TW200610634A - Resin sealing mold - Google Patents

Resin sealing mold

Info

Publication number
TW200610634A
TW200610634A TW094125572A TW94125572A TW200610634A TW 200610634 A TW200610634 A TW 200610634A TW 094125572 A TW094125572 A TW 094125572A TW 94125572 A TW94125572 A TW 94125572A TW 200610634 A TW200610634 A TW 200610634A
Authority
TW
Taiwan
Prior art keywords
substrate
resin
pressure
chip
cope
Prior art date
Application number
TW094125572A
Other languages
Chinese (zh)
Inventor
Yukitomo Tane
Masafumi Shimanouchi
Satoshi Nihei
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of TW200610634A publication Critical patent/TW200610634A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

To prevent the indentation of a substrate, damage such as a crack, or defectives such as the disconnection of a wiring pattern which the substrate bears when resin-sealing a chip attached to a thin substrate or a fragile substrate. A drag and a cope are provided to face each other. A substrate is placed on the mold surface of the drag, and a chip is attached to the chip attaching surface of the substrate. On the mold surface, a pressure absorbing layer of engineering plastic is formed to contain the substrate if viewed from above. The pressure absorbing layer has such heat resistance as enduring a temperature at the curing of a fluent resin, and a constant thickness, hardness, elasticity, and compression resistance. When the chip is resin-sealed, a fluent resin is injected in the cavity of the cope while the drag and the cope are clamped. Since the pressure absorbing layer locally deforms, pressure applied to the substrate, in other words, clamp pressure by mold-clamping and resin pressure from the fluent resin is reduced.
TW094125572A 2004-08-25 2005-07-28 Resin sealing mold TW200610634A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004244802A JP2006066486A (en) 2004-08-25 2004-08-25 Resin sealed type

Publications (1)

Publication Number Publication Date
TW200610634A true TW200610634A (en) 2006-04-01

Family

ID=36112720

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094125572A TW200610634A (en) 2004-08-25 2005-07-28 Resin sealing mold

Country Status (3)

Country Link
JP (1) JP2006066486A (en)
KR (1) KR100646905B1 (en)
TW (1) TW200610634A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110494974A (en) * 2017-04-19 2019-11-22 立山科学工业股份有限公司 Electronic module and method of manufacturing the same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100726724B1 (en) * 2006-02-09 2007-06-11 한국생산기술연구원 Stacking Molding Device for Hot Embossing
WO2011105640A1 (en) * 2010-02-25 2011-09-01 한미반도체 주식회사 Compression molding device and method
WO2011105639A1 (en) * 2010-02-25 2011-09-01 한미반도체 주식회사 Compression molding device and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110494974A (en) * 2017-04-19 2019-11-22 立山科学工业股份有限公司 Electronic module and method of manufacturing the same
CN110494974B (en) * 2017-04-19 2023-02-28 立山科学工业股份有限公司 Electronic module and manufacturing method thereof

Also Published As

Publication number Publication date
JP2006066486A (en) 2006-03-09
KR100646905B1 (en) 2006-11-23
KR20060050312A (en) 2006-05-19

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