TW200738543A - Method and apparatus for transporting a substrate using non-newtonian fluid - Google Patents

Method and apparatus for transporting a substrate using non-newtonian fluid

Info

Publication number
TW200738543A
TW200738543A TW095121224A TW95121224A TW200738543A TW 200738543 A TW200738543 A TW 200738543A TW 095121224 A TW095121224 A TW 095121224A TW 95121224 A TW95121224 A TW 95121224A TW 200738543 A TW200738543 A TW 200738543A
Authority
TW
Taiwan
Prior art keywords
newtonian fluid
substrate
transporting
flow
newtonian
Prior art date
Application number
TW095121224A
Other languages
English (en)
Other versions
TWI322128B (en
Inventor
Larios John M De
Mike Ravkin
John Parks
Mikhail Korolik
Fred C Redeker
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of TW200738543A publication Critical patent/TW200738543A/zh
Application granted granted Critical
Publication of TWI322128B publication Critical patent/TWI322128B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/36—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G54/00—Non-mechanical conveyors not otherwise provided for
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW095121224A 2005-06-15 2006-06-14 Method and apparatus for transporting a substrate using non-newtonian fluid TWI322128B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/154,129 US7416370B2 (en) 2005-06-15 2005-06-15 Method and apparatus for transporting a substrate using non-Newtonian fluid

Publications (2)

Publication Number Publication Date
TW200738543A true TW200738543A (en) 2007-10-16
TWI322128B TWI322128B (en) 2010-03-21

Family

ID=36710031

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095121224A TWI322128B (en) 2005-06-15 2006-06-14 Method and apparatus for transporting a substrate using non-newtonian fluid

Country Status (8)

Country Link
US (2) US7416370B2 (zh)
EP (1) EP1734574A1 (zh)
JP (1) JP5010856B2 (zh)
KR (2) KR101111361B1 (zh)
CN (1) CN1880200B (zh)
MY (1) MY142184A (zh)
SG (1) SG128607A1 (zh)
TW (1) TWI322128B (zh)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040031167A1 (en) 2002-06-13 2004-02-19 Stein Nathan D. Single wafer method and apparatus for drying semiconductor substrates using an inert gas air-knife
US7913703B1 (en) 2003-06-27 2011-03-29 Lam Research Corporation Method and apparatus for uniformly applying a multi-phase cleaning solution to a substrate
US7799141B2 (en) 2003-06-27 2010-09-21 Lam Research Corporation Method and system for using a two-phases substrate cleaning compound
US8522801B2 (en) 2003-06-27 2013-09-03 Lam Research Corporation Method and apparatus for cleaning a semiconductor substrate
US8316866B2 (en) 2003-06-27 2012-11-27 Lam Research Corporation Method and apparatus for cleaning a semiconductor substrate
US7648584B2 (en) 2003-06-27 2010-01-19 Lam Research Corporation Method and apparatus for removing contamination from substrate
US7737097B2 (en) 2003-06-27 2010-06-15 Lam Research Corporation Method for removing contamination from a substrate and for making a cleaning solution
US7568490B2 (en) 2003-12-23 2009-08-04 Lam Research Corporation Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids
US7416370B2 (en) 2005-06-15 2008-08-26 Lam Research Corporation Method and apparatus for transporting a substrate using non-Newtonian fluid
US8323420B2 (en) 2005-06-30 2012-12-04 Lam Research Corporation Method for removing material from semiconductor wafer and apparatus for performing the same
US7862662B2 (en) 2005-12-30 2011-01-04 Lam Research Corporation Method and material for cleaning a substrate
US8522799B2 (en) 2005-12-30 2013-09-03 Lam Research Corporation Apparatus and system for cleaning a substrate
US8043441B2 (en) 2005-06-15 2011-10-25 Lam Research Corporation Method and apparatus for cleaning a substrate using non-Newtonian fluids
EP2428557A1 (en) 2005-12-30 2012-03-14 LAM Research Corporation Cleaning solution
US8480810B2 (en) * 2005-12-30 2013-07-09 Lam Research Corporation Method and apparatus for particle removal
US7997289B1 (en) * 2006-10-03 2011-08-16 Xyratex Technology Limited Methods of and apparatus for cleaning and conveying a substrate
US7897213B2 (en) 2007-02-08 2011-03-01 Lam Research Corporation Methods for contained chemical surface treatment
US8388762B2 (en) * 2007-05-02 2013-03-05 Lam Research Corporation Substrate cleaning technique employing multi-phase solution
US8211846B2 (en) 2007-12-14 2012-07-03 Lam Research Group Materials for particle removal by single-phase and two-phase media
US8845812B2 (en) * 2009-06-12 2014-09-30 Micron Technology, Inc. Method for contamination removal using magnetic particles
US10258986B2 (en) 2014-11-12 2019-04-16 University Of New Hampshire Viscoelastic fluid drop production
CN116551419B (zh) * 2023-07-07 2023-09-19 杭州鄂达精密机电科技有限公司 用于批量阀座打孔的全自动装夹组件
CN117465893B (zh) * 2023-12-08 2026-03-20 中煤科工开采研究院有限公司 抗磨损矿用刮板机及抗磨损方法

Family Cites Families (170)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL251243A (zh) 1959-05-04
US3212762A (en) 1960-05-23 1965-10-19 Dow Chemical Co Foam generator
US3436262A (en) 1964-09-25 1969-04-01 Dow Chemical Co Cleaning by foam contact,and foam regeneration method
US3617095A (en) 1967-10-18 1971-11-02 Petrolite Corp Method of transporting bulk solids
US3978176A (en) 1972-09-05 1976-08-31 Minnesota Mining And Manufacturing Company Sparger
GB1507472A (en) 1974-05-02 1978-04-12 Bunker Ramo Foamable coating remover composition
US4156619A (en) 1975-06-11 1979-05-29 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh Process for cleaning semi-conductor discs
JPS5924849B2 (ja) 1976-03-24 1984-06-12 バブコツク日立株式会社 硫黄酸化物を含む排ガスの処理法
JPS5647471Y2 (zh) 1976-11-30 1981-11-06
US4133773A (en) 1977-07-28 1979-01-09 The Dow Chemical Company Apparatus for making foamed cleaning solutions and method of operation
US4236851A (en) * 1978-01-05 1980-12-02 Kasper Instruments, Inc. Disc handling system and method
US4238244A (en) 1978-10-10 1980-12-09 Halliburton Company Method of removing deposits from surfaces with a gas agitated cleaning liquid
JPS605529Y2 (ja) 1979-05-04 1985-02-21 株式会社タムラ製作所 コイル
JPS5684618U (zh) 1979-12-03 1981-07-08
JPS5684619U (zh) 1979-12-04 1981-07-08
US4535580A (en) 1981-07-09 1985-08-20 Donn Incorporated Screw slot runner system
US4838289A (en) 1982-08-03 1989-06-13 Texas Instruments Incorporated Apparatus and method for edge cleaning
NZ202329A (en) * 1982-10-29 1986-11-12 Fibre Dynamics Ltd Transporting slurry within a pulp
US4911761A (en) 1984-05-21 1990-03-27 Cfm Technologies Research Associates Process and apparatus for drying surfaces
US4573830A (en) * 1984-06-21 1986-03-04 International Business Machines Corporation Chip decelerator
JPS6181324A (ja) * 1984-09-26 1986-04-24 Shinko Electric Co Ltd 搬送装置
JPH027316Y2 (zh) 1986-01-20 1990-02-21
WO1988000081A1 (fr) 1986-07-08 1988-01-14 Kohlensäurewerk Deutschland Gmbh Procede pour separer des substances volatiles
NL8601939A (nl) 1986-07-28 1988-02-16 Philips Nv Werkwijze voor het verwijderen van ongewenste deeltjes van een oppervlak van een substraat.
JPS6377510A (ja) 1986-09-20 1988-04-07 Fujitsu Ltd 発泡性混酸用循環濾過装置
US4838219A (en) * 1986-11-13 1989-06-13 Feuling James J Curved intake duct having improved flow characteristics
US4962776A (en) 1987-03-26 1990-10-16 Regents Of The University Of Minnesota Process for surface and fluid cleaning
US4817652A (en) 1987-03-26 1989-04-04 Regents Of The University Of Minnesota System for surface and fluid cleaning
US4849027A (en) 1987-04-16 1989-07-18 Simmons Bobby G Method for recycling foamed solvents
US5105556A (en) 1987-08-12 1992-04-21 Hitachi, Ltd. Vapor washing process and apparatus
US5048549A (en) 1988-03-02 1991-09-17 General Dynamics Corp., Air Defense Systems Div. Apparatus for cleaning and/or fluxing circuit card assemblies
US5181985A (en) 1988-06-01 1993-01-26 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh Process for the wet-chemical surface treatment of semiconductor wafers
US5488521A (en) * 1988-10-17 1996-01-30 Conner Peripherals, Inc. Information recording apparatus with a non-newtonian liquid bearing
US5068040A (en) * 1989-04-03 1991-11-26 Hughes Aircraft Company Dense phase gas photochemical process for substrate treatment
JPH02309638A (ja) 1989-05-24 1990-12-25 Fujitsu Ltd ウエハーエッチング装置
US5000795A (en) 1989-06-16 1991-03-19 At&T Bell Laboratories Semiconductor wafer cleaning method and apparatus
JPH076993Y2 (ja) 1989-07-26 1995-02-22 株式会社工進精工所 金属管端部用加工機
US5102777A (en) 1990-02-01 1992-04-07 Ardrox Inc. Resist stripping
US5271774A (en) 1990-03-01 1993-12-21 U.S. Philips Corporation Method for removing in a centrifuge a liquid from a surface of a substrate
DE69102311T2 (de) 1990-03-07 1994-09-29 Hitachi Ltd Vorrichtung und Verfahren zur Oberflächenreinigung.
DE4038587A1 (de) 1990-12-04 1992-06-11 Hamatech Halbleiter Maschinenb Transportvorrichtung fuer substrate
US5306350A (en) 1990-12-21 1994-04-26 Union Carbide Chemicals & Plastics Technology Corporation Methods for cleaning apparatus using compressed fluids
US5261966A (en) 1991-01-28 1993-11-16 Kabushiki Kaisha Toshiba Method of cleaning semiconductor wafers using mixer containing a bundle of gas permeable hollow yarns
US5175124A (en) 1991-03-25 1992-12-29 Motorola, Inc. Process for fabricating a semiconductor device using re-ionized rinse water
US5148549A (en) * 1991-04-23 1992-09-22 Ergodyne Corporation Back support with side openings and attached apron
US5242669A (en) 1992-07-09 1993-09-07 The S. A. Day Mfg. Co., Inc. High purity potassium tetrafluoroaluminate and method of making same
JPH06177101A (ja) 1992-12-03 1994-06-24 Mitsubishi Materials Corp 改良されたシリコンウェーハ洗浄液
US5288332A (en) 1993-02-05 1994-02-22 Honeywell Inc. A process for removing corrosive by-products from a circuit assembly
US5336371A (en) 1993-03-18 1994-08-09 At&T Bell Laboratories Semiconductor wafer cleaning and rinsing techniques using re-ionized water and tank overflow
JP2659321B2 (ja) * 1993-04-20 1997-09-30 川崎製鉄株式会社 ウエハ移送装置
US5911837A (en) 1993-07-16 1999-06-15 Legacy Systems, Inc. Process for treatment of semiconductor wafers in a fluid
US5464480A (en) 1993-07-16 1995-11-07 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid
US5472502A (en) 1993-08-30 1995-12-05 Semiconductor Systems, Inc. Apparatus and method for spin coating wafers and the like
CA2170272C (en) * 1993-08-31 2005-04-05 Andrew G. Hay Transporting and metering particulate material
US5950645A (en) 1993-10-20 1999-09-14 Verteq, Inc. Semiconductor wafer cleaning system
US5656097A (en) 1993-10-20 1997-08-12 Verteq, Inc. Semiconductor wafer cleaning system
US5518542A (en) 1993-11-05 1996-05-21 Tokyo Electron Limited Double-sided substrate cleaning apparatus
US5938504A (en) 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
JPH07147263A (ja) * 1993-11-24 1995-06-06 Ebara Corp ウエハ搬送装置
US5417768A (en) 1993-12-14 1995-05-23 Autoclave Engineers, Inc. Method of cleaning workpiece with solvent and then with liquid carbon dioxide
EP0681317B1 (en) 1994-04-08 2001-10-17 Texas Instruments Incorporated Method for cleaning semiconductor wafers using liquefied gases
US5498293A (en) 1994-06-23 1996-03-12 Mallinckrodt Baker, Inc. Cleaning wafer substrates of metal contamination while maintaining wafer smoothness
