TW200532830A - Bonding apparatus - Google Patents

Bonding apparatus Download PDF

Info

Publication number
TW200532830A
TW200532830A TW094101994A TW94101994A TW200532830A TW 200532830 A TW200532830 A TW 200532830A TW 094101994 A TW094101994 A TW 094101994A TW 94101994 A TW94101994 A TW 94101994A TW 200532830 A TW200532830 A TW 200532830A
Authority
TW
Taiwan
Prior art keywords
joint
fixed
link
bonding
arm
Prior art date
Application number
TW094101994A
Other languages
English (en)
Chinese (zh)
Other versions
TWI328845B (2
Inventor
Osamu Kakutani
Yutaka Kondo
Yoshihiko Seino
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200532830A publication Critical patent/TW200532830A/zh
Application granted granted Critical
Publication of TWI328845B publication Critical patent/TWI328845B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
TW094101994A 2004-03-26 2005-01-24 Bonding apparatus TW200532830A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004092176A JP4141401B2 (ja) 2004-03-26 2004-03-26 ボンディング装置

Publications (2)

Publication Number Publication Date
TW200532830A true TW200532830A (en) 2005-10-01
TWI328845B TWI328845B (2) 2010-08-11

Family

ID=34988585

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094101994A TW200532830A (en) 2004-03-26 2005-01-24 Bonding apparatus

Country Status (4)

Country Link
US (1) US7306132B2 (2)
JP (1) JP4141401B2 (2)
KR (1) KR100628707B1 (2)
TW (1) TW200532830A (2)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7377415B2 (en) * 2005-06-15 2008-05-27 Kulicke And Soffa Industries, Inc. Bond head link assembly for a wire bonding machine
JP4657942B2 (ja) * 2006-02-14 2011-03-23 株式会社新川 ボンディング装置
JP4343985B2 (ja) * 2008-01-24 2009-10-14 株式会社新川 ボンディング装置及びボンディング装置のボンディングステージ高さ調整方法
US20140183181A1 (en) * 2012-12-27 2014-07-03 Pilkington Group Limited Method and apparatus for forming a vehicle window assembly using induction soldering
EP4357067A4 (en) * 2022-08-31 2025-07-09 Wuxi Lead Intelligent Equipment Co Ltd TAB WELDING DEVICE

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3328875A (en) * 1965-12-20 1967-07-04 Matheus D Pennings Method of attaching conductors to terminals
US6176414B1 (en) * 1999-11-08 2001-01-23 Kulicke & Soffa Investments, Inc. Linkage guided bond head
JP2003197686A (ja) * 2001-10-18 2003-07-11 Nec Corp 電子部品実装装置及び電子部品実装方法
JP3742359B2 (ja) 2002-04-02 2006-02-01 株式会社新川 ボンディング装置
JP3666592B2 (ja) * 2002-05-23 2005-06-29 株式会社新川 ボンディング装置
JP3993157B2 (ja) * 2003-10-23 2007-10-17 株式会社新川 ボンディング装置

Also Published As

Publication number Publication date
US20050211746A1 (en) 2005-09-29
KR100628707B1 (ko) 2006-09-29
US7306132B2 (en) 2007-12-11
JP4141401B2 (ja) 2008-08-27
JP2005277325A (ja) 2005-10-06
TWI328845B (2) 2010-08-11
KR20060042197A (ko) 2006-05-12

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees