TW200729331A - Vacuum processing device - Google Patents

Vacuum processing device

Info

Publication number
TW200729331A
TW200729331A TW095132459A TW95132459A TW200729331A TW 200729331 A TW200729331 A TW 200729331A TW 095132459 A TW095132459 A TW 095132459A TW 95132459 A TW95132459 A TW 95132459A TW 200729331 A TW200729331 A TW 200729331A
Authority
TW
Taiwan
Prior art keywords
vacuum processing
load lock
processing device
lock chamber
chamber
Prior art date
Application number
TW095132459A
Other languages
English (en)
Other versions
TWI398921B (zh
Inventor
Akihiko Shimura
Hiroshi Kondo
Yuki Nabeyama
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200729331A publication Critical patent/TW200729331A/zh
Application granted granted Critical
Publication of TWI398921B publication Critical patent/TWI398921B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover

Landscapes

  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
TW095132459A 2005-09-02 2006-09-01 Vacuum processing device and exhaust preparation method of vacuum preparation room TWI398921B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005255293A JP5078243B2 (ja) 2005-09-02 2005-09-02 真空処理装置および真空予備室の排気方法

Publications (2)

Publication Number Publication Date
TW200729331A true TW200729331A (en) 2007-08-01
TWI398921B TWI398921B (zh) 2013-06-11

Family

ID=37817678

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132459A TWI398921B (zh) 2005-09-02 2006-09-01 Vacuum processing device and exhaust preparation method of vacuum preparation room

Country Status (4)

Country Link
JP (1) JP5078243B2 (zh)
KR (1) KR100810804B1 (zh)
CN (2) CN100463105C (zh)
TW (1) TWI398921B (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4965358B2 (ja) * 2007-06-25 2012-07-04 大日本スクリーン製造株式会社 基板処理装置
JP5322254B2 (ja) * 2007-06-29 2013-10-23 東京エレクトロン株式会社 真空処理装置及び真空処理方法並びに記憶媒体
JP5028193B2 (ja) * 2007-09-05 2012-09-19 株式会社日立ハイテクノロジーズ 半導体製造装置における被処理体の搬送方法
JP5005512B2 (ja) * 2007-11-07 2012-08-22 東京エレクトロン株式会社 ゲートバルブ装置および真空処理装置およびゲートバルブ装置における弁体の開放方法。
JP5059583B2 (ja) * 2007-12-26 2012-10-24 東京エレクトロン株式会社 真空装置、真空処理システムおよび真空室の圧力制御方法
JP5123820B2 (ja) 2008-10-27 2013-01-23 東京エレクトロン株式会社 基板処理装置の真空排気方法及び基板処理装置
KR200473996Y1 (ko) * 2008-12-22 2014-08-13 주식회사 테스 슬릿밸브
JP5546395B2 (ja) * 2010-09-07 2014-07-09 キヤノン株式会社 堆積膜形成方法及び堆積膜形成装置
GB2492065A (en) 2011-06-16 2012-12-26 Edwards Ltd Noise reduction of a vacuum pumping system
CN102842637A (zh) * 2011-06-20 2012-12-26 理想能源设备(上海)有限公司 衬底处理装置和衬底处理方法
CN104928645A (zh) * 2015-04-07 2015-09-23 凌嘉科技股份有限公司 双门闸阀装置及具双门闸阀装置的镀膜设备
JP2017112237A (ja) * 2015-12-17 2017-06-22 株式会社ディスコ 減圧処理装置
TWI840362B (zh) 2018-06-04 2024-05-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 水氣降低的晶圓處置腔室
JP7365878B2 (ja) * 2019-12-06 2023-10-20 東京エレクトロン株式会社 計測装置及び計測方法
KR102939769B1 (ko) * 2020-05-27 2026-03-16 삼성디스플레이 주식회사 증착 장치 및 증착 방법
JP7378357B2 (ja) * 2020-06-17 2023-11-13 東京エレクトロン株式会社 基板処理装置およびガス供給配管のパージ方法
KR20230001280A (ko) * 2021-06-28 2023-01-04 주식회사 원익아이피에스 챔버내부처리방법 및 기판처리방법
CN116624651A (zh) * 2022-02-10 2023-08-22 长鑫存储技术有限公司 一种气压平衡阀、气压平衡方法以及负载锁定室
US12281723B2 (en) 2022-02-10 2025-04-22 Changxin Memory Technologies, Inc. Gas pressure balance valve, gas pressure balance method, and load locking chamber
WO2025009345A1 (ja) * 2023-07-05 2025-01-09 東京エレクトロン株式会社 プラズマ処理システム、基板処理システムおよびゲートバルブユニット

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2939378B2 (ja) * 1991-11-21 1999-08-25 東京エレクトロン株式会社 真空処理装置
JP2598353B2 (ja) * 1991-12-04 1997-04-09 アネルバ株式会社 基板処理装置、基板搬送装置及び基板交換方法
JP3154144B2 (ja) * 1992-09-21 2001-04-09 ソニー株式会社 チャンバー内の圧力変化方法及び圧力変化されるチャンバーを備えた装置
US5738767A (en) * 1994-01-11 1998-04-14 Intevac, Inc. Substrate handling and processing system for flat panel displays
JPH08335572A (ja) * 1995-06-07 1996-12-17 Hitachi Ltd 半導体製造装置
JP3297632B2 (ja) * 1997-09-20 2002-07-02 松下電器産業株式会社 Ｃｄｍａ端末装置
JP3111994B2 (ja) * 1998-08-03 2000-11-27 日本電気株式会社 金属酸化物誘電体材料の気相成長装置
JP4312965B2 (ja) * 1999-01-12 2009-08-12 東京エレクトロン株式会社 真空処理装置
US6267545B1 (en) * 1999-03-29 2001-07-31 Lam Research Corporation Semiconductor processing platform architecture having processing module isolation capabilities
US6095741A (en) * 1999-03-29 2000-08-01 Lam Research Corporation Dual sided slot valve and method for implementing the same
JP2002110560A (ja) * 2000-09-29 2002-04-12 Hitachi Kokusai Electric Inc 半導体製造装置
JP4841035B2 (ja) * 2000-11-27 2011-12-21 東京エレクトロン株式会社 真空処理装置
JP2002329763A (ja) * 2001-04-27 2002-11-15 Yaskawa Electric Corp 気密室間の連結構造
JP2004087781A (ja) * 2002-08-27 2004-03-18 Ulvac Japan Ltd 真空処理装置及び真空処理方法
JP2004119595A (ja) * 2002-09-25 2004-04-15 Sharp Corp 真空チャンバーの減圧方法および真空チャンバーの減圧装置
JP2004241566A (ja) * 2003-02-05 2004-08-26 Hitachi Kokusai Electric Inc 基板処理装置
JP4319434B2 (ja) * 2003-03-11 2009-08-26 東京エレクトロン株式会社 ゲートバルブ及び真空容器
JP2005116854A (ja) * 2003-10-09 2005-04-28 Canon Inc ロードロックチャンバー、露光装置、デバイスの製造方法

Also Published As

Publication number Publication date
TWI398921B (zh) 2013-06-11
CN1925110A (zh) 2007-03-07
KR20070026241A (ko) 2007-03-08
JP2007073541A (ja) 2007-03-22
JP5078243B2 (ja) 2012-11-21
CN101441995A (zh) 2009-05-27
KR100810804B1 (ko) 2008-03-06
CN100463105C (zh) 2009-02-18
CN101441995B (zh) 2013-09-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees