TWI325022B - - Google Patents

Download PDF

Info

Publication number
TWI325022B
TWI325022B TW095108414A TW95108414A TWI325022B TW I325022 B TWI325022 B TW I325022B TW 095108414 A TW095108414 A TW 095108414A TW 95108414 A TW95108414 A TW 95108414A TW I325022 B TWI325022 B TW I325022B
Authority
TW
Taiwan
Prior art keywords
tin
plating solution
tin plating
comparative example
acid
Prior art date
Application number
TW095108414A
Other languages
English (en)
Chinese (zh)
Other versions
TW200706707A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW200706707A publication Critical patent/TW200706707A/zh
Application granted granted Critical
Publication of TWI325022B publication Critical patent/TWI325022B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
TW095108414A 2005-04-28 2006-03-13 Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution TW200706707A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005132092 2005-04-28

Publications (2)

Publication Number Publication Date
TW200706707A TW200706707A (en) 2007-02-16
TWI325022B true TWI325022B (2) 2010-05-21

Family

ID=37307726

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095108414A TW200706707A (en) 2005-04-28 2006-03-13 Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution

Country Status (4)

Country Link
JP (1) JP3878959B2 (2)
KR (1) KR100934401B1 (2)
TW (1) TW200706707A (2)
WO (1) WO2006117920A1 (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104109885A (zh) * 2013-04-22 2014-10-22 广东致卓精密金属科技有限公司 一种弱碱性焦磷酸盐电镀光亮锡溶液及工艺

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4632186B2 (ja) * 2007-08-01 2011-02-16 太陽化学工業株式会社 電子部品用錫電解めっき液、電子部品の錫電解めっき方法及び錫電解めっき電子部品
CN101748425B (zh) * 2008-12-05 2014-07-09 宜兴方晶科技有限公司 甲基磺酸亚锡制备方法
JP6127289B2 (ja) * 2012-03-02 2017-05-17 国立大学法人信州大学 リチウムイオン電池用負極材料およびその製造方法
CN103014786B (zh) * 2013-01-22 2016-01-20 广州博泉环保材料科技有限公司 电镀液、其制备方法及应用此电镀液的镀锡工艺
KR20160094385A (ko) 2013-12-05 2016-08-09 허니웰 인터내셔날 인코포레이티드 조절된 pH를 갖는 주석(II) 메탄술포네이트 용액
US10155894B2 (en) 2014-07-07 2018-12-18 Honeywell International Inc. Thermal interface material with ion scavenger
CN107250317A (zh) 2014-12-05 2017-10-13 霍尼韦尔国际公司 具有低热阻的高性能热界面材料
CN104593835B (zh) * 2015-02-04 2017-10-24 广东羚光新材料股份有限公司 用于片式元器件端电极电镀的中性镀锡液
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
CN105525312B (zh) * 2015-12-11 2017-12-29 广州市精利表面处理技术有限公司 一种镀锡溶液及其制备方法
MX393621B (es) 2016-03-08 2025-03-24 Honeywell Int Inc Material de camibo de fase.
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
JP6818520B2 (ja) * 2016-11-11 2021-01-20 ローム・アンド・ハース電子材料株式会社 中性スズめっき液を用いたバレルめっきまたは高速回転めっき方法
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11686007B2 (en) * 2017-12-18 2023-06-27 New Mexico Tech University Research Park Corporation Tin-indium alloy electroplating solution
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
JP7598552B2 (ja) 2020-10-02 2024-12-12 メルテックス株式会社 バレルめっき用スズめっき液
CN113430592A (zh) * 2021-06-30 2021-09-24 广东德浩化工新材料有限公司 一种中性镀锡稳定剂及其制备方法
KR102664806B1 (ko) * 2021-11-18 2024-05-10 주식회사 에이엔씨코리아 적층세라믹 콘덴서용 주석도금액
KR20250124510A (ko) 2024-02-13 2025-08-20 한국생산기술연구원 솔더 범프용 주석 도금액

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3858241B2 (ja) * 2002-04-09 2006-12-13 石原薬品株式会社 中性スズメッキ浴を用いたバレルメッキ方法
JP4224698B2 (ja) 2003-10-24 2009-02-18 株式会社村田製作所 めっき浴の作製方法、めっき浴、めっき方法、及び電子部品の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104109885A (zh) * 2013-04-22 2014-10-22 广东致卓精密金属科技有限公司 一种弱碱性焦磷酸盐电镀光亮锡溶液及工艺
CN104109885B (zh) * 2013-04-22 2017-02-01 广东致卓精密金属科技有限公司 一种弱碱性焦磷酸盐电镀光亮锡溶液及工艺

Also Published As

Publication number Publication date
KR100934401B1 (ko) 2009-12-29
WO2006117920A1 (ja) 2006-11-09
JP3878959B2 (ja) 2007-02-07
KR20070116654A (ko) 2007-12-10
TW200706707A (en) 2007-02-16
JP2006328528A (ja) 2006-12-07

Similar Documents

Publication Publication Date Title
CN102277601B (zh) 含辅助配位剂的无氰镀银电镀液
JP2645701B2 (ja) パラジウム合金めっき組成物、及びめっき方法
KR100934401B1 (ko) 주석 도금액, 그 주석 도금액을 이용한 주석 도금 방법,주석 도금액 조정 방법 및 그 주석 도금액을 이용하여형성된 주석 도금층을 구비한 칩 부품
JPS6254397B2 (2)
CN1703540B (zh) 电沉积青铜的方法
TW200303938A (en) Electroplating solution containing organic acid complexing agent
JP5452458B2 (ja) ニッケルめっき液及びニッケルめっき方法
CN102409372A (zh) 在镍上电镀银触发层的方法
JP4790191B2 (ja) パラジウム又はその合金を電気化学的に析出させるための電解浴
CN108138348A (zh) 用于铟或铟合金沉积的方法和制品
KR101270770B1 (ko) 인쇄회로기판의 도금방법
CN101405435B (zh) 表面具有镀铜覆膜的稀土类永久磁铁的制造方法
CN101815814B (zh) 不使用有毒金属或类似金属由电铸获得黄色金合金沉积物的方法
TW200825213A (en) Gold-silver alloy plating liquid
JPWO2019176049A1 (ja) 電解ロジウムめっき液
JP2009149965A (ja) 銀めっき方法
TWI761212B (zh) 銀/錫電鍍浴及其使用方法
US7785460B2 (en) Method for producing rare earth metal-based permanent magnet having copper plating film on the surface thereof
JP2718793B2 (ja) 光沢錫めっきを有する銅又は銅合金
JP2011208175A (ja) めっき物の製造方法及びめっき物
TW200541417A (en) Pure copper-coated copper foil and method of producing the same, and TAB tape and method of producing the same
JP2905873B1 (ja) すず／亜鉛合金めっき浴及びそれを用いるめっき方法
JPH08337882A (ja) アルミニウム合金用亜鉛置換処理浴
JPH07188974A (ja) 金合金メッキ液
JP2002038293A (ja) 白金めっき液およびそのめっき液を用いためっき方法

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent