TW200802441A - Ceramic capacitor mounting structure and ceramic capacitor - Google Patents

Ceramic capacitor mounting structure and ceramic capacitor

Info

Publication number
TW200802441A
TW200802441A TW096104533A TW96104533A TW200802441A TW 200802441 A TW200802441 A TW 200802441A TW 096104533 A TW096104533 A TW 096104533A TW 96104533 A TW96104533 A TW 96104533A TW 200802441 A TW200802441 A TW 200802441A
Authority
TW
Taiwan
Prior art keywords
ceramic capacitor
terminal
mounting structure
connecting portion
capacitor
Prior art date
Application number
TW096104533A
Other languages
English (en)
Other versions
TWI374463B (en
Inventor
Masaaki Togashi
Kentaro Ushioda
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corp filed Critical Tdk Corp
Publication of TW200802441A publication Critical patent/TW200802441A/zh
Application granted granted Critical
Publication of TWI374463B publication Critical patent/TWI374463B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21B—MANUFACTURE OF IRON OR STEEL
    • C21B7/00—Blast furnaces
    • C21B7/14—Discharging devices, e.g. for slag
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21B—MANUFACTURE OF IRON OR STEEL
    • C21B7/00—Blast furnaces
    • C21B7/04—Blast furnaces with special refractories
    • C21B7/06—Linings for furnaces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D3/00—Charging; Discharging; Manipulation of charge
    • F27D3/14—Charging or discharging liquid or molten material
    • F27D3/145—Runners therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D21/00—Arrangement of monitoring devices; Arrangement of safety devices
    • F27D2021/0057—Security or safety devices, e.g. for protection against heat, noise, pollution or too much duress; Ergonomic aspects
    • F27D2021/0085—Security or safety devices, e.g. for protection against heat, noise, pollution or too much duress; Ergonomic aspects against molten metal, e.g. leakage or splashes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10469—Asymmetrically mounted component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10818—Flat leads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Ceramic Capacitors (AREA)
TW096104533A 2006-02-14 2007-02-08 Ceramic capacitor mounting structure and ceramic capacitor TWI374463B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006037026A JP2007220751A (ja) 2006-02-14 2006-02-14 セラミックコンデンサの実装構造及びセラミックコンデンサ

Publications (2)

Publication Number Publication Date
TW200802441A true TW200802441A (en) 2008-01-01
TWI374463B TWI374463B (en) 2012-10-11

Family

ID=38368194

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096104533A TWI374463B (en) 2006-02-14 2007-02-08 Ceramic capacitor mounting structure and ceramic capacitor

Country Status (5)

