TW200736617A - Probe pin, probe card, and probe device - Google Patents

Probe pin, probe card, and probe device

Info

Publication number
TW200736617A
TW200736617A TW095145415A TW95145415A TW200736617A TW 200736617 A TW200736617 A TW 200736617A TW 095145415 A TW095145415 A TW 095145415A TW 95145415 A TW95145415 A TW 95145415A TW 200736617 A TW200736617 A TW 200736617A
Authority
TW
Taiwan
Prior art keywords
probe
probe pin
pin
tin
vessel
Prior art date
Application number
TW095145415A
Other languages
Chinese (zh)
Other versions
TWI314213B (en
Inventor
Kenichi Kataoka
Ka Toh
Toshihiro Itoh
Original Assignee
Tokyo Electron Ltd
Univ Tokyo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Univ Tokyo filed Critical Tokyo Electron Ltd
Publication of TW200736617A publication Critical patent/TW200736617A/en
Application granted granted Critical
Publication of TWI314213B publication Critical patent/TWI314213B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

To prevent a part of a contact section on the side of a specimen such as a wafer from peeling and adhering to a contact part of a probe pin. The contact part 31 of the probe pin 10 is made of tin with a strength weaker than that of an electrode P of the wafer W. The probe pin 10 side breaks and suffers a loss when the probe pin 10 is pulled apart from the electrode P, so that a part of the electrode P is prevented from adhering to the probe pin 10. The probe device has a vessel for reserving melted tin. The vessel is three-dimensionally movable by a moving mechanism, and the probe pin 10 can be dipped in the melted tin in the vessel. Thus, tin can be supplemented on the surface of the probe pin 10 having suffered the loss.
TW095145415A 2005-12-06 2006-12-06 Probe pin, probe card, and probe device TW200736617A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005352566A JP5048942B2 (en) 2005-12-06 2005-12-06 Probe pin, probe card and probe device

Publications (2)

Publication Number Publication Date
TW200736617A true TW200736617A (en) 2007-10-01
TWI314213B TWI314213B (en) 2009-09-01

Family

ID=38122789

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095145415A TW200736617A (en) 2005-12-06 2006-12-06 Probe pin, probe card, and probe device

Country Status (3)

Country Link
JP (1) JP5048942B2 (en)
TW (1) TW200736617A (en)
WO (1) WO2007066643A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5691193B2 (en) * 2010-02-26 2015-04-01 富士通セミコンダクター株式会社 Contactor, semiconductor device testing apparatus, and semiconductor device manufacturing method
EP3593151B1 (en) * 2017-03-07 2023-07-05 Capres A/S A probe for testing an electrical property of a test sample
CN108279368A (en) * 2018-01-23 2018-07-13 德淮半导体有限公司 Tester table and test method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01291167A (en) * 1988-05-18 1989-11-22 Canon Inc Probe card and method for measuring parts to be measured using it
JP3486569B2 (en) * 1999-03-10 2004-01-13 キヤノン株式会社 Contact mechanism
JP4841737B2 (en) * 2000-08-21 2011-12-21 東京エレクトロン株式会社 Inspection method and inspection apparatus
JP2005069711A (en) * 2003-08-27 2005-03-17 Japan Electronic Materials Corp Probe card and contactor used therefor

Also Published As

Publication number Publication date
JP5048942B2 (en) 2012-10-17
TWI314213B (en) 2009-09-01
JP2007155553A (en) 2007-06-21
WO2007066643A1 (en) 2007-06-14

Similar Documents

Publication Publication Date Title
TW200745568A (en) Probe structures with electronic components
WO2010100057A3 (en) Connecting device
MY148803A (en) Electronic component pressing device and electronic component test apparatus
MY134463A (en) Inspection unit
MY139125A (en) Method and manufacturing inspection unit
WO2009054251A1 (en) Power generating apparatus
WO2005084378A8 (en) Material and device properties modification by electrochemical charge injection in the absence of contacting electrolyte for either local spatial or final states
EP1624364A3 (en) Data processing device, data processing method, and electronic device
TW200506394A (en) Electronic part test device (1)
EP2221133A3 (en) Depth Gauge for Drill Bit
MY202316A (en) Liquid material ejection device
TW200720675A (en) Electronic component test device
WO2004059328A3 (en) Composite motion probing
MX2015001754A (en) Contact bump connection and contact bump and method for producing a contact bump connection.
PL1937441T3 (en) Touch-switched plastic luminous pincette
TW200700734A (en) Probes for a wafer test apparatus
ATE538632T1 (en) ELECTRONIC APPARATUS HAVING A COOLING ASSEMBLY FOR COOLING A CONSUMER-INSERTABLE MODULE AND COOLING ASSEMBLY FOR COOLING SUCH A MODULE
TW200736617A (en) Probe pin, probe card, and probe device
MXPA02009873A (en) Liquid sample pipette with detachable ejector.
WO2008126682A1 (en) Analyzer
TW200707865A (en) Adapter, interface device with the adapter, and electronic component test apparatus
TW200734665A (en) Electronic component testing apparatus and electronic component testing method
GB0621903D0 (en) Safety kit
MY145021A (en) Plunger for holding and moving electronic components, in particular ics, with a heat conducting body
TW200741930A (en) Mounting method for probe card, and probe card transferring and loading assisting device used therefor

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees