TW200720681A - Electronic component test apparatus and temperature control method in electronic component test apparatus - Google Patents

Electronic component test apparatus and temperature control method in electronic component test apparatus

Info

Publication number
TW200720681A
TW200720681A TW095130792A TW95130792A TW200720681A TW 200720681 A TW200720681 A TW 200720681A TW 095130792 A TW095130792 A TW 095130792A TW 95130792 A TW95130792 A TW 95130792A TW 200720681 A TW200720681 A TW 200720681A
Authority
TW
Taiwan
Prior art keywords
electronic component
test apparatus
component test
temperature
control method
Prior art date
Application number
TW095130792A
Other languages
English (en)
Other versions
TWI300485B (zh
Inventor
Shigeru Hosoda
Masaaki Ogawa
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200720681A publication Critical patent/TW200720681A/zh
Application granted granted Critical
Publication of TWI300485B publication Critical patent/TWI300485B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0458—Details related to environmental aspects, e.g. temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW095130792A 2005-08-25 2006-08-22 Electronic component test apparatus and temperature control method in electronic component test apparatus TW200720681A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/015481 WO2007023557A1 (ja) 2005-08-25 2005-08-25 電子部品試験装置および電子部品試験装置における温度制御方法

Publications (2)

Publication Number Publication Date
TW200720681A true TW200720681A (en) 2007-06-01
TWI300485B TWI300485B (zh) 2008-09-01

Family

ID=37771315

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095130792A TW200720681A (en) 2005-08-25 2006-08-22 Electronic component test apparatus and temperature control method in electronic component test apparatus

Country Status (6)

Country Link
US (1) US7768286B2 (zh)
JP (1) JPWO2007023557A1 (zh)
KR (1) KR100930657B1 (zh)
CN (1) CN101248361A (zh)
TW (1) TW200720681A (zh)
WO (1) WO2007023557A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI603172B (zh) * 2015-10-26 2017-10-21 陽榮科技股份有限公司 Ic溫控裝置及方法
TWI815203B (zh) * 2020-11-30 2023-09-11 日商阿德潘鐵斯特股份有限公司 電子部件處理裝置、電子部件測試裝置及電子部件測試方法

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US7969175B2 (en) * 2009-05-07 2011-06-28 Aehr Test Systems Separate test electronics and blower modules in an apparatus for testing an integrated circuit
JPWO2011007419A1 (ja) * 2009-07-14 2012-12-20 株式会社アドバンテスト 電子部品押圧装置、電子部品試験装置及びインタフェース装置
JP5601863B2 (ja) * 2010-03-29 2014-10-08 三菱電機株式会社 電力半導体装置
US8854069B2 (en) * 2011-01-05 2014-10-07 Texas Instruments Incorporated Production integrated circuit test handler using microcontroller reading a thermal diode of a device under test for temperature control
JP6067705B2 (ja) * 2011-08-17 2017-01-25 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 多重ヒータ配列の温度監視及び制御のためのシステムと方法
JP5758790B2 (ja) * 2011-12-14 2015-08-05 Ｎｅｃフィールディング株式会社 ストレステストシステムおよびその方法、ストレステスト制御装置およびその制御方法と制御プログラム、冷却加熱装置、および、テストプログラム
KR20140080750A (ko) * 2012-12-14 2014-07-01 한국전자통신연구원 반도체 소자 테스트 장치
US9470720B2 (en) * 2013-03-08 2016-10-18 Sandisk Technologies Llc Test system with localized heating and method of manufacture thereof
US10914635B2 (en) 2014-09-29 2021-02-09 Rosemount Inc. Wireless industrial process monitor
JP2016188782A (ja) * 2015-03-30 2016-11-04 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
JP6426552B2 (ja) * 2015-07-29 2018-11-21 日立オートモティブシステムズ株式会社 バーンイン試験装置及び方法
CN105157865B (zh) * 2015-08-17 2017-07-11 济南晶恒电子有限责任公司 二极管的热焊接试验台及试验方法
KR102175798B1 (ko) * 2015-11-13 2020-11-06 주식회사 아이에스시 인터페이스 모듈 및 이를 포함하는 반도체 소자 테스트 장치
JP5916025B1 (ja) * 2015-12-11 2016-05-11 上野精機株式会社 電気特性テスト装置
KR102478111B1 (ko) * 2016-07-27 2022-12-14 삼성전자주식회사 테스트 장치
US10479495B2 (en) * 2016-08-10 2019-11-19 Bell Helicopter Textron Inc. Aircraft tail with cross-flow fan systems
US10514416B2 (en) * 2017-09-29 2019-12-24 Advantest Corporation Electronic component handling apparatus and electronic component testing apparatus
CN110618370B (zh) * 2018-06-04 2022-02-01 苏州能讯高能半导体有限公司 测试装置
JP7143134B2 (ja) * 2018-07-26 2022-09-28 株式会社アドバンテスト ロードボード及び電子部品試験装置
JP6719784B2 (ja) 2018-12-21 2020-07-08 株式会社 Ｓｙｎａｘ ハンドラ
JP6770758B2 (ja) 2019-01-15 2020-10-21 株式会社 Ｓｙｎａｘ コンタクタおよびハンドラ
CN111951878A (zh) * 2019-05-16 2020-11-17 第一检测有限公司 检测设备、芯片承载装置及电连接单元
CN113182198B (zh) * 2020-01-14 2023-08-29 鸿劲精密股份有限公司 具温控单元的测试装置及其应用的测试分类设备
KR102295435B1 (ko) 2020-03-12 2021-08-31 에이엠티 주식회사 미세 피치를 갖는 디바이스의 얼라인 및 테스트장치 그리고 디바이스의 얼라인방법
TWI787937B (zh) * 2020-08-04 2022-12-21 日商愛德萬測試股份有限公司 使用附加信號來測試被測元件的自動化測試設備、處理器、測試單元和方法
US11573267B1 (en) * 2021-11-12 2023-02-07 Advantest Corporation Electronic component handling apparatus and electronic component testing apparatus
CN114442694B (zh) * 2021-12-31 2023-03-21 重庆长安新能源汽车科技有限公司 一种自校准的碳化硅电机控制器结温估算方法
JP2023116053A (ja) * 2022-02-09 2023-08-22 株式会社アドバンテスト 電子部品ハンドリング装置、及び、電子部品試験装置

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JPH0964128A (ja) * 1995-08-28 1997-03-07 Hitachi Ltd バーンイン方法および装置
JP3784884B2 (ja) * 1996-05-15 2006-06-14 エスペック株式会社 試料実測式環境試験装置
JPH09312359A (ja) * 1996-05-22 1997-12-02 Nec Gumma Ltd 半導体集積回路の内部温度測定方法ならびにこれを用い た半導体集積回路の冷却方法および冷却装置
JP2000035462A (ja) * 1998-07-16 2000-02-02 Advantest Corp 半導体試験装置
SG98373A1 (en) * 1998-11-25 2003-09-19 Advantest Corp Device testing apparatus
JP4054473B2 (ja) * 1999-02-22 2008-02-27 株式会社アドバンテスト 電子部品試験装置および電子部品の試験方法
JP3700505B2 (ja) * 1999-12-07 2005-09-28 セイコーエプソン株式会社 Ｉｃハンドラー
WO2003075025A1 (en) * 2002-03-07 2003-09-12 Advantest Corporation Electronic component testing apparatus
JP4086613B2 (ja) * 2002-10-09 2008-05-14 Ｎｅｃエレクトロニクス株式会社 半導体装置および内部温度測定方法
JP2004245756A (ja) * 2003-02-17 2004-09-02 Alps Electric Co Ltd ジャンクション温度の推定方法
US7345495B2 (en) * 2004-06-30 2008-03-18 Intel Corporation Temperature and voltage controlled integrated circuit processes

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI603172B (zh) * 2015-10-26 2017-10-21 陽榮科技股份有限公司 Ic溫控裝置及方法
TWI815203B (zh) * 2020-11-30 2023-09-11 日商阿德潘鐵斯特股份有限公司 電子部件處理裝置、電子部件測試裝置及電子部件測試方法
US12276693B2 (en) 2020-11-30 2025-04-15 Advantest Corporation Electronic component handling apparatus, electronic component testing apparatus, electronic component testing method

Also Published As

Publication number Publication date
US20090051381A1 (en) 2009-02-26
KR100930657B1 (ko) 2009-12-09
WO2007023557A1 (ja) 2007-03-01
KR20080040016A (ko) 2008-05-07
JPWO2007023557A1 (ja) 2009-02-26
CN101248361A (zh) 2008-08-20
US7768286B2 (en) 2010-08-03
TWI300485B (zh) 2008-09-01

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