TW200745199A - Thermally curable epoxy-amine barrier sealants - Google Patents
Thermally curable epoxy-amine barrier sealantsInfo
- Publication number
- TW200745199A TW200745199A TW096110912A TW96110912A TW200745199A TW 200745199 A TW200745199 A TW 200745199A TW 096110912 A TW096110912 A TW 096110912A TW 96110912 A TW96110912 A TW 96110912A TW 200745199 A TW200745199 A TW 200745199A
- Authority
- TW
- Taiwan
- Prior art keywords
- optionally
- curable epoxy
- thermally curable
- resin
- barrier sealants
- Prior art date
Links
- 230000004888 barrier function Effects 0.000 title abstract 3
- 239000000565 sealant Substances 0.000 title 1
- 239000000945 filler Substances 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- 239000002318 adhesion promoter Substances 0.000 abstract 1
- 150000001491 aromatic compounds Chemical class 0.000 abstract 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 abstract 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5006—Amines aliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2006/012657 WO2007114822A1 (en) | 2006-03-30 | 2006-03-30 | Thermally curable epoxy-amine barrier sealants |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200745199A true TW200745199A (en) | 2007-12-16 |
Family
ID=37946707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096110912A TW200745199A (en) | 2006-03-30 | 2007-03-29 | Thermally curable epoxy-amine barrier sealants |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20100168279A1 (zh) |
| EP (1) | EP2001924A1 (zh) |
| JP (1) | JP5373595B2 (zh) |
| KR (1) | KR101286745B1 (zh) |
| CN (1) | CN101405321A (zh) |
| TW (1) | TW200745199A (zh) |
| WO (1) | WO2007114822A1 (zh) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ITMI20082206A1 (it) * | 2008-12-12 | 2010-06-13 | Getters Spa | Materiale composito per la protezione di dispositivi sensibili ad h2o costituito da nanozeoliti disperse in una matrice polimerica |
| US9136195B2 (en) | 2009-07-17 | 2015-09-15 | Tyco Electronics Corporation | Oxygen barrier compositions and related methods |
| US8525635B2 (en) | 2009-07-17 | 2013-09-03 | Tyco Electronics Corporation | Oxygen-barrier packaged surface mount device |
| JP2016011428A (ja) * | 2010-11-26 | 2016-01-21 | 日立化成株式会社 | 封止用エポキシ樹脂成形材料、及びこの成形材料で封止した素子を備えた電子部品装置 |
| KR101387179B1 (ko) * | 2011-11-18 | 2014-04-21 | 주식회사 엘지화학 | 접착 필름 및 이를 이용한 유기전자장치의 봉지 방법 |
| JP6069047B2 (ja) * | 2012-04-27 | 2017-01-25 | 花王株式会社 | 鋳型造型用硬化剤組成物 |
| US9345813B2 (en) * | 2012-06-07 | 2016-05-24 | Medos International S.A.R.L. | Three dimensional packaging for medical implants |
| CN102945927B (zh) * | 2012-11-09 | 2015-01-28 | 京东方科技集团股份有限公司 | 一种封装方法及显示器件 |
| KR102131211B1 (ko) * | 2012-11-13 | 2020-07-08 | 다우 글로벌 테크놀로지스 엘엘씨 | 수지 이송 성형 공정을 위한 폴리에틸렌 테트라아민을 함유하는 에폭시 수지 시스템 |
| WO2017166188A1 (en) * | 2016-03-31 | 2017-10-05 | Henkel Ag & Co. Kgaa | A latent curing accelerator composition and a one-part curable adhesive composition comprising the same |
| CN116041669B (zh) * | 2022-12-29 | 2024-07-02 | 中国建筑材料科学研究总院有限公司 | 环氧树脂单体及其制备方法和应用 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2903381A (en) * | 1954-09-03 | 1959-09-08 | Shell Dev | Treatment of synthetic textiles with a polyepoxide having a plurality of 1,2 epoxy groups |
| US3160518A (en) * | 1961-09-21 | 1964-12-08 | Shell Oil Co | Process for treating and repairing surfaces immersed in water |
| US3637902A (en) * | 1969-08-26 | 1972-01-25 | Celanese Coatings Co | Epoxide resins cured with amine-glycidyl ester adducts in admixture with a phenolic accelerator |
| JPS59225775A (ja) * | 1983-06-02 | 1984-12-18 | Mitsubishi Petrochem Co Ltd | 樹脂被覆金属の製造方法 |
| JPS6289720A (ja) * | 1985-10-15 | 1987-04-24 | Ube Ind Ltd | 電子・電気部品注型用エポキシ樹脂組成物 |
| US5006381A (en) * | 1988-02-04 | 1991-04-09 | Ppg Industries, Inc. | Ungelled polyamine-polyepoxide resins |
| ATE163949T1 (de) * | 1990-10-03 | 1998-03-15 | Dow Chemical Co | Hydroxy-funktionalisierte polyetheramine zur verwendung als sperrschicht bei sauerstoffempfindlichen materialien |
| US5621025A (en) * | 1990-10-19 | 1997-04-15 | Power Lone Star, Inc. | Polymer concrete coating for pipe tubular shapes, other metal members and metal structures |
| JPH04348120A (ja) * | 1991-05-24 | 1992-12-03 | Nippon Kayaku Co Ltd | 封止用エポキシ樹脂組成物 |
| WO1996018669A1 (en) * | 1994-12-16 | 1996-06-20 | Ppg Industries, Inc. | Epoxy-amine barrier coatings with aryloxy or aryloate groups |
| JP2000351831A (ja) * | 1999-06-11 | 2000-12-19 | Nippon Kayaku Co Ltd | 光半導体封止用エポキシ樹脂組成物 |
| JP4280892B2 (ja) * | 2001-04-03 | 2009-06-17 | 三菱瓦斯化学株式会社 | ガスバリア性積層体 |
| US7163727B2 (en) * | 2003-10-23 | 2007-01-16 | Toray Plastics (America), Inc. | Multi-layer barrier film structure |
-
2006
- 2006-03-30 US US12/293,741 patent/US20100168279A1/en not_active Abandoned
- 2006-03-30 KR KR1020087023789A patent/KR101286745B1/ko not_active Expired - Fee Related
- 2006-03-30 EP EP06844085A patent/EP2001924A1/en not_active Withdrawn
- 2006-03-30 CN CNA2006800540253A patent/CN101405321A/zh active Pending
- 2006-03-30 JP JP2009502742A patent/JP5373595B2/ja not_active Expired - Fee Related
- 2006-03-30 WO PCT/US2006/012657 patent/WO2007114822A1/en not_active Ceased
-
2007
- 2007-03-29 TW TW096110912A patent/TW200745199A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US20100168279A1 (en) | 2010-07-01 |
| JP5373595B2 (ja) | 2013-12-18 |
| KR20080104037A (ko) | 2008-11-28 |
| EP2001924A1 (en) | 2008-12-17 |
| CN101405321A (zh) | 2009-04-08 |
| JP2009532519A (ja) | 2009-09-10 |
| KR101286745B1 (ko) | 2013-07-15 |
| WO2007114822A1 (en) | 2007-10-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200745199A (en) | Thermally curable epoxy-amine barrier sealants | |
| WO2009001658A1 (ja) | 一液型シアネート-エポキシ複合樹脂組成物 | |
| WO2011116050A3 (en) | Curing agents for epoxy resins | |
| BRPI0717676A2 (pt) | "composição de endurecedor para resinas epóxi, composição de endurecedor de pré-polímero para resinas epóxi, formulação curável, método para aderir dois substratos, método para revestir um substrato, resina epóxi aquosa e método para produzir uma composição de endurecedor de pré-polímero". | |
| DE602007005002D1 (de) | Modifizierte hydrocarbylphenol-aldehydharze als klebrigmacher und diese enthaltende kautschukzusammensetzungen | |
| WO2010024642A3 (en) | Phenol novolac resin, phenol novolac epoxy resin and epoxy resin composition | |
| RU2017132420A (ru) | Праймер или адгезив на основе эпоксидной смолы холодного отвеждения | |
| WO2009038960A3 (en) | Flexible epoxy-based compositions | |
| DE602007006345D1 (de) | Härtbare silikonzusammensetzung und elektronikbauteil | |
| BRPI0817181A8 (pt) | Polímero termofixo contendo anel de oxazolidinona terminado por epóxi, composição termofixa de revestimento em pó, substrato, método para prover um substrato com um revestimento epóxi ligado por fusão (fbe), substrato revestido, método para preparar um polimero contendo um anel de oxazolidinona terminado por epóxi e polímero | |
| ATE483751T1 (de) | Hitzehärtende epoxidharzzusammensetzungen einsetzbar als rohbauklebstoff oder strukturschaum | |
| WO2009011777A3 (en) | Curable silicon-containing compositions possessing high translucency | |
| WO2010114279A3 (en) | Phosphorus-containing phenol novolac resin, hardener comprising the same and epoxy resin composition | |
| MY142243A (en) | Curing accelerator, epoxy resin composition, and semiconductor device | |
| TW200745198A (en) | Epoxy resin curable composition for prepreg | |
| ATE524533T1 (de) | Anisotrope leitfähige klebstoffe | |
| AR068732A1 (es) | Resina epoxica modificada con isocianato y composiciones de recubrimiento de polvo epoxico de la misma | |
| MY155689A (en) | Resin composition for encapsulating semiconductor and semiconductor device | |
| MY146603A (en) | Expoxy resin composition, products of curing thereof, material for the encapsulation of semiconductors, novel phenol resin, novel expoxy resin, process for production of novel phenol resin and process for production of novel epoxy resin | |
| MY156450A (en) | Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material | |
| ATE365758T1 (de) | Nichtfliessende unterfüllungszusammensetzung | |
| TW200745194A (en) | Epoxy resin hardener and epoxy resin composition | |
| WO2009060576A1 (ja) | 粉末状エポキシ樹脂用潜在性硬化剤の製造方法、その方法によって得られた粉末状エポキシ樹脂用潜在性硬化剤、及びそれを用いた硬化性エポキシ樹脂組成物 | |
| WO2008143314A1 (ja) | 液状エポキシ樹脂、エポキシ樹脂組成物、および硬化物 | |
| DK1996641T3 (da) | Anvendelse af en substitueret guanidinforbindelse som en hærder for epoxyharpikser |