TW200738854A - Metal-polishing liquid and chemical-mechanical polishing method using the same - Google Patents

Metal-polishing liquid and chemical-mechanical polishing method using the same

Info

Publication number
TW200738854A
TW200738854A TW096103277A TW96103277A TW200738854A TW 200738854 A TW200738854 A TW 200738854A TW 096103277 A TW096103277 A TW 096103277A TW 96103277 A TW96103277 A TW 96103277A TW 200738854 A TW200738854 A TW 200738854A
Authority
TW
Taiwan
Prior art keywords
polishing
metal
polished
chemical
same
Prior art date
Application number
TW096103277A
Other languages
English (en)
Chinese (zh)
Inventor
Makoto Kikuchi
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006023205A external-priority patent/JP2007207909A/ja
Priority claimed from JP2006023203A external-priority patent/JP4954558B2/ja
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of TW200738854A publication Critical patent/TW200738854A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C09K3/1445—Composite particles, e.g. coated particles the coating consisting exclusively of metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Composite Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW096103277A 2006-01-31 2007-01-30 Metal-polishing liquid and chemical-mechanical polishing method using the same TW200738854A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006023205A JP2007207909A (ja) 2006-01-31 2006-01-31 金属用研磨液、及びそれを用いた化学的機械的研磨方法
JP2006023203A JP4954558B2 (ja) 2006-01-31 2006-01-31 金属用研磨液、及びそれを用いた化学的機械的研磨方法

Publications (1)

Publication Number Publication Date
TW200738854A true TW200738854A (en) 2007-10-16

Family

ID=38042526

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096103277A TW200738854A (en) 2006-01-31 2007-01-30 Metal-polishing liquid and chemical-mechanical polishing method using the same

Country Status (4)

Country Link
US (1) US20070176142A1 (de)
EP (1) EP1813657A3 (de)
KR (1) KR20070078988A (de)
TW (1) TW200738854A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109153889A (zh) * 2016-05-19 2019-01-04 东进世美肯株式会社 用于化学机械抛光的浆料组合物

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1813656A3 (de) * 2006-01-30 2009-09-02 FUJIFILM Corporation Flüssigkeit zum Polieren von Metallen und chemisch-mechanisches Polierverfahren damit
JP2007214518A (ja) * 2006-02-13 2007-08-23 Fujifilm Corp 金属用研磨液
US7902072B2 (en) * 2006-02-28 2011-03-08 Fujifilm Corporation Metal-polishing composition and chemical-mechanical polishing method
JP5327427B2 (ja) * 2007-06-19 2013-10-30 Ｊｓｒ株式会社 化学機械研磨用水系分散体調製用セット、化学機械研磨用水系分散体の調製方法、化学機械研磨用水系分散体および化学機械研磨方法
JP5140469B2 (ja) * 2007-09-12 2013-02-06 富士フイルム株式会社 金属用研磨液、及び化学的機械的研磨方法
CN101451048A (zh) * 2007-11-30 2009-06-10 安集微电子（上海）有限公司 一种化学机械抛光液
JPWO2011122415A1 (ja) * 2010-03-29 2013-07-08 旭硝子株式会社 研磨剤、研磨方法および半導体集積回路装置の製造方法
US10144850B2 (en) 2015-09-25 2018-12-04 Versum Materials Us, Llc Stop-on silicon containing layer additive

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3922393A (en) * 1974-07-02 1975-11-25 Du Pont Process for polishing silicon and germanium semiconductor materials
US4944836A (en) * 1985-10-28 1990-07-31 International Business Machines Corporation Chem-mech polishing method for producing coplanar metal/insulator films on a substrate
US4673524A (en) * 1986-05-16 1987-06-16 Dean Ralph R Cleaner composition
US5545429A (en) * 1994-07-01 1996-08-13 International Business Machines Corporation Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess
CA2177634C (en) * 1996-01-17 2000-02-22 George Mcilwraith Reflective materials for manufacture of reflective lighting elements including parabolic louvers and the like
US5795695A (en) * 1996-09-30 1998-08-18 Xerox Corporation Recording and backing sheets containing linear and cross-linked polyester resins
JP3707966B2 (ja) * 1998-10-26 2005-10-19 三菱製紙株式会社 インクジェット記録シート及びその製造方法
US6881776B2 (en) * 1998-10-29 2005-04-19 Penreco Gel compositions
EP1198534B1 (de) * 1999-07-13 2004-10-13 Kao Corporation Schleifmittelzusammensetzung
TWI296006B (de) * 2000-02-09 2008-04-21 Jsr Corp
EP1272144A4 (de) * 2000-03-27 2006-04-26 Schott Ag NEUES KOSMETISCHES KöRPERREINIGUNGSMITTEL UND NAHRUNGSMITTELERGäNZUNGEN ENTHALTEND BIOAKTIVES GLAS UND METHODEN ZUR HERSTELLUNG UND VERWENDUNG DERSELBEN
ES2331302T3 (es) * 2001-05-01 2009-12-29 A.V. Topchiev Institute Of Petrochemical Synthesis Composiciones de hidrogel.
US6485612B1 (en) * 2001-05-18 2002-11-26 Voith Paper, Inc. Air press assembly for use in a paper-making machine
JP3899456B2 (ja) * 2001-10-19 2007-03-28 株式会社フジミインコーポレーテッド 研磨用組成物およびそれを用いた研磨方法
JP2003197573A (ja) * 2001-12-26 2003-07-11 Ekc Technology Kk メタル膜絶縁膜共存表面研磨用コロイダルシリカ
DE10164262A1 (de) * 2001-12-27 2003-07-17 Bayer Ag Zusammensetzung für das chemisch-mechanische Polieren von Metall- und Metall/Dielektrikastrukturen
US7513920B2 (en) * 2002-02-11 2009-04-07 Dupont Air Products Nanomaterials Llc Free radical-forming activator attached to solid and used to enhance CMP formulations
US6822063B2 (en) * 2002-08-27 2004-11-23 Ecolab Inc. Highly durable waterborne radiation cured coating
TWI307712B (en) * 2002-08-28 2009-03-21 Kao Corp Polishing composition
US20040109853A1 (en) * 2002-09-09 2004-06-10 Reactive Surfaces, Ltd. Biological active coating components, coatings, and coated surfaces
US6893476B2 (en) * 2002-12-09 2005-05-17 Dupont Air Products Nanomaterials Llc Composition and associated methods for chemical mechanical planarization having high selectivity for metal removal
TW200424299A (en) * 2002-12-26 2004-11-16 Kao Corp Polishing composition
US7736405B2 (en) * 2003-05-12 2010-06-15 Advanced Technology Materials, Inc. Chemical mechanical polishing compositions for copper and associated materials and method of using same
TW200427827A (en) * 2003-05-30 2004-12-16 Sumitomo Chemical Co Metal polishing composition
US7300480B2 (en) * 2003-09-25 2007-11-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High-rate barrier polishing composition
US7153335B2 (en) * 2003-10-10 2006-12-26 Dupont Air Products Nanomaterials Llc Tunable composition and method for chemical-mechanical planarization with aspartic acid/tolyltriazole
US7022255B2 (en) * 2003-10-10 2006-04-04 Dupont Air Products Nanomaterials Llc Chemical-mechanical planarization composition with nitrogen containing polymer and method for use
US7514363B2 (en) * 2003-10-23 2009-04-07 Dupont Air Products Nanomaterials Llc Chemical-mechanical planarization composition having benzenesulfonic acid and per-compound oxidizing agents, and associated method for use
US7247566B2 (en) * 2003-10-23 2007-07-24 Dupont Air Products Nanomaterials Llc CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers
TWI244498B (en) * 2003-11-20 2005-12-01 Eternal Chemical Co Ltd Chemical mechanical abrasive slurry and method of using the same
JP3892846B2 (ja) * 2003-11-27 2007-03-14 株式会社東芝 Ｃｍｐ用スラリー、研磨方法、および半導体装置の製造方法
US20050142084A1 (en) * 2003-12-29 2005-06-30 Sanjoy Ganguly Cosmetic compositions containing nacreous pigments of large sized synthetic mica
US7527861B2 (en) * 2004-01-12 2009-05-05 Ecolab, Inc. Jobsite-renewable multilayer floor finish with enhanced hardening rate
TW200613485A (en) * 2004-03-22 2006-05-01 Kao Corp Polishing composition
US20080057336A1 (en) * 2004-06-22 2008-03-06 Toyo Seikan Kaisha, Ltd Surface-Treated Metal Materials, Method of Treating the Surfaces Thereof, Resin-Coated Metal Materials, Cans and Can Lids
AU2006209239A1 (en) * 2005-01-27 2006-08-03 A.V. Topchiev Institute Of Petrochemical Synthesis Hydrophilic biocompatible adhesive formulations and uses
US20060205904A1 (en) * 2005-03-11 2006-09-14 St Clair David J Oil gels of controlled distribution block copolymers and ester oils
US7309684B2 (en) * 2005-05-12 2007-12-18 The Lubrizol Corporation Oil-in-water emulsified remover comprising an ethoxylated alcohol surfactant
MX2008001496A (es) * 2005-07-30 2008-02-15 Unilever Nv Composiciones de atomizacion.
US7842193B2 (en) * 2005-09-29 2010-11-30 Fujifilm Corporation Polishing liquid
US7547670B2 (en) * 2005-10-25 2009-06-16 Cognis Ip Management Gmbh Low odor ester-based microemulsions for cleaning hard surfaces
EP1813656A3 (de) * 2006-01-30 2009-09-02 FUJIFILM Corporation Flüssigkeit zum Polieren von Metallen und chemisch-mechanisches Polierverfahren damit
JP2007207908A (ja) * 2006-01-31 2007-08-16 Fujifilm Corp バリア層用研磨液
JP2007214518A (ja) * 2006-02-13 2007-08-23 Fujifilm Corp 金属用研磨液
US7902072B2 (en) * 2006-02-28 2011-03-08 Fujifilm Corporation Metal-polishing composition and chemical-mechanical polishing method
US7691287B2 (en) * 2007-01-31 2010-04-06 Dupont Air Products Nanomaterials Llc Method for immobilizing ligands and organometallic compounds on silica surface, and their application in chemical mechanical planarization

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109153889A (zh) * 2016-05-19 2019-01-04 东进世美肯株式会社 用于化学机械抛光的浆料组合物
US11001732B2 (en) 2016-05-19 2021-05-11 Dongjin Semichem Co., Ltd. Polishing slurry composition
CN109153889B (zh) * 2016-05-19 2021-10-29 东进世美肯株式会社 用于化学机械抛光的浆料组合物

Also Published As

Publication number Publication date
EP1813657A2 (de) 2007-08-01
US20070176142A1 (en) 2007-08-02
EP1813657A3 (de) 2009-09-02
KR20070078988A (ko) 2007-08-03

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