TW200733294A - Tool for picking up, placing down or pressing on a flat object, and use of the tool - Google Patents
Tool for picking up, placing down or pressing on a flat object, and use of the toolInfo
- Publication number
- TW200733294A TW200733294A TW095148166A TW95148166A TW200733294A TW 200733294 A TW200733294 A TW 200733294A TW 095148166 A TW095148166 A TW 095148166A TW 95148166 A TW95148166 A TW 95148166A TW 200733294 A TW200733294 A TW 200733294A
- Authority
- TW
- Taiwan
- Prior art keywords
- tool
- picking
- pressing
- flat object
- shaft
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
Landscapes
- Wire Bonding (AREA)
- Hand Tools For Fitting Together And Separating, Or Other Hand Tools (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2005/057149 WO2007079769A1 (de) | 2005-12-23 | 2005-12-23 | Werkzeug zum aufnehmen, absetzen oder anpressen eines flächigen objektes und verwendung des werkzeugs |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200733294A true TW200733294A (en) | 2007-09-01 |
Family
ID=35840253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095148166A TW200733294A (en) | 2005-12-23 | 2006-12-21 | Tool for picking up, placing down or pressing on a flat object, and use of the tool |
Country Status (3)
| Country | Link |
|---|---|
| CH (1) | CH697496B1 (de) |
| TW (1) | TW200733294A (de) |
| WO (1) | WO2007079769A1 (de) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59117231A (ja) * | 1982-12-24 | 1984-07-06 | Hitachi Yonezawa Denshi Kk | 平面合せ機構 |
| US4875614A (en) * | 1988-10-31 | 1989-10-24 | International Business Machines Corporation | Alignment device |
| JPH0354836A (ja) * | 1989-07-21 | 1991-03-08 | Fujitsu Ltd | 吸着ヘッド |
| JP2841915B2 (ja) * | 1991-05-07 | 1998-12-24 | 富士通株式会社 | ペースト塗布装置 |
| JPH07226430A (ja) * | 1994-02-10 | 1995-08-22 | Sony Corp | ダイボンダにおける移送コレットの支持装置 |
| JPH1022306A (ja) * | 1996-06-28 | 1998-01-23 | Hitachi Ltd | ダイボンディング装置 |
| JPH1056027A (ja) * | 1996-08-09 | 1998-02-24 | Furukawa Electric Co Ltd:The | 素子接合装置 |
| DE19747579C1 (de) * | 1997-10-28 | 1999-02-25 | Siemens Ag | Vorrichtung zum Auftragen eines viskosen Fluids und Verfahren zum Aufbringen von Lotkugeln auf ein Halbleiter-Bauelement |
| US7182118B2 (en) * | 2003-06-02 | 2007-02-27 | Asm Assembly Automation Ltd. | Pick and place assembly for transporting a film of material |
-
2005
- 2005-12-23 CH CH01303/07A patent/CH697496B1/de not_active IP Right Cessation
- 2005-12-23 WO PCT/EP2005/057149 patent/WO2007079769A1/de not_active Ceased
-
2006
- 2006-12-21 TW TW095148166A patent/TW200733294A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007079769A1 (de) | 2007-07-19 |
| CH697496B1 (de) | 2008-11-14 |
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