Country Link
US (1) US7365957B2 (zh)
JP (1) JP2007220751A (zh)
KR (1) KR100865636B1 (zh)
CN (1) CN100578699C (zh)
TW (1) TWI374463B (zh)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7633739B2 (en) * 2007-05-24 2009-12-15 Daniel Devoe Stacked multilayer capacitor
US20080291602A1 (en) * 2007-05-24 2008-11-27 Daniel Devoe Stacked multilayer capacitor
US8289675B2 (en) * 2007-05-24 2012-10-16 Daniel Devoe Stacked multilayer capacitor
DE102007044604A1 (de) * 2007-09-19 2009-04-09 Epcos Ag Elektrisches Vielschichtbauelement
TWI357789B (en) * 2008-09-03 2012-02-01 Chimei Innolux Corp Layout structure and method for reducing audible n
CN102232234B (zh) * 2009-01-29 2012-10-24 株式会社村田制作所 陶瓷电子部件
JP4924698B2 (ja) * 2009-11-11 2012-04-25 Ｔｄｋ株式会社 電子部品実装構造
JP5154676B2 (ja) * 2011-06-29 2013-02-27 双信電機株式会社 コンデンサ
JP2013149675A (ja) * 2012-01-17 2013-08-01 Murata Mfg Co Ltd セラミックコンデンサ
WO2013163416A1 (en) 2012-04-27 2013-10-31 Kemet Electronics Corporation Coefficient of thermal expansion compensating compliant component
JP5874682B2 (ja) * 2012-08-09 2016-03-02 株式会社村田製作所 コンデンサ部品及びコンデンサ部品実装構造体
US9042079B2 (en) * 2012-08-24 2015-05-26 Tdk Corporation Ceramic electronic component
JP6036408B2 (ja) * 2013-02-28 2016-11-30 株式会社デンソー 電子部品及び電子制御装置
DE102013102278A1 (de) * 2013-03-07 2014-09-11 Epcos Ag Kondensatoranordnung
JP2015008270A (ja) * 2013-05-27 2015-01-15 株式会社村田製作所 セラミック電子部品
JP6372067B2 (ja) * 2013-11-08 2018-08-15 Tdk株式会社 セラミック電子部品
US20160055976A1 (en) * 2014-08-25 2016-02-25 Qualcomm Incorporated Package substrates including embedded capacitors
JP6694235B2 (ja) * 2015-01-29 2020-05-13 Tdk株式会社 電子部品
JP6656000B2 (ja) * 2016-01-28 2020-03-04 三菱電機株式会社 電子部品モジュール、回路モジュール、電子部品モジュールの製造方法及び回路モジュールの製造方法
WO2018213288A1 (en) 2017-05-15 2018-11-22 Avx Corporation Multilayer capacitor and circuit board containing the same
JP2020526041A (ja) * 2017-06-29 2020-08-27 エイブイエックス コーポレイション 表面実装積層結合コンデンサ、およびそれを含む回路板
KR20190121179A (ko) * 2018-09-13 2019-10-25 삼성전기주식회사 전자 부품
US10916493B2 (en) * 2018-11-27 2021-02-09 International Business Machines Corporation Direct current blocking capacitors
KR20260085176A (ko) 2019-02-13 2026-06-08 교세라 에이브이엑스 컴포넌츠 코포레이션 전도성 비아들을 포함하는 다층 세라믹 커패시터
WO2023283292A1 (en) 2021-07-08 2023-01-12 KYOCERA AVX Components Corporation Multilayer ceramic capacitor
CN115881431A (zh) * 2021-09-28 2023-03-31 Tdk株式会社 带金属端子的电子部件
EP4427553A1 (en) * 2021-11-03 2024-09-11 Kromek Limited Stand off structures for electronic circuits
JP2026510132A (ja) 2022-10-31 2026-04-01 キョーセラ・エーブイエックス・コンポーネンツ・コーポレーション 多層コンデンサ
JP2026510128A (ja) 2022-10-31 2026-04-01 キョーセラ・エーブイエックス・コンポーネンツ・コーポレーション 多層コンデンサ

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4346429A (en) * 1980-07-09 1982-08-24 Union Carbide Corporation Multilayer ceramic capacitor with foil terminal
JP2528326B2 (ja) * 1987-07-30 1996-08-28 太陽誘電株式会社 回路基板に対するコンデンサの取付方法
JPH06251996A (ja) * 1993-02-26 1994-09-09 Mitsubishi Materials Corp Ｌｃフィルタアレイ
GB9814317D0 (en) * 1997-07-23 1998-09-02 Murata Manufacturing Co Ceramic electronic part and method for producing the same
JP3777856B2 (ja) * 1998-11-20 2006-05-24 松下電器産業株式会社 面実装用電子部品
JP3805146B2 (ja) 1998-12-09 2006-08-02 太陽誘電株式会社 積層セラミックコンデンサの回路基板実装方法及び回路基板
EP1950775B1 (en) * 1998-12-15 2013-07-03 Murata Manufacturing Co. Ltd. Monolithic ceramic capacitor
JP2000235932A (ja) * 1999-02-16 2000-08-29 Murata Mfg Co Ltd セラミック電子部品
AU1198700A (en) * 1999-03-16 2000-10-04 Maxwell Energy Products Low inductance four terminal capacitor lead frame
US6396682B1 (en) * 2000-01-31 2002-05-28 Ness Capacitor Co., Ltd. Electric energy storage device and method for manufacturing the same
JP2004253425A (ja) * 2003-02-18 2004-09-09 Tdk Corp 積層コンデンサ
US6958899B2 (en) * 2003-03-20 2005-10-25 Tdk Corporation Electronic device
US6903920B1 (en) * 2004-08-06 2005-06-07 Kemet Electronics Clip-on leadframe for large ceramic SMD

Also Published As

Publication number Publication date
KR20070082025A (ko) 2007-08-20
CN100578699C (zh) 2010-01-06
KR100865636B1 (ko) 2008-10-29
CN101022055A (zh) 2007-08-22
US20070188975A1 (en) 2007-08-16
TWI374463B (en) 2012-10-11
US7365957B2 (en) 2008-04-29
JP2007220751A (ja) 2007-08-30

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