TW200744792A - Polishing pad, pad dressing evaluation method, and polishing apparatus - Google Patents

Polishing pad, pad dressing evaluation method, and polishing apparatus

Info

Publication number
TW200744792A
TW200744792A TW095131781A TW95131781A TW200744792A TW 200744792 A TW200744792 A TW 200744792A TW 095131781 A TW095131781 A TW 095131781A TW 95131781 A TW95131781 A TW 95131781A TW 200744792 A TW200744792 A TW 200744792A
Authority
TW
Taiwan
Prior art keywords
pad
polishing
polishing pad
dressing
evaluation method
Prior art date
Application number
TW095131781A
Other languages
Chinese (zh)
Inventor
Takashi Fujita
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of TW200744792A publication Critical patent/TW200744792A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The present invention provides: a polishing apparatus for polishing a workpiece, comprising a polishing pad whose surface or surface layer part is colored with a color different from a color inside the polishing pad, a pad dresser which performs dressing of the polishing pad, and an observing device which observes the surface of the polishing pad; and a method for simply and accurately monitoring the uniformity of dressing state of a polishing pad in dressing the polishing pad of a polishing apparatus such as a CMP device, in order to prolong the life of the polishing pad, and to reduce the number of dummy wafers used in the pad dressing.
TW095131781A 2005-08-30 2006-08-29 Polishing pad, pad dressing evaluation method, and polishing apparatus TW200744792A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005250124A JP4756583B2 (en) 2005-08-30 2005-08-30 Polishing pad, pad dressing evaluation method, and polishing apparatus

Publications (1)

Publication Number Publication Date
TW200744792A true TW200744792A (en) 2007-12-16

Family

ID=37804914

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095131781A TW200744792A (en) 2005-08-30 2006-08-29 Polishing pad, pad dressing evaluation method, and polishing apparatus

Country Status (4)

Country Link
US (1) US20070049168A1 (en)
JP (1) JP4756583B2 (en)
KR (1) KR20070026021A (en)
TW (1) TW200744792A (en)

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JP5194516B2 (en) * 2007-03-30 2013-05-08 富士通セミコンダクター株式会社 Management method for chemical mechanical polishing equipment
JP2010149259A (en) * 2008-12-26 2010-07-08 Nitta Haas Inc Abrasive cloth
JP5898420B2 (en) 2011-06-08 2016-04-06 株式会社荏原製作所 Polishing pad conditioning method and apparatus
TWI511836B (en) * 2013-05-09 2015-12-11 Kinik Co Detection apparatus and method of chemical mechanical polishing conditioner
JP6010511B2 (en) * 2013-08-22 2016-10-19 株式会社荏原製作所 Method for measuring surface roughness of polishing pad
TWI551399B (en) * 2014-01-20 2016-10-01 中國砂輪企業股份有限公司 Chemical mechanical polishing conditioner with high quality abrasive particles
JP2017537480A (en) * 2014-11-23 2017-12-14 エム キューブド テクノロジーズＭ Ｃｕｂｅｄ Ｔｅｃｈｎｏｌｏｇｉｅｓ Manufacture and repair of wafer pin chuck
US10790181B2 (en) 2015-08-14 2020-09-29 M Cubed Technologies, Inc. Wafer chuck featuring reduced friction support surface
EP3334561B1 (en) 2015-08-14 2023-12-20 M Cubed Technologies Inc. Machine for finishing a work piece, and having a highly controllable treatment tool
WO2017030841A1 (en) 2015-08-14 2017-02-23 M Cubed Technologies, Inc. Method for removing contamination from a chuck surface
WO2017030867A2 (en) 2015-08-14 2017-02-23 M Cubed Technologies, Inc. Method for deterministic finishing of a chuck surface
WO2017146743A1 (en) * 2016-02-27 2017-08-31 Intel Corporation Pad surface roughness change metrics for chemical mechanical polishing conditioning disks
US9802293B1 (en) * 2016-09-29 2017-10-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method to shape the surface of chemical mechanical polishing pads
KR102570853B1 (en) * 2017-08-10 2023-08-25 도쿄엘렉트론가부시키가이샤 Dressing apparatus and dressing method for substrate rear surface polishing member
JP7169769B2 (en) * 2017-08-10 2022-11-11 東京エレクトロン株式会社 Dressing device and dressing method for substrate backside polishing member
CN109420973B (en) * 2017-09-05 2020-11-17 联华电子股份有限公司 Wafer polishing disk and use method thereof
CN108500843B (en) * 2018-04-04 2020-01-14 河南科技学院 Abrasive jet flow self-adaptive finishing method for fixed abrasive polishing pad
JP6713015B2 (en) * 2018-04-13 2020-06-24 株式会社大気社 Automatic polishing system
KR102580487B1 (en) * 2018-06-18 2023-09-21 주식회사 케이씨텍 Pad monitoring apparatus and pad monotirng system, pad monitoring method
CN109410806A (en) 2018-10-30 2019-03-01 重庆先进光电显示技术研究院 A kind of method and tester table of the common voltage of quick searching display panel
JP6822518B2 (en) * 2019-05-14 2021-01-27 株式会社Sumco Polishing pad management method and polishing pad management system
WO2020255744A1 (en) * 2019-06-19 2020-12-24 株式会社クラレ Polishing pad, method for manufacturing polishing pad, and polishing method
CN114454256B (en) * 2022-01-08 2023-10-13 奥士康科技股份有限公司 Control method for prolonging grinding life of PCB drill bit
JP7746217B2 (en) * 2022-05-13 2025-09-30 株式会社荏原製作所 Processing system and pad transport device
CN115890473A (en) * 2022-12-15 2023-04-04 西安奕斯伟材料科技有限公司 Polishing equipment and polishing pad testing method

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Also Published As

Publication number Publication date
US20070049168A1 (en) 2007-03-01
JP4756583B2 (en) 2011-08-24
JP2007067110A (en) 2007-03-15
KR20070026021A (en) 2007-03-08

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