TW200616041A - Coating and developing apparatus, exposure apparatus and resist pattern forming method - Google Patents

Coating and developing apparatus, exposure apparatus and resist pattern forming method

Info

Publication number
TW200616041A
TW200616041A TW094131155A TW94131155A TW200616041A TW 200616041 A TW200616041 A TW 200616041A TW 094131155 A TW094131155 A TW 094131155A TW 94131155 A TW94131155 A TW 94131155A TW 200616041 A TW200616041 A TW 200616041A
Authority
TW
Taiwan
Prior art keywords
wafer
coating
forming method
resist pattern
pattern forming
Prior art date
Application number
TW094131155A
Other languages
Chinese (zh)
Other versions
TWI267129B (en
Inventor
Taro Yamamoto
Osamu Hirakawa
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200616041A publication Critical patent/TW200616041A/en
Application granted granted Critical
Publication of TWI267129B publication Critical patent/TWI267129B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0474—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

A washing unit is prepared in the interface station of a coating and developing apparatus. This washing unit faces across the circumferential edge of a wafer by "⊃" Character type part formed so that the circumferential edge of a wafer might be surrounded, and it attracts it from the suction port of the side part of the "⊃" Character type part while making the circumferential edge of a wafer dispense washing liquid from the top nozzle part and a bottom nozzle part prepared in this "⊃" Character type part. The particle adhered to the wafer is removed certainly by making it such composition.
TW094131155A 2004-09-10 2005-09-09 Coating and developing apparatus, exposure apparatus and resist pattern forming method TWI267129B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004264755A JP4343069B2 (en) 2004-09-10 2004-09-10 Coating, developing device, exposure device, and resist pattern forming method.

Publications (2)

Publication Number Publication Date
TW200616041A true TW200616041A (en) 2006-05-16
TWI267129B TWI267129B (en) 2006-11-21

Family

ID=36036454

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094131155A TWI267129B (en) 2004-09-10 2005-09-09 Coating and developing apparatus, exposure apparatus and resist pattern forming method

Country Status (3)

Country Link
JP (1) JP4343069B2 (en)
TW (1) TWI267129B (en)
WO (1) WO2006028173A1 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4381285B2 (en) 2004-11-11 2009-12-09 株式会社Ｓｏｋｕｄｏ Substrate processing apparatus and substrate processing method
JP5154006B2 (en) * 2004-12-06 2013-02-27 株式会社Ｓｏｋｕｄｏ Substrate processing equipment
JP2006220847A (en) * 2005-02-09 2006-08-24 Toshiba Corp Resist pattern forming method
JP5132108B2 (en) 2006-02-02 2013-01-30 株式会社Ｓｏｋｕｄｏ Substrate processing equipment
JP2007266074A (en) * 2006-03-27 2007-10-11 Toshiba Corp Semiconductor device manufacturing method and immersion lithography system
JP4832142B2 (en) * 2006-03-31 2011-12-07 株式会社Ｓｏｋｕｄｏ Substrate processing equipment
JP4912180B2 (en) * 2006-09-15 2012-04-11 東京エレクトロン株式会社 Exposure and development processing methods
JP4926678B2 (en) * 2006-12-04 2012-05-09 東京エレクトロン株式会社 Immersion exposure cleaning apparatus and cleaning method, and computer program and storage medium
JP2008153450A (en) 2006-12-18 2008-07-03 Tokyo Electron Ltd Coating film processing method and coating film processing apparatus
JP2008153422A (en) * 2006-12-18 2008-07-03 Tokyo Electron Ltd Coating / developing apparatus and pattern forming method
JP2008198820A (en) 2007-02-14 2008-08-28 Tokyo Electron Ltd Substrate processing method and substrate processing apparatus
JP5004611B2 (en) 2007-02-15 2012-08-22 株式会社Ｓｏｋｕｄｏ Substrate processing equipment
JP5149513B2 (en) * 2007-02-15 2013-02-20 株式会社Ｓｏｋｕｄｏ Substrate processing equipment
US7641406B2 (en) * 2007-07-26 2010-01-05 Sokudo Co., Ltd. Bevel inspection apparatus for substrate processing
JP4893574B2 (en) * 2007-10-11 2012-03-07 東京エレクトロン株式会社 Surface exposure apparatus, surface exposure method, coating, developing apparatus, and storage medium
JP5308054B2 (en) * 2008-04-16 2013-10-09 株式会社Ｓｏｋｕｄｏ Substrate processing equipment
JP2009295716A (en) * 2008-06-04 2009-12-17 Toshiba Corp Method for manufacturing semiconductor device and substrate processing apparatus
JP2013118205A (en) * 2010-03-23 2013-06-13 Jet Co Ltd Substrate processing apparatus
WO2012081587A1 (en) 2010-12-14 2012-06-21 株式会社ニコン Inspection method, inspection device, exposure management method, exposure system, and semiconductor device
CN111352314A (en) * 2018-12-20 2020-06-30 夏泰鑫半导体(青岛)有限公司 Developing device and developing method for semiconductor device
CN110600405A (en) * 2019-08-28 2019-12-20 长江存储科技有限责任公司 Cleaning device, method and storage medium
CN112405339B (en) * 2020-12-05 2024-11-19 天津中环领先材料技术有限公司 A temporary storage system for silicon wafer polishing
JP7779688B2 (en) * 2021-09-24 2025-12-03 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method and substrate processing apparatus

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3114084B2 (en) * 1994-04-04 2000-12-04 東京エレクトロン株式会社 Processing method and processing apparatus
JP3295620B2 (en) * 1996-08-08 2002-06-24 東京エレクトロン株式会社 Processing equipment
JP2001319849A (en) * 2000-05-08 2001-11-16 Tokyo Electron Ltd Liquid processing apparatus and liquid processing method
JP4191421B2 (en) * 2002-03-28 2008-12-03 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
JP4043382B2 (en) * 2003-02-28 2008-02-06 東京エレクトロン株式会社 Coating film removing method and apparatus
JP4101740B2 (en) * 2003-12-09 2008-06-18 東京エレクトロン株式会社 Coating / developing apparatus and resist pattern forming method

Also Published As

Publication number Publication date
JP4343069B2 (en) 2009-10-14
TWI267129B (en) 2006-11-21
JP2006080404A (en) 2006-03-23
WO2006028173A1 (en) 2006-03-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees