TW200724657A - Abrasive particulate material, and method of planarizing a workpiece using the abrasive particulate material - Google Patents

Abrasive particulate material, and method of planarizing a workpiece using the abrasive particulate material

Info

Publication number
TW200724657A
TW200724657A TW095137814A TW95137814A TW200724657A TW 200724657 A TW200724657 A TW 200724657A TW 095137814 A TW095137814 A TW 095137814A TW 95137814 A TW95137814 A TW 95137814A TW 200724657 A TW200724657 A TW 200724657A
Authority
TW
Taiwan
Prior art keywords
particulate material
abrasive particulate
planarizing
workpiece
abrasive
Prior art date
Application number
TW095137814A
Other languages
English (en)
Other versions
TWI308928B (en
Inventor
Jun Wang
Andrew G Haerle
Original Assignee
Saint Gobain Ceramics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Ceramics filed Critical Saint Gobain Ceramics
Publication of TW200724657A publication Critical patent/TW200724657A/zh
Application granted granted Critical
Publication of TWI308928B publication Critical patent/TWI308928B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F7/00—Compounds of aluminium
    • C01F7/02—Aluminium oxide; Aluminium hydroxide; Aluminates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/02—Amorphous compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/10—Particle morphology extending in one dimension, e.g. needle-like
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/20—Particle morphology extending in two dimensions, e.g. plate-like
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/54—Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/10—Solid density
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Geology (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW095137814A 2005-10-14 2006-10-13 Abrasive particulate material, and method of planarizing a workpiece using the abrasive particulate material TWI308928B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/251,633 US8685123B2 (en) 2005-10-14 2005-10-14 Abrasive particulate material, and method of planarizing a workpiece using the abrasive particulate material

Publications (2)

Publication Number Publication Date
TW200724657A true TW200724657A (en) 2007-07-01
TWI308928B TWI308928B (en) 2009-04-21

Family

ID=37722443

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095137814A TWI308928B (en) 2005-10-14 2006-10-13 Abrasive particulate material, and method of planarizing a workpiece using the abrasive particulate material

Country Status (18)

Country Link
US (1) US8685123B2 (zh)
EP (1) EP1934300B1 (zh)
JP (1) JP5384938B2 (zh)
KR (1) KR101120417B1 (zh)
CN (1) CN101370896B (zh)
AT (1) ATE555179T1 (zh)
AU (1) AU2006304356B2 (zh)
BR (1) BRPI0617413A2 (zh)
CA (1) CA2625273C (zh)
IL (1) IL190737A0 (zh)
MY (1) MY145461A (zh)
NO (1) NO20082195L (zh)
NZ (1) NZ567318A (zh)
RU (1) RU2401856C2 (zh)
TW (1) TWI308928B (zh)
UA (1) UA87938C2 (zh)
WO (1) WO2007047547A2 (zh)
ZA (1) ZA200803185B (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8685123B2 (en) 2005-10-14 2014-04-01 Saint-Gobain Ceramics & Plastics, Inc. Abrasive particulate material, and method of planarizing a workpiece using the abrasive particulate material
US20070287004A1 (en) * 2006-05-25 2007-12-13 Gottzmann Andreas M Laminate and Method of Manufacture
FR2906800B1 (fr) * 2006-10-09 2008-11-28 Rhodia Recherches & Tech Suspension liquide et poudre de particules d'oxyde de cerium, procedes de preparation de celles-ci et utilisation dans le polissage
US7837888B2 (en) * 2006-11-13 2010-11-23 Cabot Microelectronics Corporation Composition and method for damascene CMP
KR20100125339A (ko) * 2008-03-03 2010-11-30 유니버시티 오브 플로리다 리서치 파운데이션, 인크. 나노입자 졸-겔 복합 혼성 투명 코팅 물질
WO2009151120A1 (ja) * 2008-06-13 2009-12-17 株式会社 フジミインコーポレーテッド アルミニウム酸化物粒子及びそれを含有する研磨用組成物
US8382016B2 (en) * 2009-02-25 2013-02-26 Thiele Kaolin Company Nano particle mineral pigment
CN102348535B (zh) * 2009-03-11 2015-01-14 圣戈班磨料磨具有限公司 包含具有改进形状的熔凝的氧化锆氧化铝颗粒的磨料物品
KR20140000496A (ko) * 2012-06-22 2014-01-03 에스케이하이닉스 주식회사 연마 조성물, 이의 제조 방법 및 이를 이용한 화학적 기계적 연마 방법
KR101889698B1 (ko) 2013-09-30 2018-08-21 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 형상화 연마입자 및 이의 형성 방법
CN104726061A (zh) * 2013-12-19 2015-06-24 3M创新有限公司 磨料、研磨件及其制备方法
CN103952084B (zh) * 2014-04-29 2016-03-23 德米特（苏州）电子环保材料有限公司 一种氧化铝基质的金属抛光液的制备方法
JP6233296B2 (ja) * 2014-12-26 2017-11-22 株式会社Sumco 砥粒の評価方法、および、シリコンウェーハの製造方法
JP6803176B2 (ja) * 2016-08-26 2020-12-23 一般財団法人ファインセラミックスセンター 多孔質アルミナ粒子材料の製造方法
WO2021049154A1 (ja) * 2019-09-11 2021-03-18 株式会社フジミインコーポレーテッド 研磨用組成物およびこれを用いた研磨方法
KR102261151B1 (ko) 2020-02-27 2021-06-07 비드오리진(주) 표면 돌기가 형성된 구형 무기 입자 및 그 제조 방법
EP4314179A4 (en) * 2021-03-29 2025-06-18 Entegris, Inc. Suspension for chemical mechanical planarization (cmp) and method employing the same
JP7638349B1 (ja) * 2023-10-26 2025-03-03 株式会社トッパンインフォメディア 研磨スラリー

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US4835124A (en) * 1985-09-30 1989-05-30 Aluminum Company Of America Alumina ceramic product from colloidal alumina
US5302368A (en) * 1987-01-29 1994-04-12 Sumitomo Chemical Company, Limited Process for preparation of alumina
US4797139A (en) * 1987-08-11 1989-01-10 Norton Company Boehmite produced by a seeded hydyothermal process and ceramic bodies produced therefrom
JPH04193712A (ja) 1990-11-26 1992-07-13 Sumitomo Chem Co Ltd 遷移アルミナおよびその製造方法
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Also Published As

Publication number Publication date
AU2006304356B2 (en) 2010-07-01
WO2007047547A2 (en) 2007-04-26
RU2008114107A (ru) 2009-11-20
IL190737A0 (en) 2008-11-03
BRPI0617413A2 (pt) 2011-07-26
JP5384938B2 (ja) 2014-01-08
EP1934300B1 (en) 2012-04-25
US8685123B2 (en) 2014-04-01
UA87938C2 (ru) 2009-08-25
US20070084134A1 (en) 2007-04-19
KR20080066799A (ko) 2008-07-16
TWI308928B (en) 2009-04-21
WO2007047547A3 (en) 2007-06-14
CN101370896B (zh) 2012-10-17
ZA200803185B (en) 2009-01-28
JP2009511719A (ja) 2009-03-19
EP1934300A2 (en) 2008-06-25
ATE555179T1 (de) 2012-05-15
MY145461A (en) 2012-02-15
AU2006304356A1 (en) 2007-04-26
RU2401856C2 (ru) 2010-10-20
KR101120417B1 (ko) 2012-03-16
NZ567318A (en) 2011-06-30
CA2625273A1 (en) 2007-04-26
CN101370896A (zh) 2009-02-18
NO20082195L (no) 2008-07-03
CA2625273C (en) 2011-08-23

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