TW200610634A - Resin sealing mold - Google Patents

Resin sealing mold

Info

Publication number
TW200610634A
TW200610634A TW094125572A TW94125572A TW200610634A TW 200610634 A TW200610634 A TW 200610634A TW 094125572 A TW094125572 A TW 094125572A TW 94125572 A TW94125572 A TW 94125572A TW 200610634 A TW200610634 A TW 200610634A
Authority
TW
Taiwan
Prior art keywords
substrate
resin
pressure
chip
cope
Prior art date
Application number
TW094125572A
Other languages
English (en)
Inventor
Yukitomo Tane
Masafumi Shimanouchi
Satoshi Nihei
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of TW200610634A publication Critical patent/TW200610634A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
TW094125572A 2004-08-25 2005-07-28 Resin sealing mold TW200610634A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004244802A JP2006066486A (ja) 2004-08-25 2004-08-25 樹脂封止型

Publications (1)

Publication Number Publication Date
TW200610634A true TW200610634A (en) 2006-04-01

Family

ID=36112720

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094125572A TW200610634A (en) 2004-08-25 2005-07-28 Resin sealing mold

Country Status (3)

Country Link
JP (1) JP2006066486A (zh)
KR (1) KR100646905B1 (zh)
TW (1) TW200610634A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110494974A (zh) * 2017-04-19 2019-11-22 立山科学工业股份有限公司 电子模块及其制造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100726724B1 (ko) * 2006-02-09 2007-06-11 한국생산기술연구원 핫엠보싱용 적층형 금형장치
WO2011105640A1 (ko) * 2010-02-25 2011-09-01 한미반도체 주식회사 압축 성형장치 및 압축 성형방법
WO2011105639A1 (ko) * 2010-02-25 2011-09-01 한미반도체 주식회사 압축 성형 장치 및 방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110494974A (zh) * 2017-04-19 2019-11-22 立山科学工业股份有限公司 电子模块及其制造方法
CN110494974B (zh) * 2017-04-19 2023-02-28 立山科学工业股份有限公司 电子模块及其制造方法

Also Published As

Publication number Publication date
KR20060050312A (ko) 2006-05-19
JP2006066486A (ja) 2006-03-09
KR100646905B1 (ko) 2006-11-23

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