US6081650A (en) 1994-06-30 2000-06-27 Thomson Licensing S.A. Transport processor interface and video recorder/playback apparatus in a field structured datastream suitable for conveying television information
US5705223A (en) 1994-07-26 1998-01-06 International Business Machine Corp. Method and apparatus for coating a semiconductor wafer
US5514417A (en) * 1994-08-04 1996-05-07 Schuller International, Inc. Method of and apparatus for coating a molded fibrous workpiece
US5772784A (en) 1994-11-14 1998-06-30 Yieldup International Ultra-low particle semiconductor cleaner
JP3504023B2 (ja) 1995-05-26 2004-03-08 株式会社ルネサステクノロジ 洗浄装置および洗浄方法
US5660642A (en) 1995-05-26 1997-08-26 The Regents Of The University Of California Moving zone Marangoni drying of wet objects using naturally evaporated solvent vapor
US5968285A (en) 1995-06-07 1999-10-19 Gary W. Ferrell Methods for drying and cleaning of objects using aerosols and inert gases
US5964958A (en) 1995-06-07 1999-10-12 Gary W. Ferrell Methods for drying and cleaning objects using aerosols
US6532976B1 (en) 1995-07-10 2003-03-18 Lg Semicon Co., Ltd. Semiconductor wafer cleaning apparatus
DE19622015A1 (de) 1996-05-31 1997-12-04 Siemens Ag Verfahren zum Ätzen von Zerstörungszonen an einem Halbleitersubstratrand sowie Ätzanlage
TW416987B (en) 1996-06-05 2001-01-01 Wako Pure Chem Ind Ltd A composition for cleaning the semiconductor substrate surface
JPH1055993A (ja) 1996-08-09 1998-02-24 Hitachi Ltd 半導体素子製造用洗浄液及びそれを用いた半導体素子の製造方法
WO1998013149A1 (en) 1996-09-25 1998-04-02 Shuzurifuresher Kaihatsukyodokumiai Washing means using liquefied gas of high density
US5997653A (en) 1996-10-07 1999-12-07 Tokyo Electron Limited Method for washing and drying substrates
US5858283A (en) 1996-11-18 1999-01-12 Burris; William Alan Sparger
US6896826B2 (en) 1997-01-09 2005-05-24 Advanced Technology Materials, Inc. Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
US5900191A (en) 1997-01-14 1999-05-04 Stable Air, Inc. Foam producing apparatus and method
US7320457B2 (en) * 1997-02-07 2008-01-22 Sri International Electroactive polymer devices for controlling fluid flow
US5800626A (en) 1997-02-18 1998-09-01 International Business Machines Corporation Control of gas content in process liquids for improved megasonic cleaning of semiconductor wafers and microelectronics substrates
US6701941B1 (en) 1997-05-09 2004-03-09 Semitool, Inc. Method for treating the surface of a workpiece
JPH10321572A (ja) 1997-05-15 1998-12-04 Toshiba Corp 半導体ウェーハの両面洗浄装置及び半導体ウェーハのポリッシング方法
JPH1126423A (ja) 1997-07-09 1999-01-29 Sugai:Kk 半導体ウエハ等の処理方法並びにその処理装置
US6152805A (en) 1997-07-17 2000-11-28 Canon Kabushiki Kaisha Polishing machine
US5932493A (en) 1997-09-15 1999-08-03 International Business Machines Corporaiton Method to minimize watermarks on silicon substrates
WO1999016109A1 (en) 1997-09-24 1999-04-01 Interuniversitair Micro-Elektronica Centrum Vereniging Zonder Winstbejag Method and apparatus for removing a liquid from a surface
US6491764B2 (en) 1997-09-24 2002-12-10 Interuniversitair Microelektronics Centrum (Imec) Method and apparatus for removing a liquid from a surface of a rotating substrate
US5904156A (en) 1997-09-24 1999-05-18 International Business Machines Corporation Dry film resist removal in the presence of electroplated C4's
EP0905746A1 (en) 1997-09-24 1999-03-31 Interuniversitair Micro-Elektronica Centrum Vzw Method of removing a liquid from a surface of a rotating substrate
US6398975B1 (en) 1997-09-24 2002-06-04 Interuniversitair Microelektronica Centrum (Imec) Method and apparatus for localized liquid treatment of the surface of a substrate
JP3039493B2 (ja) 1997-11-28 2000-05-08 日本電気株式会社 基板の洗浄方法及び洗浄溶液
US6270584B1 (en) 1997-12-03 2001-08-07 Gary W. Ferrell Apparatus for drying and cleaning objects using controlled aerosols and gases
JPH11334874A (ja) 1998-05-25 1999-12-07 Speedfam-Ipec Co Ltd 搬送装置
JPH11350169A (ja) 1998-06-10 1999-12-21 Chemitoronics Co ウエットエッチング装置およびウエットエッチングの方法
US6049996A (en) 1998-07-10 2000-04-18 Ball Semiconductor, Inc. Device and fluid separator for processing spherical shaped devices
US6161311A (en) * 1998-07-10 2000-12-19 Asm America, Inc. System and method for reducing particles in epitaxial reactors
US5944581A (en) 1998-07-13 1999-08-31 Ford Motor Company CO2 cleaning system and method
JP3003684B1 (ja) 1998-09-07 2000-01-31 日本電気株式会社 基板洗浄方法および基板洗浄液
JP2000100801A (ja) 1998-09-25 2000-04-07 Sumitomo Electric Ind Ltd エピタキシャルウェハおよびその製造方法ならびにそれに用いられる化合物半導体基板の表面清浄化方法
JP2000141215A (ja) 1998-11-05 2000-05-23 Sony Corp 平坦化研磨装置及び平坦化研磨方法
US6090217A (en) 1998-12-09 2000-07-18 Kittle; Paul A. Surface treatment of semiconductor substrates
JP2000260739A (ja) 1999-03-11 2000-09-22 Kokusai Electric Co Ltd 基板処理装置および基板処理方法
US6290780B1 (en) 1999-03-19 2001-09-18 Lam Research Corporation Method and apparatus for processing a wafer
EP1088337A1 (en) 1999-03-30 2001-04-04 Koninklijke Philips Electronics N.V. Semiconductor wafer cleaning apparatus and method
US6272712B1 (en) 1999-04-02 2001-08-14 Lam Research Corporation Brush box containment apparatus
KR100585448B1 (ko) * 1999-04-08 2006-06-02 동경 엘렉트론 주식회사 막 형성방법 및 막 형성장치
JP4247587B2 (ja) 1999-06-23 2009-04-02 Ｊｓｒ株式会社 半導体部品用洗浄剤、半導体部品の洗浄方法、研磨用組成物、および研磨方法
US6562726B1 (en) 1999-06-29 2003-05-13 Micron Technology, Inc. Acid blend for removing etch residue
RU2149930C1 (ru) * 1999-07-30 2000-05-27 Рябков Данила Витальевич Способ модифицирования поверхности металлических изделий и устройство для реализации способа
WO2001012384A2 (en) 1999-08-12 2001-02-22 Speedfam-Ipec Corporation Apparatus for moving a workpiece
US20020121290A1 (en) 1999-08-25 2002-09-05 Applied Materials, Inc. Method and apparatus for cleaning/drying hydrophobic wafers
US6734121B2 (en) 1999-09-02 2004-05-11 Micron Technology, Inc. Methods of treating surfaces of substrates
US6228563B1 (en) 1999-09-17 2001-05-08 Gasonics International Corporation Method and apparatus for removing post-etch residues and other adherent matrices
US7122126B1 (en) 2000-09-28 2006-10-17 Materials And Technologies Corporation Wet processing using a fluid meniscus, apparatus and method
US6858089B2 (en) 1999-10-29 2005-02-22 Paul P. Castrucci Apparatus and method for semiconductor wafer cleaning
US6576066B1 (en) 1999-12-06 2003-06-10 Nippon Telegraph And Telephone Corporation Supercritical drying method and supercritical drying apparatus
US6286231B1 (en) 2000-01-12 2001-09-11 Semitool, Inc. Method and apparatus for high-pressure wafer processing and drying
US6276459B1 (en) 2000-02-01 2001-08-21 Bradford James Herrick Compressed air foam generator
US6594847B1 (en) 2000-03-28 2003-07-22 Lam Research Corporation Single wafer residue, thin film removal and clean
US6457199B1 (en) 2000-10-12 2002-10-01 Lam Research Corporation Substrate processing in an immersion, scrub and dry system
ATE366299T1 (de) 2000-05-17 2007-07-15 Henkel Kgaa Wasch- oder reinigungsmittelformkörper
US6508882B1 (en) * 2000-05-24 2003-01-21 Gaston Systems, Inc. Apparatus for applying a chemical foam to a traveling substrate
US6927176B2 (en) 2000-06-26 2005-08-09 Applied Materials, Inc. Cleaning method and solution for cleaning a wafer in a single wafer process
US6488040B1 (en) 2000-06-30 2002-12-03 Lam Research Corporation Capillary proximity heads for single wafer cleaning and drying
KR100366623B1 (ko) 2000-07-18 2003-01-09 삼성전자 주식회사 반도체 기판 또는 ｌｃｄ 기판의 세정방법
EP1303870A2 (en) * 2000-07-26 2003-04-23 Tokyo Electron Limited High pressure processing chamber for semiconductor substrate
US6810887B2 (en) 2000-08-11 2004-11-02 Chemtrace Corporation Method for cleaning semiconductor fabrication equipment parts
JP2002066475A (ja) 2000-08-25 2002-03-05 Dainippon Screen Mfg Co Ltd 基板洗浄装置
US6328042B1 (en) 2000-10-05 2001-12-11 Lam Research Corporation Wafer cleaning module and method for cleaning the surface of a substrate
US20020094684A1 (en) 2000-11-27 2002-07-18 Hirasaki George J. Foam cleaning process in semiconductor manufacturing
US6525009B2 (en) 2000-12-07 2003-02-25 International Business Machines Corporation Polycarboxylates-based aqueous compositions for cleaning of screening apparatus
US6493902B2 (en) 2001-02-22 2002-12-17 Chung-Yi Lin Automatic wall cleansing apparatus
JP2002280343A (ja) 2001-03-15 2002-09-27 Nec Corp 洗浄処理装置、切削加工装置
JP2002280330A (ja) 2001-03-21 2002-09-27 Lintec Corp チップ状部品のピックアップ方法
US6627550B2 (en) 2001-03-27 2003-09-30 Micron Technology, Inc. Post-planarization clean-up
JP2002309638A (ja) 2001-04-17 2002-10-23 Takiron Co Ltd 建物の排水管路における通気性掃除口
JP3511514B2 (ja) 2001-05-31 2004-03-29 エム・エフエスアイ株式会社 基板浄化処理装置、ディスペンサー、基板保持機構、基板の浄化処理用チャンバー、及びこれらを用いた基板の浄化処理方法
WO2002101796A2 (en) 2001-06-12 2002-12-19 Verteq, Inc. Megasonic cleaner and dryer system
US6802911B2 (en) 2001-09-19 2004-10-12 Samsung Electronics Co., Ltd. Method for cleaning damaged layers and polymer residue from semiconductor device
CA2465823A1 (en) 2001-11-19 2003-05-30 Unilever Plc Improved washing system
TW497494U (en) * 2001-12-28 2002-08-01 Metal Ind Redearch & Amp Dev C Fluid driven stirring device for compressing gas cleaning system
US20030171239A1 (en) 2002-01-28 2003-09-11 Patel Bakul P. Methods and compositions for chemically treating a substrate using foam technology
JP2003282513A (ja) 2002-03-26 2003-10-03 Seiko Epson Corp 有機物剥離方法及び有機物剥離装置
JP4570008B2 (ja) 2002-04-16 2010-10-27 東京エレクトロン株式会社 液処理装置および液処理方法
US7129091B2 (en) * 2002-05-09 2006-10-31 University Of Chicago Device and method for pressure-driven plug transport and reaction
US20040159335A1 (en) 2002-05-17 2004-08-19 P.C.T. Systems, Inc. Method and apparatus for removing organic layers
US6846380B2 (en) 2002-06-13 2005-01-25 The Boc Group, Inc. Substrate processing apparatus and related systems and methods
US20040002430A1 (en) 2002-07-01 2004-01-01 Applied Materials, Inc. Using a time critical wafer cleaning solution by combining a chelating agent with an oxidizer at point-of-use
US6733596B1 (en) 2002-12-23 2004-05-11 Lam Research Corporation Substrate cleaning brush preparation sequence, method, and system
WO2004065911A2 (en) * 2003-01-16 2004-08-05 North Carolina State University Apparatus and method for controlling flow of process materials
US20040163681A1 (en) 2003-02-25 2004-08-26 Applied Materials, Inc. Dilute sulfuric peroxide at point-of-use
US6951042B1 (en) 2003-02-28 2005-10-04 Lam Research Corporation Brush scrubbing-high frequency resonating wafer processing system and methods for making and implementing the same
US20040261823A1 (en) 2003-06-27 2004-12-30 Lam Research Corporation Method and apparatus for removing a target layer from a substrate using reactive gases
US6946396B2 (en) 2003-10-30 2005-09-20 Nissan Chemical Indusries, Ltd. Maleic acid and ethylene urea containing formulation for removing residue from semiconductor substrate and method for cleaning wafer
KR20050044085A (ko) 2003-11-07 2005-05-12 삼성전자주식회사 집적회로 소자의 세정액 및 그 세정액을 이용한 세정방법
US7353560B2 (en) 2003-12-18 2008-04-08 Lam Research Corporation Proximity brush unit apparatus and method
US7416370B2 (en) 2005-06-15 2008-08-26 Lam Research Corporation Method and apparatus for transporting a substrate using non-Newtonian fluid
US7568490B2 (en) 2003-12-23 2009-08-04 Lam Research Corporation Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids
US8043441B2 (en) 2005-06-15 2011-10-25 Lam Research Corporation Method and apparatus for cleaning a substrate using non-Newtonian fluids
US8323420B2 (en) 2005-06-30 2012-12-04 Lam Research Corporation Method for removing material from semiconductor wafer and apparatus for performing the same
JP2005194294A (ja) 2003-12-26 2005-07-21 Nec Electronics Corp 洗浄液及び半導体装置の製造方法
CN1654617A (zh) 2004-02-10 2005-08-17 捷时雅株式会社 清洗用组合物和半导体基板的清洗方法及半导体装置的制造方法
US20050183740A1 (en) 2004-02-19 2005-08-25 Fulton John L. Process and apparatus for removing residues from semiconductor substrates
US7140393B2 (en) * 2004-12-22 2006-11-28 Tokyo Electron Limited Non-contact shuttle valve for flow diversion in high pressure systems
US8136423B2 (en) 2005-01-25 2012-03-20 Schukra of North America Co. Multiple turn mechanism for manual lumbar support adjustment
US7291565B2 (en) * 2005-02-15 2007-11-06 Tokyo Electron Limited Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid
US7536962B2 (en) * 2005-04-19 2009-05-26 Kamterter Ii, L.L.C. Systems for the control and use of fluids and particles
US7765949B2 (en) * 2005-11-17 2010-08-03 Palo Alto Research Center Incorporated Extrusion/dispensing systems and methods
WO2007124409A2 (en) * 2006-04-20 2007-11-01 Velocys, Inc. Process for treating and/or forming a non-newtonian fluid using microchannel process technology

Also Published As

Publication number Publication date
MY142184A (en) 2010-10-15
TWI322128B (en) 2010-03-21
JP2007053341A (ja) 2007-03-01
KR20060131680A (ko) 2006-12-20
KR101111360B1 (ko) 2012-02-24
KR20110120853A (ko) 2011-11-04
US20060285930A1 (en) 2006-12-21
SG128607A1 (en) 2007-01-30
US20080267721A1 (en) 2008-10-30
US7591613B2 (en) 2009-09-22
EP1734574A1 (en) 2006-12-20
JP5010856B2 (ja) 2012-08-29
KR101111361B1 (ko) 2012-02-24
CN1880200A (zh) 2006-12-20
US7416370B2 (en) 2008-08-26
CN1880200B (zh) 2013-02-06

Similar Documents

Publication Publication Date Title
MY142184A (en) Method and apparatus for transporting a substrate using non-newtonian fluid
DE602006004184D1 (de) Vorrichtung und verfahren zur übertragung einer flüssigkeit auf ein bewegliches bahnmaterial
ATE306954T1 (de) Unterbrechungsfreie durchfluss pumpvorrichtung und verfahren
SG146545A1 (en) A flow control assembly having a fixed flow control device and an adjustable flow control device
TW200603218A (en) Proximity meniscus manifold
EP1948860A4 (en) DEVICE FOR LEADING AND LEAVING A LIQUID AND OPERATING METHOD THEREFOR
IL181965A0 (en) Fluid supply method and apparatus
WO2007015810A3 (en) Method, system and apparatus for detecting defects in a honeycomb body using a particulate fluid
IL192071A0 (en) Device and method for the surface treatment of substrates
SG144740A1 (en) Methods and systems for processing a substrate using a dynamic liquid meniscus
SG113042A1 (en) Device, method and system for controlling fluid flow
SG157342A1 (en) Lithographic apparatus and a method of operating the apparatus
TW200732836A (en) Method for expelling gas positioned between a substrate and a mold
MXPA05003367A (es) Metodo y aparato para aplicar material en particulas a un substrato.
TW200640681A (en) Apparatus and method for coating a metal support material
GB2453880A (en) Improved workover riser compensator system
IL176620A0 (en) Method for water hammer-less opening of fluid passages, chemical supply method using the same, and water hammer-less opening device
SG149849A1 (en) Method and apparatus for cleaning a substrate using non-newtonian fluids
SG137729A1 (en) Substrate carrier and facility interface and apparatus including same
DE502005008847D1 (de) Vorrichtung zum transportieren und stützen tafelfö
TW200622507A (en) Lithographic apparatus and device manufacturing method
SG132647A1 (en) Lithographic apparatus and device manufacturing method
WO2006056864A3 (en) Heated spray painting system
SG132651A1 (en) System and method to increase surface tension and contact angle in immersion lithography
WO2009044530A1 (ja) 表面処理装置および表面処理システム、表面処理方法、これによって処理された帯状薄体

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees