TW200701852A - Method for producing flexible copper-clad laminated substrate and multi-layer laminate - Google Patents

Method for producing flexible copper-clad laminated substrate and multi-layer laminate

Info

Publication number
TW200701852A
TW200701852A TW095110408A TW95110408A TW200701852A TW 200701852 A TW200701852 A TW 200701852A TW 095110408 A TW095110408 A TW 095110408A TW 95110408 A TW95110408 A TW 95110408A TW 200701852 A TW200701852 A TW 200701852A
Authority
TW
Taiwan
Prior art keywords
carrier
copper foil
ultrathin copper
clad laminated
laminate
Prior art date
Application number
TW095110408A
Other languages
Chinese (zh)
Other versions
TWI372006B (en
Inventor
Makoto Ueno
Taeko Takarabe
Yuji Matsushita
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006030635A external-priority patent/JP4762742B2/en
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200701852A publication Critical patent/TW200701852A/en
Application granted granted Critical
Publication of TWI372006B publication Critical patent/TWI372006B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)

Abstract

The purpose is to reduce the curling of a flexible cupper-clad laminated substrate which occurs when a resin solution is applied directly on an ultrathin copper foil with a heat-resistant carrier to form a resin layer on the substrate and then the carrier is peeled off. A method for producing a flexible copper-clad laminated substrate (6) having a resin layer (1) and an ultrathin copper foil (2), the method comprising, in an ultrathin copper foil with a heat-resistant carrier in which the ultrathin copper foil (2) is provided on the carrier (4) thorough a releasable layer (3), applying a resin solution onto the ultrathin copper foil, drying and thermally treating the resin solution to form the resin layer (1) which is composed of one or more layers on the ultrathin copper foil with the heat-resistant carrier, thereby producing a multi-layer laminate, and removing the carrier from the laminate. In the multi-layer laminate provided before the removal of the carrier, a force for causing the laminate to curl inwardly on the carrier-side is applied to the laminate and then the carrier is peeled off from the substrate. Thus, a flexible cupper-clad laminated substrate (6) can be produced which is reduced in the degree of curling.
TW095110408A 2005-03-31 2006-03-24 Method for producing flexible copper-clad laminated substrate and multi-layer laminate TW200701852A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005104156 2005-03-31
JP2006030635A JP4762742B2 (en) 2006-02-08 2006-02-08 Method for producing flexible copper-clad laminate

Publications (2)

Publication Number Publication Date
TW200701852A true TW200701852A (en) 2007-01-01
TWI372006B TWI372006B (en) 2012-09-01

Family

ID=37073287

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095110408A TW200701852A (en) 2005-03-31 2006-03-24 Method for producing flexible copper-clad laminated substrate and multi-layer laminate

Country Status (4)

Country Link
KR (1) KR101245791B1 (en)
CN (1) CN101151946B (en)
TW (1) TW200701852A (en)
WO (1) WO2006106723A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI846241B (en) * 2022-12-27 2024-06-21 亞洲電材股份有限公司 High thermal conductive metal substrate and preparation method thereof

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5347980B2 (en) * 2010-01-14 2013-11-20 住友金属鉱山株式会社 Metallized polyimide film and flexible wiring board using the same
KR101441235B1 (en) * 2013-03-14 2014-09-17 홍익대학교 산학협력단 Stiffness-gradient stretchable substrate, manufacturing method of the same substrate, stretchable electronics package produced using the substrate and manufacturing method of the same package
CN103212505B (en) * 2013-03-18 2017-08-29 深圳市振勤电子科技有限公司 The barrier structure of metal material spraying
JP6427454B2 (en) * 2015-03-31 2018-11-21 日鉄ケミカル＆マテリアル株式会社 Copper-clad laminate and printed wiring board
DE102015113928A1 (en) * 2015-08-21 2017-02-23 Schreiner Group Gmbh & Co. Kg Object with an electronic unit and ladder structures on a support structure
JP6252567B2 (en) * 2015-09-03 2017-12-27 王子ホールディングス株式会社 Release sheet, release sheet manufacturing method and laminate
JP6642194B2 (en) * 2016-03-29 2020-02-05 味の素株式会社 Manufacturing method of printed wiring board
JP6652111B2 (en) * 2017-07-18 2020-02-19 トヨタ自動車株式会社 Solar cell manufacturing method
CN118042723B (en) * 2024-02-27 2025-05-02 九江德福科技股份有限公司 A production method of a flexible copper-clad laminate and a peelable copper foil with a carrier
CN120685415B (en) * 2025-08-26 2026-02-13 淄博芯材集成电路有限责任公司 Method for manufacturing test strips to simulate peel strength under inner layer substrate process flow

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2216318Y (en) * 1994-11-24 1995-12-27 刘宝申 Flexible polyester film coated copper foil plate and film-coated circuit board
JP3641952B2 (en) * 1998-11-05 2005-04-27 ソニーケミカル株式会社 Polyimide film and flexible substrate
JP2000286514A (en) * 1999-03-29 2000-10-13 Sumitomo Bakelite Co Ltd Adhesive-backed board for flexible printed circuit
JP4504602B2 (en) * 2001-09-04 2010-07-14 三井化学株式会社 Polyimide copper clad laminate and method for producing the same
CN1180006C (en) * 2002-11-22 2004-12-15 中国科学院长春应用化学研究所 Preparation method of polyetherimide flexible printed circuit substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI846241B (en) * 2022-12-27 2024-06-21 亞洲電材股份有限公司 High thermal conductive metal substrate and preparation method thereof

Also Published As

Publication number Publication date
CN101151946B (en) 2010-10-27
KR20070120555A (en) 2007-12-24
TWI372006B (en) 2012-09-01
KR101245791B1 (en) 2013-03-20
CN101151946A (en) 2008-03-26
WO2006106723A1 (en) 2006-10-12

Similar Documents

Publication Publication Date Title
TW200701852A (en) Method for producing flexible copper-clad laminated substrate and multi-layer laminate
WO2004006296A3 (en) Laminate body and corresponding methods and apparatus
TWI268209B (en) Apparatus and method for manufacturing copper clad laminate with improved peel strength
MY149431A (en) Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device
ATE512808T1 (en) EMBOSSED COATING FOR METALLIC PRINTING MATERIALS
EP1627901A4 (en) Primer, conductor foil with resin, laminate and process for producing the laminate
TW200509761A (en) Copper foil with an extremely thin adhesive layer and the method thereof
MY115624A (en) Composite foil of aluminum and copper
WO2009044592A1 (en) Adhesive optical film manufacturing method, adhesive optical film and image display device
CN102711392A (en) Manufacturing method of flexible-rigid circuit board
CN106852032B (en) A kind of flexible metal base plate and preparation method thereof
JP2015026654A5 (en) Copper foil with carrier, method for producing copper-clad laminate and method for producing printed wiring board
WO2009017051A1 (en) Composite for multilayer circuit board
TW200640663A (en) Polyimide-copper composite laminate
JP2007059892A5 (en)
JP2015024515A5 (en) Copper foil with carrier, method for producing copper-clad laminate and method for producing printed wiring board
TW200746971A (en) Flexible laminate board, process for manufacture of the board, and flexible print wiring board
CA2343595A1 (en) Coextrusion binders made of grafted polypropylene and their use on peelable metalloplasctic structures
JP4916057B2 (en) Protective film for FPC, resin conductor foil laminate with protective film for FPC, and method for producing flexible printed wiring board using the same
TW200746967A (en) Conductor-clad laminate, wiring circuit board, and processes for producing the same
TW200706365A (en) Polyimide thin film, polyimide metal laminate and method of manufacturing thereof
KR101175892B1 (en) Dielectric film structure and method of preparing the same
TWI496694B (en) Hot stamping coil and hot stamping coil manufacturing method
JP2014123755A (en) Protective film for fpc, resin conductor foil laminate with protective film for fpc, and method of manufacturing flexible printed wiring board using it
JP2005044880A (en) Flexible metal laminate and manufacturing method thereof

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees