TW200701852A - Method for producing flexible copper-clad laminated substrate and multi-layer laminate - Google Patents

Method for producing flexible copper-clad laminated substrate and multi-layer laminate

Info

Publication number
TW200701852A
TW200701852A TW095110408A TW95110408A TW200701852A TW 200701852 A TW200701852 A TW 200701852A TW 095110408 A TW095110408 A TW 095110408A TW 95110408 A TW95110408 A TW 95110408A TW 200701852 A TW200701852 A TW 200701852A
Authority
TW
Taiwan
Prior art keywords
carrier
copper foil
ultrathin copper
clad laminated
laminate
Prior art date
Application number
TW095110408A
Other languages
English (en)
Other versions
TWI372006B (zh
Inventor
Makoto Ueno
Taeko Takarabe
Yuji Matsushita
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006030635A external-priority patent/JP4762742B2/ja
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200701852A publication Critical patent/TW200701852A/zh
Application granted granted Critical
Publication of TWI372006B publication Critical patent/TWI372006B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
TW095110408A 2005-03-31 2006-03-24 Method for producing flexible copper-clad laminated substrate and multi-layer laminate TW200701852A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005104156 2005-03-31
JP2006030635A JP4762742B2 (ja) 2006-02-08 2006-02-08 フレキシブル銅張積層基板の製造方法

Publications (2)

Publication Number Publication Date
TW200701852A true TW200701852A (en) 2007-01-01
TWI372006B TWI372006B (zh) 2012-09-01

Family

ID=37073287

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095110408A TW200701852A (en) 2005-03-31 2006-03-24 Method for producing flexible copper-clad laminated substrate and multi-layer laminate

Country Status (4)

Country Link
KR (1) KR101245791B1 (zh)
CN (1) CN101151946B (zh)
TW (1) TW200701852A (zh)
WO (1) WO2006106723A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI846241B (zh) * 2022-12-27 2024-06-21 亞洲電材股份有限公司 高導熱金屬基板及其製備方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5347980B2 (ja) * 2010-01-14 2013-11-20 住友金属鉱山株式会社 金属化ポリイミドフィルム、及びそれを用いたフレキシブル配線板
KR101441235B1 (ko) * 2013-03-14 2014-09-17 홍익대학교 산학협력단 강성도 경사형 신축성 기판과 그 제조방법 및 그 신축성 기판을 이용하여 이루어지는 신축성 전자소자 패키지와 그 제조방법
CN103212505B (zh) * 2013-03-18 2017-08-29 深圳市振勤电子科技有限公司 金属材料喷涂的遮挡结构
JP6427454B2 (ja) * 2015-03-31 2018-11-21 日鉄ケミカル＆マテリアル株式会社 銅張積層板及びプリント配線板
DE102015113928A1 (de) * 2015-08-21 2017-02-23 Schreiner Group Gmbh & Co. Kg Gegenstand mit einer elektronischen Einheit und mit Leiterstrukturen auf einer Trägerstruktur
JP6252567B2 (ja) * 2015-09-03 2017-12-27 王子ホールディングス株式会社 剥離シート、剥離シートの製造方法及び積層体
JP6642194B2 (ja) * 2016-03-29 2020-02-05 味の素株式会社 プリント配線板の製造方法
JP6652111B2 (ja) * 2017-07-18 2020-02-19 トヨタ自動車株式会社 太陽電池の製造方法
CN118042723B (zh) * 2024-02-27 2025-05-02 九江德福科技股份有限公司 一种挠性覆铜板及可剥离附载体铜箔的生产方法
CN120685415B (zh) * 2025-08-26 2026-02-13 淄博芯材集成电路有限责任公司 模拟内层基板工艺流程下剥离强度的测试条制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2216318Y (zh) * 1994-11-24 1995-12-27 刘宝申 聚酯薄膜柔性覆铜箔板和覆膜线路板
JP3641952B2 (ja) * 1998-11-05 2005-04-27 ソニーケミカル株式会社 ポリイミドフィルム及びフレキシブル基板
JP2000286514A (ja) * 1999-03-29 2000-10-13 Sumitomo Bakelite Co Ltd 接着剤付きフレキシブルプリント回路用基板
JP4504602B2 (ja) * 2001-09-04 2010-07-14 三井化学株式会社 ポリイミド銅張積層板及びその製造方法
CN1180006C (zh) * 2002-11-22 2004-12-15 中国科学院长春应用化学研究所 聚醚酰亚胺柔性印刷线路基材的制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI846241B (zh) * 2022-12-27 2024-06-21 亞洲電材股份有限公司 高導熱金屬基板及其製備方法

Also Published As

Publication number Publication date
CN101151946B (zh) 2010-10-27
CN101151946A (zh) 2008-03-26
KR101245791B1 (ko) 2013-03-20
WO2006106723A1 (ja) 2006-10-12
KR20070120555A (ko) 2007-12-24
TWI372006B (zh) 2012-09-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees