TWI365116B - - Google Patents

Info

Publication number
TWI365116B
TWI365116B TW094140663A TW94140663A TWI365116B TW I365116 B TWI365116 B TW I365116B TW 094140663 A TW094140663 A TW 094140663A TW 94140663 A TW94140663 A TW 94140663A TW I365116 B TWI365116 B TW I365116B
Authority
TW
Taiwan
Application number
TW094140663A
Other languages
Chinese (zh)
Other versions
TW200621418A (en
Inventor
Takehiko Komiya
Toshiyuki Osuga
Toshihiro Sawa
Original Assignee
Yaskawa Denki Seisakusho Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaskawa Denki Seisakusho Kk filed Critical Yaskawa Denki Seisakusho Kk
Publication of TW200621418A publication Critical patent/TW200621418A/zh
Application granted granted Critical
Publication of TWI365116B publication Critical patent/TWI365116B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/25—Movable or adjustable work or tool supports
    • B23Q1/44—Movable or adjustable work or tool supports using particular mechanisms
    • G—PHYSICS
    • G12—INSTRUMENT DETAILS
    • G12B—CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILS OF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G12B5/00—Adjusting position or attitude, e.g. level, of instruments or other apparatus, or of parts thereof; Compensating for the effects of tilting or acceleration, e.g. for optical apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/57—Mask-wafer alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Machine Tool Units (AREA)
  • Details Of Measuring And Other Instruments (AREA)
TW094140663A 2004-11-30 2005-11-18 An alignment device TW200621418A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004345925 2004-11-30
JP2005160929 2005-06-01

Publications (2)

Publication Number Publication Date
TW200621418A TW200621418A (en) 2006-07-01
TWI365116B true TWI365116B (2) 2012-06-01

Family

ID=36564894

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094140663A TW200621418A (en) 2004-11-30 2005-11-18 An alignment device

Country Status (6)

Country Link
US (1) US7848832B2 (2)
JP (1) JP4656334B2 (2)
KR (1) KR101025632B1 (2)
DE (1) DE112005002970T5 (2)
TW (1) TW200621418A (2)
WO (1) WO2006059457A1 (2)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007240213A (ja) 2006-03-06 2007-09-20 Yaskawa Electric Corp 回転・二方向移動装置、アライメントユニットおよびアライメントステージ
JP4952102B2 (ja) * 2006-07-12 2012-06-13 株式会社安川電機 アライメント装置
JP5061569B2 (ja) * 2006-10-12 2012-10-31 株式会社安川電機 アライメントステージ
JP2010274429A (ja) * 2009-05-26 2010-12-09 Ihi Corp アライメントステージ
JP5467349B2 (ja) * 2010-02-17 2014-04-09 国立大学法人京都大学 駆動ユニットを備えた機械構造
CN101871549B (zh) * 2010-06-04 2012-06-13 上海理工大学 三自由度精密定位工作台
JP6208419B2 (ja) * 2012-09-19 2017-10-04 株式会社ダイヘン 算出装置、搬送ロボットシステム、及び算出方法
CN104007768B (zh) * 2013-02-25 2017-04-12 全研科技有限公司 四轴共平面对位平台的回归原点方法
CN110634786A (zh) * 2013-09-22 2019-12-31 盛美半导体设备（上海）有限公司 对准装置及对准方法
CN103714865B (zh) * 2014-01-03 2015-11-18 天津大学 一种大行程两平动一转动精密定位平台
US10379314B2 (en) * 2015-03-19 2019-08-13 Panasonic Intellectual Property Management Co., Ltd. Multi-degree-of-freedom support mechanism, lens barrel, and optical device
CN106158715B (zh) * 2015-04-24 2021-04-02 上海微电子装备（集团）股份有限公司 用于晶圆的预对准装置及方法
CN105448353B (zh) * 2015-11-23 2018-06-22 清华大学 紧凑型多层纳米伺服平台
CN106933060B (zh) * 2015-12-30 2018-10-16 上海微电子装备（集团）股份有限公司 一种棱镜旋转调节机构和光刻机曝光系统及光刻机
CN106363615B (zh) * 2016-10-31 2019-02-26 天津大学 一种卧式六自由度微纳操作器
CN106683710B (zh) * 2017-03-20 2023-01-10 歌尔股份有限公司 一种三自由度运动平台
CN108146058A (zh) * 2018-03-07 2018-06-12 杭州思元智能科技有限公司 全自动印刷机
TWI664642B (zh) * 2018-08-20 2019-07-01 全研科技有限公司 高精度線性馬達一次對位平台
CN111146917B (zh) * 2018-11-03 2021-01-01 全研科技有限公司 高精度线性马达一次对位平台
JP7235587B2 (ja) * 2019-05-14 2023-03-08 株式会社ディスコ 荷重センサの電圧調整方法
CN111285880A (zh) * 2019-08-28 2020-06-16 中南大学 一种含双冠醚的开关化合物的制备和应用
KR102298394B1 (ko) * 2020-01-21 2021-09-06 (주)브이에이디인스트루먼트 회전 가능한 스테이지 장치
KR102298055B1 (ko) * 2020-04-01 2021-09-03 유한책임회사 세봉 기판 얼라인 장치
CN115346890B (zh) * 2021-05-14 2025-05-06 深圳中科飞测科技股份有限公司 校准设备和校准方法
CN116230610B (zh) * 2023-05-08 2023-09-26 上海隐冠半导体技术有限公司 一种工件的位置调整方法及系统
WO2025099947A1 (ja) * 2023-11-10 2025-05-15 ヤマハ発動機株式会社 ワーク作業装置およびワーク移動方法
FR3158464A1 (fr) * 2024-01-19 2025-07-25 Micro-Controle-Spectra Physics Système et méthode associée pour déplacer une plaque de support dans un environnement de traitement

