TWI328845B - - Google Patents

Download PDF

Info

Publication number
TWI328845B
TWI328845B TW094101994A TW94101994A TWI328845B TW I328845 B TWI328845 B TW I328845B TW 094101994 A TW094101994 A TW 094101994A TW 94101994 A TW94101994 A TW 94101994A TW I328845 B TWI328845 B TW I328845B
Authority
TW
Taiwan
Prior art keywords
joint
drive motor
arm
link
center
Prior art date
Application number
TW094101994A
Other languages
English (en)
Chinese (zh)
Other versions
TW200532830A (en
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200532830A publication Critical patent/TW200532830A/zh
Application granted granted Critical
Publication of TWI328845B publication Critical patent/TWI328845B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
TW094101994A 2004-03-26 2005-01-24 Bonding apparatus TW200532830A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004092176A JP4141401B2 (ja) 2004-03-26 2004-03-26 ボンディング装置

Publications (2)

Publication Number Publication Date
TW200532830A TW200532830A (en) 2005-10-01
TWI328845B true TWI328845B (2) 2010-08-11

Family

ID=34988585

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094101994A TW200532830A (en) 2004-03-26 2005-01-24 Bonding apparatus

Country Status (4)

Country Link
US (1) US7306132B2 (2)
JP (1) JP4141401B2 (2)
KR (1) KR100628707B1 (2)
TW (1) TW200532830A (2)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7377415B2 (en) * 2005-06-15 2008-05-27 Kulicke And Soffa Industries, Inc. Bond head link assembly for a wire bonding machine
JP4657942B2 (ja) * 2006-02-14 2011-03-23 株式会社新川 ボンディング装置
JP4343985B2 (ja) * 2008-01-24 2009-10-14 株式会社新川 ボンディング装置及びボンディング装置のボンディングステージ高さ調整方法
US20140183181A1 (en) * 2012-12-27 2014-07-03 Pilkington Group Limited Method and apparatus for forming a vehicle window assembly using induction soldering
EP4357067A4 (en) * 2022-08-31 2025-07-09 Wuxi Lead Intelligent Equipment Co Ltd TAB WELDING DEVICE

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3328875A (en) * 1965-12-20 1967-07-04 Matheus D Pennings Method of attaching conductors to terminals
US6176414B1 (en) * 1999-11-08 2001-01-23 Kulicke & Soffa Investments, Inc. Linkage guided bond head
JP2003197686A (ja) * 2001-10-18 2003-07-11 Nec Corp 電子部品実装装置及び電子部品実装方法
JP3742359B2 (ja) 2002-04-02 2006-02-01 株式会社新川 ボンディング装置
JP3666592B2 (ja) * 2002-05-23 2005-06-29 株式会社新川 ボンディング装置
JP3993157B2 (ja) * 2003-10-23 2007-10-17 株式会社新川 ボンディング装置

Also Published As

Publication number Publication date
US20050211746A1 (en) 2005-09-29
KR100628707B1 (ko) 2006-09-29
US7306132B2 (en) 2007-12-11
JP4141401B2 (ja) 2008-08-27
JP2005277325A (ja) 2005-10-06
TW200532830A (en) 2005-10-01
KR20060042197A (ko) 2006-05-12

Similar Documents

Publication Publication Date Title
CN1218317C (zh) 盘装置
TW578246B (en) Electronic component bonder and bonding tool
JP2019527464A (ja) 回転クランプ装置
TWI328845B (2)
TW201210765A (en) Selective compliance assembly robot arm type robot
JPH01130365A (ja) 磁気デイスク装置の磁気ヘツド位置決め機構
JP3742359B2 (ja) ボンディング装置
JP3666592B2 (ja) ボンディング装置
JP7278706B2 (ja) 把持装置及び実装装置
TW200838063A (en) Ultrasonic bonding device
TWI330874B (2)
JP4657942B2 (ja) ボンディング装置
CN103367566B (zh) 基于音圈电机和花键轴的固晶机焊头机构及固晶机
TW200805527A (en) Oscillatory horn holder bonding apparatus
JP2002151545A (ja) ワイヤボンディング装置
CN215262405U (zh) 一种电子元器件加工用配合牢固性检测装置
TWI298685B (2)
JP4393398B2 (ja) 椅子用メモ台収納機構
JP2005111535A (ja) 摩擦撹拌接合ガン
JP6242204B2 (ja) 工作機械
JPS63127892A (ja) 工業用ロボツト
JP2009151893A (ja) 記憶装置、記憶装置の組み立て装置および記憶装置の組み立て方法
JPS6079574A (ja) 磁気デイスク装置
JPH0237534A (ja) 対物レンズの駆動機構
JPH03115798A (ja) 送風機

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees