TW200537241A - Photosensitive transcription sheet, photosensitive laminate, imagine pattern formation method, and wiring pattern formation method - Google Patents

Photosensitive transcription sheet, photosensitive laminate, imagine pattern formation method, and wiring pattern formation method Download PDF

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Publication number
TW200537241A
TW200537241A TW094100949A TW94100949A TW200537241A TW 200537241 A TW200537241 A TW 200537241A TW 094100949 A TW094100949 A TW 094100949A TW 94100949 A TW94100949 A TW 94100949A TW 200537241 A TW200537241 A TW 200537241A
Authority
TW
Taiwan
Prior art keywords
photosensitive
photosensitive layer
layer
transfer sheet
laminated body
Prior art date
Application number
TW094100949A
Other languages
English (en)
Chinese (zh)
Inventor
Yuuichi Wakata
Morimasa Sato
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of TW200537241A publication Critical patent/TW200537241A/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Structural Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Laminated Bodies (AREA)
TW094100949A 2004-01-14 2005-01-13 Photosensitive transcription sheet, photosensitive laminate, imagine pattern formation method, and wiring pattern formation method TW200537241A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004007196A JP2005202066A (ja) 2004-01-14 2004-01-14 感光性転写シート、感光性積層体、画像パターンを形成する方法、配線パターンを形成する方法

Publications (1)

Publication Number Publication Date
TW200537241A true TW200537241A (en) 2005-11-16

Family

ID=34820924

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094100949A TW200537241A (en) 2004-01-14 2005-01-13 Photosensitive transcription sheet, photosensitive laminate, imagine pattern formation method, and wiring pattern formation method

Country Status (4)

Country Link
JP (1) JP2005202066A (ja)
KR (1) KR20050074927A (ja)
CN (1) CN1641481A (ja)
TW (1) TW200537241A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI689524B (zh) * 2017-11-06 2020-04-01 日商旭化成股份有限公司 感光性樹脂積層體及抗蝕劑圖案之製造方法
TWI732926B (zh) * 2016-08-31 2021-07-11 日商富士軟片股份有限公司 圖案形成方法、積層體的製造方法及電子裝置的製造方法

Families Citing this family (15)

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Publication number Priority date Publication date Assignee Title
JP5079995B2 (ja) * 2005-08-26 2012-11-21 株式会社ジャパンディスプレイイースト 透過型液晶表示装置およびその製造方法
TW200728908A (en) * 2006-01-25 2007-08-01 Kaneka Corp Photosensitive dry film resist, printed wiring board using same, and method for producing printed wiring board
JP5740915B2 (ja) * 2010-10-28 2015-07-01 東レ株式会社 フィルム積層体
KR20160070801A (ko) * 2013-12-26 2016-06-20 아사히 가세이 가부시키가이샤 감광성 수지 조성물 및 감광성 수지 적층체
JP6225053B2 (ja) 2014-03-20 2017-11-01 富士フイルム株式会社 感光性積層体、転写材料、パターン化された感光性積層体及びその製造方法、タッチパネル、並びに画像表示装置
JP6482206B2 (ja) * 2014-08-22 2019-03-13 キヤノン株式会社 中空構造を有するパターンの形成方法
JP6329499B2 (ja) * 2015-02-26 2018-05-23 三菱製紙株式会社 エッチング保護用樹脂組成物及びエッチング保護シート
KR102572426B1 (ko) * 2015-07-30 2023-08-30 가부시끼가이샤 레조낙 감광성 엘리먼트, 배리어층 형성용 수지 조성물, 레지스터 패턴의 형성 방법 및 프린트 배선판의 제조 방법
DE102016217929A1 (de) * 2016-09-20 2018-03-22 Carl Zeiss Smt Gmbh Projektionsbelichtungsverfahren und Projektionsbelichtungsanlage für die Mikrolithographie
JP6839476B2 (ja) * 2016-09-26 2021-03-10 カンタツ株式会社 パターン形成用シート
WO2018179095A1 (ja) * 2017-03-28 2018-10-04 日立化成株式会社 転写型感光性フィルム、硬化膜パターンの形成方法、硬化膜及びタッチパネル
CN111093984A (zh) * 2017-09-22 2020-05-01 富士胶片株式会社 层叠体、偏振片及图像显示装置
CN112242098B (zh) * 2020-10-14 2022-08-05 Tcl华星光电技术有限公司 基板及其制备方法、显示面板
CN116719075A (zh) * 2023-06-07 2023-09-08 河南省科学院同位素研究所有限责任公司 一种辐射敏感标志及其制备方法
EP4660707A1 (en) * 2024-06-03 2025-12-10 ASML Netherlands B.V. Method of manufacturing devices by lithography with resist transfer

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JPS5523163A (en) * 1978-08-09 1980-02-19 Agency Of Ind Science & Technol Polyvinyl alcohol type photosensitive resin and its preparation
JPH04301846A (ja) * 1991-03-29 1992-10-26 Toshiba Corp 露光用マスク基板の製造方法
JPH09205057A (ja) * 1996-01-25 1997-08-05 Hitachi Ltd 半導体装置の製造方法
JP3800668B2 (ja) * 1996-05-24 2006-07-26 東洋合成工業株式会社 感光剤およびこれを含む感光性組成物並びにパターン形成方法
JP3893553B2 (ja) * 1998-09-22 2007-03-14 富士フイルム株式会社 感光性転写材料
JP4005236B2 (ja) * 1998-09-25 2007-11-07 富士フイルム株式会社 感光性転写材料および画像形成方法
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JP4048791B2 (ja) * 2002-02-18 2008-02-20 Ｊｓｒ株式会社 感放射線性樹脂組成物
JP3912663B2 (ja) * 2002-02-26 2007-05-09 富士フイルム株式会社 カラーフィルター用画素の形成方法、液晶表示装置用カラーフィルター、液晶表示装置用スペーサー及び配向制御用突起の形成方法、液晶表示装置用スペーサー及び配向制御用突起

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI732926B (zh) * 2016-08-31 2021-07-11 日商富士軟片股份有限公司 圖案形成方法、積層體的製造方法及電子裝置的製造方法
TWI689524B (zh) * 2017-11-06 2020-04-01 日商旭化成股份有限公司 感光性樹脂積層體及抗蝕劑圖案之製造方法

Also Published As

Publication number Publication date
KR20050074927A (ko) 2005-07-19
CN1641481A (zh) 2005-07-20
JP2005202066A (ja) 2005-07-28

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