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05162035A (ja) * 1991-12-13 1993-06-29 Ono Sokki Co Ltd ＸＹ−θ軸の微調整機構
JP2700050B2 (ja) * 1994-10-04 1998-01-19 ヒーハイスト精工株式会社 縦横移動旋回テーブル機構
US5758429A (en) * 1996-05-14 1998-06-02 Farzan; Farshad Translation and rotation coupled positioning method and apparatus
JPH1043978A (ja) 1996-08-02 1998-02-17 Sakai Giken:Kk 移動テーブル装置
JPH11245128A (ja) * 1998-02-26 1999-09-14 Thk Co Ltd ２軸平行・１軸旋回運動案内機構およびこれを用いた２軸平行・１軸旋回テーブル装置
TW469483B (en) * 1999-04-19 2001-12-21 Applied Materials Inc Method and apparatus for aligning a cassette
US6577923B1 (en) * 1999-12-23 2003-06-10 Applied Materials, Inc. Apparatus and method for robotic alignment of substrates
JP4814438B2 (ja) 2001-05-02 2011-11-16 日本トムソン株式会社 リニアモータを内蔵したステージ装置
TWI227814B (en) * 2002-09-20 2005-02-11 Asml Netherlands Bv Alignment system and methods for lithographic systems using at least two wavelengths
US20090152785A1 (en) * 2005-09-12 2009-06-18 Kabushiki Kaisha Yaskawa Denki Alignment apparatus and original point returning method of alignment apparatus, turning table, translational table, machine including alignment apparatus and machine control system

Also Published As

Publication number Publication date
KR101025632B1 (ko) 2011-03-30
JP4656334B2 (ja) 2011-03-23
KR20070085538A (ko) 2007-08-27
TW200621418A (en) 2006-07-01
US7848832B2 (en) 2010-12-07
WO2006059457A1 (ja) 2006-06-08
DE112005002970T5 (de) 2007-10-25
US20080019817A1 (en) 2008-01-24
JPWO2006059457A1 (ja) 2008-06-05

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees