TW200736372A - Chemical mechanical polishing composition - Google Patents

Chemical mechanical polishing composition

Info

Publication number
TW200736372A
TW200736372A TW095108960A TW95108960A TW200736372A TW 200736372 A TW200736372 A TW 200736372A TW 095108960 A TW095108960 A TW 095108960A TW 95108960 A TW95108960 A TW 95108960A TW 200736372 A TW200736372 A TW 200736372A
Authority
TW
Taiwan
Prior art keywords
metal
chemical mechanical
mechanical polishing
polishing composition
group
Prior art date
Application number
TW095108960A
Other languages
Chinese (zh)
Other versions
TWI305802B (en
Inventor
Hui-Fang Hou
wen-zheng Liu
Pao-Cheng Chen
Yen-Liang Chen
rui-qing Chen
Original Assignee
Epoch Material Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epoch Material Co Ltd filed Critical Epoch Material Co Ltd
Priority to TW095108960A priority Critical patent/TWI305802B/en
Priority to KR1020070025038A priority patent/KR100851615B1/en
Priority to JP2007067443A priority patent/JP2007251175A/en
Publication of TW200736372A publication Critical patent/TW200736372A/en
Application granted granted Critical
Publication of TWI305802B publication Critical patent/TWI305802B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/90—Carbides
    • C01B32/914—Carbides of single elements
    • C01B32/956—Silicon carbide
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/02—Silicon
    • C01B33/021—Preparation
    • C01B33/023—Preparation by reduction of silica or free silica-containing material
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F7/00—Compounds of aluminium
    • C01F7/02—Aluminium oxide; Aluminium hydroxide; Aluminates
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G25/00—Compounds of zirconium
    • C01G25/02—Oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Geology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A chemical mechanical polishing composition has a pH value between 2 and 5 and comprises a mixture having the following components : an aqueous medium, abrasive particles, a corrosion inhibitor, a surfactant, diacid compound and a metal residual inhibitor. Said metal residual inhibitor is selected from the group consisting of the compounds represented by the following formulae: (I), (II), (III), (IV), (V) and the combination thereof, wherein the structures and the definitions of each subsisting group of the formulae (II)~(V) are defined as set forth in the specification and claims. The chemical mechanical polishing composition of the present invention was used for polishing the surfaces of the semiconductor wafers in order to obtain the better polishing rate of metal, efficiently reduce the dishing of metal and the metal residues in the surfaces of the wafers.
TW095108960A 2006-03-16 2006-03-16 Chemical mechanical polishing composition TWI305802B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW095108960A TWI305802B (en) 2006-03-16 2006-03-16 Chemical mechanical polishing composition
KR1020070025038A KR100851615B1 (en) 2006-03-16 2007-03-14 Chemical mechanical polishing composition
JP2007067443A JP2007251175A (en) 2006-03-16 2007-03-15 Chemical mechanical polishing composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095108960A TWI305802B (en) 2006-03-16 2006-03-16 Chemical mechanical polishing composition

Publications (2)

Publication Number Publication Date
TW200736372A true TW200736372A (en) 2007-10-01
TWI305802B TWI305802B (en) 2009-02-01

Family

ID=38595064

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095108960A TWI305802B (en) 2006-03-16 2006-03-16 Chemical mechanical polishing composition

Country Status (3)

Country Link
JP (1) JP2007251175A (en)
KR (1) KR100851615B1 (en)
TW (1) TWI305802B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2912537C (en) * 2013-05-14 2018-12-11 Prc-Desoto International, Inc. Permanganate based conversion coating compositions
JP7682193B2 (en) * 2020-02-13 2025-05-23 フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド Polishing composition and method of use thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI314950B (en) * 2001-10-31 2009-09-21 Hitachi Chemical Co Ltd Polishing slurry and polishing method

Also Published As

Publication number Publication date
JP2007251175A (en) 2007-09-27
KR20070094489A (en) 2007-09-20
TWI305802B (en) 2009-02-01
KR100851615B1 (en) 2008-08-12

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