TW200718764A - Adhesive composition, circuit connecting material, connection structure of circuit connectors, and semiconductor devices - Google Patents

Adhesive composition, circuit connecting material, connection structure of circuit connectors, and semiconductor devices

Info

Publication number
TW200718764A
TW200718764A TW095137605A TW95137605A TW200718764A TW 200718764 A TW200718764 A TW 200718764A TW 095137605 A TW095137605 A TW 095137605A TW 95137605 A TW95137605 A TW 95137605A TW 200718764 A TW200718764 A TW 200718764A
Authority
TW
Taiwan
Prior art keywords
circuit
adhesive composition
semiconductor devices
connection structure
connecting material
Prior art date
Application number
TW095137605A
Other languages
English (en)
Chinese (zh)
Other versions
TWI336724B (de
Inventor
Toshiaki Shirasaka
Shigeki Katogi
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200718764A publication Critical patent/TW200718764A/zh
Application granted granted Critical
Publication of TWI336724B publication Critical patent/TWI336724B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07339—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by cooling, e.g. thermoplastics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
TW095137605A 2005-10-18 2006-10-12 Adhesive composition, circuit connecting material, connection structure of circuit connectors, and semiconductor devices TW200718764A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005302944 2005-10-18
JP2006182388 2006-06-30

Publications (2)

Publication Number Publication Date
TW200718764A true TW200718764A (en) 2007-05-16
TWI336724B TWI336724B (de) 2011-02-01

Family

ID=37962289

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095137605A TW200718764A (en) 2005-10-18 2006-10-12 Adhesive composition, circuit connecting material, connection structure of circuit connectors, and semiconductor devices

Country Status (5)

Country Link
JP (1) JPWO2007046190A1 (de)
KR (1) KR101010108B1 (de)
CN (2) CN102277091A (de)
TW (1) TW200718764A (de)
WO (1) WO2007046190A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI870654B (zh) * 2021-03-31 2025-01-21 日商電化股份有限公司 黏接劑組成物、接合體及黏接劑組成物之製造方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101063602B1 (ko) * 2006-08-22 2011-09-07 히다치 가세고교 가부시끼가이샤 회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 구조의 제조 방법
JP2008291199A (ja) * 2007-04-23 2008-12-04 Hitachi Chem Co Ltd 回路接続材料およびそれを用いた接続構造体
CN101675715B (zh) * 2007-05-09 2011-06-08 日立化成工业株式会社 膜状电路连接材料及电路部件的连接结构
US20080292801A1 (en) * 2007-05-23 2008-11-27 National Starch And Chemical Investment Holding Corporation Corrosion-Preventive Adhesive Compositions
JP4978893B2 (ja) * 2007-12-19 2012-07-18 Ｔｄｋ株式会社 固体電解コンデンサ及び固体電解コンデンサの製造方法
WO2013035206A1 (ja) * 2011-09-09 2013-03-14 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 電子装置用シール剤組成物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1135647A (ja) * 1997-07-25 1999-02-09 Hitachi Chem Co Ltd 電子部品封止用成形材料、その成形方法、電子部品装置及びその製造方法
JP2001294557A (ja) * 2000-02-10 2001-10-23 Nippon Shokubai Co Ltd α，β−不飽和カルボン酸エステル類の製法及び該製法に用いる触媒
JP4788036B2 (ja) * 2000-11-29 2011-10-05 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
JP4852785B2 (ja) * 2000-11-29 2012-01-11 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
JP4752107B2 (ja) * 2000-11-29 2011-08-17 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
KR100780136B1 (ko) * 2002-11-29 2007-11-28 히다치 가세고교 가부시끼가이샤 접착제조성물
JP4720073B2 (ja) * 2003-08-07 2011-07-13 日立化成工業株式会社 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置
JP4466650B2 (ja) * 2004-06-09 2010-05-26 日立化成工業株式会社 フィルム状接着剤、フィルム状回路接続材、回路部材の接続方法及び半導体装置
JP5236144B2 (ja) * 2004-08-09 2013-07-17 日立化成株式会社 接着剤組成物、回路接続構造体及び半導体装置
JP4760070B2 (ja) * 2005-03-16 2011-08-31 日立化成工業株式会社 接着剤、回路接続用接着剤、接続体及び半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI870654B (zh) * 2021-03-31 2025-01-21 日商電化股份有限公司 黏接劑組成物、接合體及黏接劑組成物之製造方法

Also Published As

Publication number Publication date
JPWO2007046190A1 (ja) 2009-04-23
TWI336724B (de) 2011-02-01
KR101010108B1 (ko) 2011-01-24
CN102277091A (zh) 2011-12-14
WO2007046190A1 (ja) 2007-04-26
KR20080068865A (ko) 2008-07-24
CN102222649A (zh) 2011-10-19

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees