TW200520136A - Adhesive sheet for processing semiconductors and method for processing semiconductors - Google Patents

Adhesive sheet for processing semiconductors and method for processing semiconductors

Info

Publication number
TW200520136A
TW200520136A TW093123311A TW93123311A TW200520136A TW 200520136 A TW200520136 A TW 200520136A TW 093123311 A TW093123311 A TW 093123311A TW 93123311 A TW93123311 A TW 93123311A TW 200520136 A TW200520136 A TW 200520136A
Authority
TW
Taiwan
Prior art keywords
processing semiconductors
adhesive sheet
semiconductors
processing
base film
Prior art date
Application number
TW093123311A
Other languages
Chinese (zh)
Other versions
TWI317155B (en
Inventor
Syouji Yamamoto
Tomokazu Takahashi
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200520136A publication Critical patent/TW200520136A/en
Application granted granted Critical
Publication of TWI317155B publication Critical patent/TWI317155B/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H10W74/017—Auxiliary layers for moulds, e.g. release layers or layers preventing residue
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention provides an adhesive sheet for processing semiconductors, which has excellent pick-up performance even in thin semiconductor chips. In the adhesive sheet for processing semiconductors, a layer of adhesive compound (2) is disposed on at least one side of a base film (1) of a substrate. The base film (1) is characterized in that the polyethylene therein has a density below 0.915g/cm3.
TW093123311A 2003-10-10 2004-08-04 Adhesive sheet for processing semiconductors and method for processing semiconductors TWI317155B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003351680A JP2005116920A (en) 2003-10-10 2003-10-10 Adhesive sheet for semiconductor processing and semiconductor processing method

Publications (2)

Publication Number Publication Date
TW200520136A true TW200520136A (en) 2005-06-16
TWI317155B TWI317155B (en) 2009-11-11

Family

ID=34542853

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093123311A TWI317155B (en) 2003-10-10 2004-08-04 Adhesive sheet for processing semiconductors and method for processing semiconductors

Country Status (4)

Country Link
JP (1) JP2005116920A (en)
KR (1) KR20050035101A (en)
CN (1) CN100365793C (en)
TW (1) TWI317155B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009060788A1 (en) * 2007-11-08 2009-05-14 Nitto Denko Corporation Dicing die-bonding film
JP4717051B2 (en) * 2007-11-08 2011-07-06 日東電工株式会社 Dicing die bond film
JP4717052B2 (en) * 2007-11-08 2011-07-06 日東電工株式会社 Dicing die bond film
WO2009060787A1 (en) * 2007-11-08 2009-05-14 Nitto Denko Corporation Dicing die-bonding film
JP4717086B2 (en) * 2008-01-18 2011-07-06 日東電工株式会社 Dicing die bond film
JP4717085B2 (en) * 2008-01-18 2011-07-06 日東電工株式会社 Dicing die bond film
JP4718640B2 (en) * 2010-04-14 2011-07-06 日東電工株式会社 Dicing die bond film
JP4790073B2 (en) * 2010-04-14 2011-10-12 日東電工株式会社 Dicing die bond film
JP5716371B2 (en) * 2010-12-03 2015-05-13 住友ベークライト株式会社 Film for semiconductor and method for manufacturing semiconductor device
JP2012209363A (en) * 2011-03-29 2012-10-25 Sumitomo Bakelite Co Ltd Dicing film
KR102552837B1 (en) * 2017-03-28 2023-07-06 린텍 가부시키가이샤 Manufacturing method of film adhesive composite sheet and semiconductor device
JP7377723B2 (en) * 2020-01-21 2023-11-10 タキロンシーアイ株式会社 Base film for dicing tape
KR20230064291A (en) * 2021-11-03 2023-05-10 삼성전자주식회사 Release film and method for manufacturing semiconductor package using same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07120640B2 (en) * 1987-07-08 1995-12-20 古河電気工業株式会社 Radiation curable adhesive tape for semiconductors
KR100222141B1 (en) * 1996-01-11 1999-10-01 사또 아끼오 Adhesive polyethylene compositions and multi-layer laminated films using the same
JP2002168820A (en) * 2000-12-05 2002-06-14 Yazaki Corp Smoke detector

Also Published As

Publication number Publication date
CN100365793C (en) 2008-01-30
TWI317155B (en) 2009-11-11
KR20050035101A (en) 2005-04-15
JP2005116920A (en) 2005-04-28
CN1606144A (en) 2005-04-13

Similar Documents

Publication Publication Date Title
TW200707698A (en) Semiconductor device, manufacturing method for semiconductor device, and electronic equipment
TW200520136A (en) Adhesive sheet for processing semiconductors and method for processing semiconductors
NL1027962A1 (en) Multi-chip package, semiconductor device used therein and method of manufacture therefor.
EP2175494A3 (en) Compound semiconductor device and manufacturing method of the same
MY141785A (en) Manufacturing method of semiconductor device
TW200511453A (en) Methods and apparatus for packaging integrated circuit devices
EP1548821A3 (en) Dicing die-bonding film
TWI261486B (en) Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same
EP2937897A3 (en) Device package and methods for the fabrication and testing thereof
EP1699091A3 (en) Semiconductor composite LED apparatus
TW200942594A (en) Film for semiconductor, method for manufacturing semiconductor device and semiconductor device
AU2001249659A1 (en) Method of forming vias in silicon carbide and resulting devices and circuits
TWI268729B (en) Protected organic electronic devices and methods for making the same
TW200707699A (en) Sip type package containing analog semiconductor chip and digital semiconductor chip stacked in order, and method for manufacturing the same
EP0977254A3 (en) Hot-melt sheet for holding and protecting semiconductor wafers and method for applying the same
EP1465244A3 (en) Integrated circuit package with exposed die surfaces and auxiliary attachment
WO2002029856A3 (en) A testing device for semiconductor components and a method of using the same
MY123249A (en) A semiconductor device and a method of manufacturing the same and an electronic device
SG150377A1 (en) Adhesive sheet for producing semiconductor device, semiconductor device therewith, and manufacturing method therefor
TW200603132A (en) Optical pickup device, semiconductor laser device and housing usable for the optical pickup device, and method of manufacturing semiconductor laser device
WO2008114753A1 (en) Substrate placing table, substrate processing apparatus and method for machining surface of substrate placing table
TW200618342A (en) Nitride-based compound semiconductor light emitting device and fabricating method thereof
MY143405A (en) N-type nitride semiconductor laminate and semiconductor device using same
TW200601599A (en) Semiconductor chip and circuit board, manufacturing method of same, and electronic equipment
TW200729436A (en) Integrated circuit device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees