TW200732507A - Apparatus and method for agitating liquids in wet chemical processing of microfeature workpieces - Google Patents
Apparatus and method for agitating liquids in wet chemical processing of microfeature workpiecesInfo
- Publication number
- TW200732507A TW200732507A TW095143353A TW95143353A TW200732507A TW 200732507 A TW200732507 A TW 200732507A TW 095143353 A TW095143353 A TW 095143353A TW 95143353 A TW95143353 A TW 95143353A TW 200732507 A TW200732507 A TW 200732507A
- Authority
- TW
- Taiwan
- Prior art keywords
- agitators
- reactors
- workpiece
- wet chemical
- microfeature workpieces
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 238000012993 chemical processing Methods 0.000 title 1
- 239000007788 liquid Substances 0.000 title 1
- 239000012530 fluid Substances 0.000 abstract 2
- 238000004140 cleaning Methods 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 230000005684 electric field Effects 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000007704 wet chemistry method Methods 0.000 abstract 1
Landscapes
- Weting (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Reactors with agitators and methods for processing microfeature workpieces with such reactors. The agitators are capable of obtaining high, controlled mass-transfer rates that result in high quality surfaces and efficient wet chemical processes. The agitators generate high flow velocities in the fluid and contain the high energy fluid proximate to the surface of the workpiece to form high quality surfaces when cleaning, etching and/or depositing materials to/from a workpiece. The agitators also have short stroke lengths so that the footprints of the reactors are relatively small. As a result, the reactors are efficient and cost effective to operate. The agitators are also designed so that electrical fields in the processing solution can effectively operate at the surface of the workpiece.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US73934305P | 2005-11-23 | 2005-11-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200732507A true TW200732507A (en) | 2007-09-01 |
| TWI415968B TWI415968B (en) | 2013-11-21 |
Family
ID=49990909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95143353A TWI415968B (en) | 2005-11-23 | 2006-11-23 | Apparatus and method for agitating liquids in wet chemical processing of microfeature workpieces |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI415968B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI512814B (en) * | 2009-03-27 | 2015-12-11 | 阿奇默公司 | Apparatus and method for performing electrochemical reaction on the surface of a semiconductor substrate |
| CN107012489A (en) * | 2016-01-06 | 2017-08-04 | 应用材料公司 | System and method for covering workpiece features during electrochemical deposition |
| TWI677928B (en) * | 2014-05-26 | 2019-11-21 | 日商荏原製作所股份有限公司 | Substrate electrolytic processing apparatus and paddle for use in such substrate electrolytic processing apparatus |
| CN116377548A (en) * | 2023-06-02 | 2023-07-04 | 苏州尊恒半导体科技有限公司 | Uniform electroplating equipment for wafer |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10227706B2 (en) * | 2015-07-22 | 2019-03-12 | Applied Materials, Inc. | Electroplating apparatus with electrolyte agitation |
| US10240248B2 (en) * | 2015-08-18 | 2019-03-26 | Applied Materials, Inc. | Adaptive electric field shielding in an electroplating processor using agitator geometry and motion control |
| CN106793499B (en) * | 2015-11-23 | 2019-07-16 | 宇宙电路板设备(深圳)有限公司 | Printed circuit board wet-chemical treatment equipment and printed circuit board Wet chemical processing method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6034210A (en) * | 1997-02-18 | 2000-03-07 | Kashima Oil Co., Ltd. | Process for producing highly reactive modified phenolic resin and molding material |
| US7204917B2 (en) * | 1998-12-01 | 2007-04-17 | Novellus Systems, Inc. | Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same |
| US6916412B2 (en) * | 1999-04-13 | 2005-07-12 | Semitool, Inc. | Adaptable electrochemical processing chamber |
| TWI240763B (en) * | 2001-05-16 | 2005-10-01 | Ind Tech Res Inst | Liquid phase deposition production method and device |
| TW200502429A (en) * | 2003-07-01 | 2005-01-16 | Dcr Internat Environmental Services B V | Process for reductive deposition on a metal surface |
| US7722747B2 (en) * | 2003-10-22 | 2010-05-25 | Nexx Systems, Inc. | Method and apparatus for fluid processing a workpiece |
-
2006
- 2006-11-23 TW TW95143353A patent/TWI415968B/en active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI512814B (en) * | 2009-03-27 | 2015-12-11 | 阿奇默公司 | Apparatus and method for performing electrochemical reaction on the surface of a semiconductor substrate |
| TWI677928B (en) * | 2014-05-26 | 2019-11-21 | 日商荏原製作所股份有限公司 | Substrate electrolytic processing apparatus and paddle for use in such substrate electrolytic processing apparatus |
| CN107012489A (en) * | 2016-01-06 | 2017-08-04 | 应用材料公司 | System and method for covering workpiece features during electrochemical deposition |
| US11987897B2 (en) | 2016-01-06 | 2024-05-21 | Applied Materials, Inc. | Systems and methods for shielding features of a workpiece during electrochemical deposition |
| CN116377548A (en) * | 2023-06-02 | 2023-07-04 | 苏州尊恒半导体科技有限公司 | Uniform electroplating equipment for wafer |
| CN116377548B (en) * | 2023-06-02 | 2023-08-22 | 苏州尊恒半导体科技有限公司 | Uniform electroplating equipment for wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI415968B (en) | 2013-11-21 |
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