TW200621418A - An alignment device - Google Patents
An alignment deviceInfo
- Publication number
- TW200621418A TW200621418A TW094140663A TW94140663A TW200621418A TW 200621418 A TW200621418 A TW 200621418A TW 094140663 A TW094140663 A TW 094140663A TW 94140663 A TW94140663 A TW 94140663A TW 200621418 A TW200621418 A TW 200621418A
- Authority
- TW
- Taiwan
- Prior art keywords
- freedom degree
- horizontal movement
- worktable
- vertical rotation
- guiding parts
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/25—Movable or adjustable work or tool supports
- B23Q1/44—Movable or adjustable work or tool supports using particular mechanisms
-
- G—PHYSICS
- G12—INSTRUMENT DETAILS
- G12B—CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILS OF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR
- G12B5/00—Adjusting position or attitude, e.g. level, of instruments or other apparatus, or of parts thereof; Compensating for the effects of tilting or acceleration, e.g. for optical apparatus
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
- H10P72/57—Mask-wafer alignment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Machine Tool Units (AREA)
- Details Of Measuring And Other Instruments (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004345925 | 2004-11-30 | ||
| JP2005160929 | 2005-06-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200621418A true TW200621418A (en) | 2006-07-01 |
| TWI365116B TWI365116B (2) | 2012-06-01 |
Family
ID=36564894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094140663A TW200621418A (en) | 2004-11-30 | 2005-11-18 | An alignment device |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7848832B2 (2) |
| JP (1) | JP4656334B2 (2) |
| KR (1) | KR101025632B1 (2) |
| DE (1) | DE112005002970T5 (2) |
| TW (1) | TW200621418A (2) |
| WO (1) | WO2006059457A1 (2) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104007768A (zh) * | 2013-02-25 | 2014-08-27 | 全研科技有限公司 | 四轴共平面对位平台的回归原点方法 |
| TWI664642B (zh) * | 2018-08-20 | 2019-07-01 | 全研科技有限公司 | 高精度線性馬達一次對位平台 |
| CN116230610A (zh) * | 2023-05-08 | 2023-06-06 | 上海隐冠半导体技术有限公司 | 一种工件的位置调整方法及系统 |
| TWI826686B (zh) * | 2019-05-14 | 2023-12-21 | 日商迪思科股份有限公司 | 荷重感測器的電壓調整方法 |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007240213A (ja) | 2006-03-06 | 2007-09-20 | Yaskawa Electric Corp | 回転・二方向移動装置、アライメントユニットおよびアライメントステージ |
| JP4952102B2 (ja) * | 2006-07-12 | 2012-06-13 | 株式会社安川電機 | アライメント装置 |
| JP5061569B2 (ja) * | 2006-10-12 | 2012-10-31 | 株式会社安川電機 | アライメントステージ |
| JP2010274429A (ja) * | 2009-05-26 | 2010-12-09 | Ihi Corp | アライメントステージ |
| JP5467349B2 (ja) * | 2010-02-17 | 2014-04-09 | 国立大学法人京都大学 | 駆動ユニットを備えた機械構造 |
| CN101871549B (zh) * | 2010-06-04 | 2012-06-13 | 上海理工大学 | 三自由度精密定位工作台 |
| JP6208419B2 (ja) * | 2012-09-19 | 2017-10-04 | 株式会社ダイヘン | 算出装置、搬送ロボットシステム、及び算出方法 |
| CN110634786A (zh) * | 2013-09-22 | 2019-12-31 | 盛美半导体设备(上海)有限公司 | 对准装置及对准方法 |
| CN103714865B (zh) * | 2014-01-03 | 2015-11-18 | 天津大学 | 一种大行程两平动一转动精密定位平台 |
| US10379314B2 (en) * | 2015-03-19 | 2019-08-13 | Panasonic Intellectual Property Management Co., Ltd. | Multi-degree-of-freedom support mechanism, lens barrel, and optical device |
| CN106158715B (zh) * | 2015-04-24 | 2021-04-02 | 上海微电子装备(集团)股份有限公司 | 用于晶圆的预对准装置及方法 |
| CN105448353B (zh) * | 2015-11-23 | 2018-06-22 | 清华大学 | 紧凑型多层纳米伺服平台 |
| CN106933060B (zh) * | 2015-12-30 | 2018-10-16 | 上海微电子装备(集团)股份有限公司 | 一种棱镜旋转调节机构和光刻机曝光系统及光刻机 |
| CN106363615B (zh) * | 2016-10-31 | 2019-02-26 | 天津大学 | 一种卧式六自由度微纳操作器 |
| CN106683710B (zh) * | 2017-03-20 | 2023-01-10 | 歌尔股份有限公司 | 一种三自由度运动平台 |
| CN108146058A (zh) * | 2018-03-07 | 2018-06-12 | 杭州思元智能科技有限公司 | 全自动印刷机 |
| CN111146917B (zh) * | 2018-11-03 | 2021-01-01 | 全研科技有限公司 | 高精度线性马达一次对位平台 |
| CN111285880A (zh) * | 2019-08-28 | 2020-06-16 | 中南大学 | 一种含双冠醚的开关化合物的制备和应用 |
| KR102298394B1 (ko) * | 2020-01-21 | 2021-09-06 | (주)브이에이디인스트루먼트 | 회전 가능한 스테이지 장치 |
| KR102298055B1 (ko) * | 2020-04-01 | 2021-09-03 | 유한책임회사 세봉 | 기판 얼라인 장치 |
| CN115346890B (zh) * | 2021-05-14 | 2025-05-06 | 深圳中科飞测科技股份有限公司 | 校准设备和校准方法 |
| WO2025099947A1 (ja) * | 2023-11-10 | 2025-05-15 | ヤマハ発動機株式会社 | ワーク作業装置およびワーク移動方法 |
| FR3158464A1 (fr) * | 2024-01-19 | 2025-07-25 | Micro-Controle-Spectra Physics | Système et méthode associée pour déplacer une plaque de support dans un environnement de traitement |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05162035A (ja) * | 1991-12-13 | 1993-06-29 | Ono Sokki Co Ltd | XY−θ軸の微調整機構 |
| JP2700050B2 (ja) * | 1994-10-04 | 1998-01-19 | ヒーハイスト精工株式会社 | 縦横移動旋回テーブル機構 |
| US5758429A (en) * | 1996-05-14 | 1998-06-02 | Farzan; Farshad | Translation and rotation coupled positioning method and apparatus |
| JPH1043978A (ja) | 1996-08-02 | 1998-02-17 | Sakai Giken:Kk | 移動テーブル装置 |
| JPH11245128A (ja) * | 1998-02-26 | 1999-09-14 | Thk Co Ltd | 2軸平行・1軸旋回運動案内機構およびこれを用いた2軸平行・1軸旋回テーブル装置 |
| TW469483B (en) * | 1999-04-19 | 2001-12-21 | Applied Materials Inc | Method and apparatus for aligning a cassette |
| US6577923B1 (en) * | 1999-12-23 | 2003-06-10 | Applied Materials, Inc. | Apparatus and method for robotic alignment of substrates |
| JP4814438B2 (ja) | 2001-05-02 | 2011-11-16 | 日本トムソン株式会社 | リニアモータを内蔵したステージ装置 |
| TWI227814B (en) * | 2002-09-20 | 2005-02-11 | Asml Netherlands Bv | Alignment system and methods for lithographic systems using at least two wavelengths |
| US20090152785A1 (en) * | 2005-09-12 | 2009-06-18 | Kabushiki Kaisha Yaskawa Denki | Alignment apparatus and original point returning method of alignment apparatus, turning table, translational table, machine including alignment apparatus and machine control system |
-
2005
- 2005-11-07 KR KR1020077012126A patent/KR101025632B1/ko not_active Expired - Fee Related
- 2005-11-07 DE DE112005002970T patent/DE112005002970T5/de not_active Ceased
- 2005-11-07 WO PCT/JP2005/020343 patent/WO2006059457A1/ja not_active Ceased
- 2005-11-07 US US11/720,271 patent/US7848832B2/en not_active Expired - Fee Related
- 2005-11-07 JP JP2006547703A patent/JP4656334B2/ja not_active Expired - Fee Related
- 2005-11-18 TW TW094140663A patent/TW200621418A/zh not_active IP Right Cessation
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104007768A (zh) * | 2013-02-25 | 2014-08-27 | 全研科技有限公司 | 四轴共平面对位平台的回归原点方法 |
| CN104007768B (zh) * | 2013-02-25 | 2017-04-12 | 全研科技有限公司 | 四轴共平面对位平台的回归原点方法 |
| TWI664642B (zh) * | 2018-08-20 | 2019-07-01 | 全研科技有限公司 | 高精度線性馬達一次對位平台 |
| TWI826686B (zh) * | 2019-05-14 | 2023-12-21 | 日商迪思科股份有限公司 | 荷重感測器的電壓調整方法 |
| CN116230610A (zh) * | 2023-05-08 | 2023-06-06 | 上海隐冠半导体技术有限公司 | 一种工件的位置调整方法及系统 |
| CN116230610B (zh) * | 2023-05-08 | 2023-09-26 | 上海隐冠半导体技术有限公司 | 一种工件的位置调整方法及系统 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101025632B1 (ko) | 2011-03-30 |
| JP4656334B2 (ja) | 2011-03-23 |
| KR20070085538A (ko) | 2007-08-27 |
| TWI365116B (2) | 2012-06-01 |
| US7848832B2 (en) | 2010-12-07 |
| WO2006059457A1 (ja) | 2006-06-08 |
| DE112005002970T5 (de) | 2007-10-25 |
| US20080019817A1 (en) | 2008-01-24 |
| JPWO2006059457A1 (ja) | 2008-06-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |