TW200733294A - Tool for picking up, placing down or pressing on a flat object, and use of the tool - Google Patents

Tool for picking up, placing down or pressing on a flat object, and use of the tool

Info

Publication number
TW200733294A
TW200733294A TW095148166A TW95148166A TW200733294A TW 200733294 A TW200733294 A TW 200733294A TW 095148166 A TW095148166 A TW 095148166A TW 95148166 A TW95148166 A TW 95148166A TW 200733294 A TW200733294 A TW 200733294A
Authority
TW
Taiwan
Prior art keywords
tool
picking
pressing
flat object
shaft
Prior art date
Application number
TW095148166A
Other languages
English (en)
Chinese (zh)
Inventor
Johannes Schuster
Jochen Koehler
Original Assignee
Alphasem Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alphasem Gmbh filed Critical Alphasem Gmbh
Publication of TW200733294A publication Critical patent/TW200733294A/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0442Apparatus for placing on an insulating substrate, e.g. tape
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Wire Bonding (AREA)
  • Hand Tools For Fitting Together And Separating, Or Other Hand Tools (AREA)
TW095148166A 2005-12-23 2006-12-21 Tool for picking up, placing down or pressing on a flat object, and use of the tool TW200733294A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2005/057149 WO2007079769A1 (de) 2005-12-23 2005-12-23 Werkzeug zum aufnehmen, absetzen oder anpressen eines flächigen objektes und verwendung des werkzeugs

Publications (1)

Publication Number Publication Date
TW200733294A true TW200733294A (en) 2007-09-01

Family

ID=35840253

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095148166A TW200733294A (en) 2005-12-23 2006-12-21 Tool for picking up, placing down or pressing on a flat object, and use of the tool

Country Status (3)

Country Link
CH (1) CH697496B1 (de)
TW (1) TW200733294A (de)
WO (1) WO2007079769A1 (de)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59117231A (ja) * 1982-12-24 1984-07-06 Hitachi Yonezawa Denshi Kk 平面合せ機構
US4875614A (en) * 1988-10-31 1989-10-24 International Business Machines Corporation Alignment device
JPH0354836A (ja) * 1989-07-21 1991-03-08 Fujitsu Ltd 吸着ヘッド
JP2841915B2 (ja) * 1991-05-07 1998-12-24 富士通株式会社 ペースト塗布装置
JPH07226430A (ja) * 1994-02-10 1995-08-22 Sony Corp ダイボンダにおける移送コレットの支持装置
JPH1022306A (ja) * 1996-06-28 1998-01-23 Hitachi Ltd ダイボンディング装置
JPH1056027A (ja) * 1996-08-09 1998-02-24 Furukawa Electric Co Ltd:The 素子接合装置
DE19747579C1 (de) * 1997-10-28 1999-02-25 Siemens Ag Vorrichtung zum Auftragen eines viskosen Fluids und Verfahren zum Aufbringen von Lotkugeln auf ein Halbleiter-Bauelement
US7182118B2 (en) * 2003-06-02 2007-02-27 Asm Assembly Automation Ltd. Pick and place assembly for transporting a film of material

Also Published As

Publication number Publication date
WO2007079769A1 (de) 2007-07-19
CH697496B1 (de) 2008-11-14

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