TW200714116A - Silicon microphone - Google Patents

Silicon microphone

Info

Publication number
TW200714116A
TW200714116A TW095117331A TW95117331A TW200714116A TW 200714116 A TW200714116 A TW 200714116A TW 095117331 A TW095117331 A TW 095117331A TW 95117331 A TW95117331 A TW 95117331A TW 200714116 A TW200714116 A TW 200714116A
Authority
TW
Taiwan
Prior art keywords
backplate
diaphragm
surrounding area
area
surrounding
Prior art date
Application number
TW095117331A
Other languages
Chinese (zh)
Inventor
Kitt-Wai Kok
Kathirgamasundaram Sooriakumar
Kok-Meng Ong
Bryan Keith Patmon
Original Assignee
Sensfab Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sensfab Pte Ltd filed Critical Sensfab Pte Ltd
Publication of TW200714116A publication Critical patent/TW200714116A/en

Links

Landscapes

  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

A silicon microphone comprising a backplate of electrically conductive or semi- conductive material comprising a rigid aperture area and a surrounding area, a diaphragm of electrically conductive or semi-conductive material comprising a flexible member that extends over the aperture area and a surrounding area that is at least partially connected to, and insulated from , the surrounding area of the backplate, the aperture area of the backplate and flexible member of the diaphragm forming two parallel plates of a capacitor spaced apart by a cavity, a bond pad formed on the surrounding area of the diaphragm, a bond pad formed on the surrounding area of the backplate, a channel formed in the diaphragm surrounding the bond pad formed on the surrounding area of the backplate, at least one air channel formed in the surrounding area of the diaphragm and open into the cavity between the flexible member and the aperture area of the backplate, and at least one vent through the surrounding area of the diaphragm connected to each air channel.
TW095117331A 2005-05-16 2006-05-16 Silicon microphone TW200714116A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG2005003110 2005-05-16

Publications (1)

Publication Number Publication Date
TW200714116A true TW200714116A (en) 2007-04-01

Family

ID=57911463

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095117331A TW200714116A (en) 2005-05-16 2006-05-16 Silicon microphone

Country Status (1)

Country Link
TW (1) TW200714116A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI469912B (en) * 2008-09-25 2015-01-21 United Microelectronics Corp Structure of mems electroacoustic transducer and fabricating method thereof
TWI472235B (en) * 2009-05-29 2015-02-01 Neomems Technologies Inc Wuxi 矽Microphone package
US9783408B2 (en) 2008-09-19 2017-10-10 United Microelectronics Corp. Structure of MEMS electroacoustic transducer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9783408B2 (en) 2008-09-19 2017-10-10 United Microelectronics Corp. Structure of MEMS electroacoustic transducer
TWI469912B (en) * 2008-09-25 2015-01-21 United Microelectronics Corp Structure of mems electroacoustic transducer and fabricating method thereof
TWI472235B (en) * 2009-05-29 2015-02-01 Neomems Technologies Inc Wuxi 矽Microphone package

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