TW200706707A - Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution - Google Patents

Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution

Info

Publication number: TW200706707A
Authority: TW; Taiwan
Prior art keywords: tin plating; plating solution; tin; solution; preparing
Prior art date: 2005-04-28

Application number

TW095108414A

Other languages

English (en)

Chinese (zh)

Other versions

TWI325022B (2

Inventor

Satoshi Kawashima

Hiroyuki Tashiro

Shigenori Emura

Takamitsu Nashiyama

Hideyuki Sampei

Original Assignee

Meltex Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2005-04-28

Filing date

2006-03-13

Publication date

2007-02-16

2006-03-13 Application filed by Meltex Inc filed Critical Meltex Inc

2007-02-16 Publication of TW200706707A publication Critical patent/TW200706707A/zh

2010-05-21 Application granted granted Critical

2010-05-21 Publication of TWI325022B publication Critical patent/TWI325022B/zh

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating And Plating Baths Therefor (AREA)

TW095108414A 2005-04-28 2006-03-13 Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution TW200706707A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2005132092		2005-04-28

Publications (2)

Publication Number	Publication Date
TW200706707A true TW200706707A (en)	2007-02-16
TWI325022B TWI325022B (2)	2010-05-21

Family

ID=37307726

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW095108414A TW200706707A (en)	2005-04-28	2006-03-13	Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution

Country Status (4)

Country	Link
JP (1)	JP3878959B2 (2)
KR (1)	KR100934401B1 (2)
TW (1)	TW200706707A (2)
WO (1)	WO2006117920A1 (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN104593835A (zh) *	2015-02-04	2015-05-06	广东羚光新材料股份有限公司	用于片式元器件端电极电镀的中性镀锡液
CN105525312A (zh) *	2015-12-11	2016-04-27	广州市精利表面处理技术有限公司	一种镀锡溶液及其制备方法

Families Citing this family (21)

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JP4632186B2 (ja) *	2007-08-01	2011-02-16	太陽化学工業株式会社	電子部品用錫電解めっき液、電子部品の錫電解めっき方法及び錫電解めっき電子部品
CN101748425B (zh) *	2008-12-05	2014-07-09	宜兴方晶科技有限公司	甲基磺酸亚锡制备方法
JP6127289B2 (ja) *	2012-03-02	2017-05-17	国立大学法人信州大学	リチウムイオン電池用負極材料およびその製造方法
CN103014786B (zh) *	2013-01-22	2016-01-20	广州博泉环保材料科技有限公司	电镀液、其制备方法及应用此电镀液的镀锡工艺
CN104109885B (zh) *	2013-04-22	2017-02-01	广东致卓精密金属科技有限公司	一种弱碱性焦磷酸盐电镀光亮锡溶液及工艺
KR20160094385A (ko)	2013-12-05	2016-08-09	허니웰 인터내셔날 인코포레이티드	조절된 pH를 갖는 주석(II) 메탄술포네이트 용액
US10155894B2 (en)	2014-07-07	2018-12-18	Honeywell International Inc.	Thermal interface material with ion scavenger
CN107250317A (zh)	2014-12-05	2017-10-13	霍尼韦尔国际公司	具有低热阻的高性能热界面材料
US10312177B2 (en)	2015-11-17	2019-06-04	Honeywell International Inc.	Thermal interface materials including a coloring agent
MX393621B (es)	2016-03-08	2025-03-24	Honeywell Int Inc	Material de camibo de fase.
US10501671B2 (en)	2016-07-26	2019-12-10	Honeywell International Inc.	Gel-type thermal interface material
JP6818520B2 (ja) *	2016-11-11	2021-01-20	ローム・アンド・ハース電子材料株式会社	中性スズめっき液を用いたバレルめっきまたは高速回転めっき方法
US11041103B2 (en)	2017-09-08	2021-06-22	Honeywell International Inc.	Silicone-free thermal gel
US10428256B2 (en)	2017-10-23	2019-10-01	Honeywell International Inc.	Releasable thermal gel
US11686007B2 (en) *	2017-12-18	2023-06-27	New Mexico Tech University Research Park Corporation	Tin-indium alloy electroplating solution
US11072706B2 (en)	2018-02-15	2021-07-27	Honeywell International Inc.	Gel-type thermal interface material
US11373921B2 (en)	2019-04-23	2022-06-28	Honeywell International Inc.	Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
JP7598552B2 (ja)	2020-10-02	2024-12-12	メルテックス株式会社	バレルめっき用スズめっき液
CN113430592A (zh) *	2021-06-30	2021-09-24	广东德浩化工新材料有限公司	一种中性镀锡稳定剂及其制备方法
KR102664806B1 (ko) *	2021-11-18	2024-05-10	주식회사 에이엔씨코리아	적층세라믹 콘덴서용 주석도금액
KR20250124510A (ko)	2024-02-13	2025-08-20	한국생산기술연구원	솔더 범프용 주석 도금액

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3858241B2 (ja) *	2002-04-09	2006-12-13	石原薬品株式会社	中性スズメッキ浴を用いたバレルメッキ方法
JP4224698B2 (ja)	2003-10-24	2009-02-18	株式会社村田製作所	めっき浴の作製方法、めっき浴、めっき方法、及び電子部品の製造方法

2006
- 2006-02-22 KR KR1020077024412A patent/KR100934401B1/ko not_active Expired - Lifetime
- 2006-02-22 JP JP2006044722A patent/JP3878959B2/ja not_active Expired - Lifetime
- 2006-02-22 WO PCT/JP2006/303124 patent/WO2006117920A1/ja not_active Ceased
- 2006-03-13 TW TW095108414A patent/TW200706707A/zh not_active IP Right Cessation

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN104593835A (zh) *	2015-02-04	2015-05-06	广东羚光新材料股份有限公司	用于片式元器件端电极电镀的中性镀锡液
CN105525312A (zh) *	2015-12-11	2016-04-27	广州市精利表面处理技术有限公司	一种镀锡溶液及其制备方法
CN105525312B (zh) *	2015-12-11	2017-12-29	广州市精利表面处理技术有限公司	一种镀锡溶液及其制备方法

Also Published As

Publication number	Publication date
KR100934401B1 (ko)	2009-12-29
WO2006117920A1 (ja)	2006-11-09
JP3878959B2 (ja)	2007-02-07
KR20070116654A (ko)	2007-12-10
TWI325022B (2)	2010-05-21
JP2006328528A (ja)	2006-12-07

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Legal Events

Date	Code	Title	Description
2026-04-21	MK4A	Expiration of patent term of an invention patent