
US8344479B2 (en) 2013-01-01
EP1480234A3 (en) 2010-01-13
EP1480234A2 (en) 2004-11-24
US7400025B2 (en) 2008-07-15
US20080286933A1 (en) 2008-11-20

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