TW200806145A - Optical/electronic circuit film and electronic machine including that - Google Patents

Optical/electronic circuit film and electronic machine including that Download PDF

Info

Publication number: TW200806145A
Authority: TW; Taiwan
Prior art keywords: film; optical waveguide; opto; electric; slit
Prior art date: 2006-05-12

Application number

TW096116850A

Other languages

English (en)

Chinese (zh)

Other versions

TWI326571B (2

Inventor

Tsuyoshi Shioda

Kazuhiro Yamada

Original Assignee

Mitsui Chemicals Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2006-05-12

Filing date

2007-05-11

Publication date

2008-01-16

2007-05-11 Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc

2008-01-16 Publication of TW200806145A publication Critical patent/TW200806145A/zh

2010-06-21 Application granted granted Critical

2010-06-21 Publication of TWI326571B publication Critical patent/TWI326571B/zh

Links

230000003287 optical effect Effects 0.000 title claims abstract description 93
238000000926 separation method Methods 0.000 claims abstract description 43
239000010408 film Substances 0.000 description 230
239000010410 layer Substances 0.000 description 32
238000012360 testing method Methods 0.000 description 14
238000005520 cutting process Methods 0.000 description 11
239000004020 conductor Substances 0.000 description 8
239000000853 adhesive Substances 0.000 description 7
230000001070 adhesive effect Effects 0.000 description 7
238000000034 method Methods 0.000 description 6
238000009429 electrical wiring Methods 0.000 description 5
229920002799 BoPET Polymers 0.000 description 4
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
239000012790 adhesive layer Substances 0.000 description 4
239000002390 adhesive tape Substances 0.000 description 4
230000005540 biological transmission Effects 0.000 description 4
238000005253 cladding Methods 0.000 description 4
229910052802 copper Inorganic materials 0.000 description 4
239000010949 copper Substances 0.000 description 4
238000004519 manufacturing process Methods 0.000 description 4
239000002861 polymer material Substances 0.000 description 4
239000000243 solution Substances 0.000 description 4
239000000126 substance Substances 0.000 description 4
KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 3
239000011247 coating layer Substances 0.000 description 3
239000012792 core layer Substances 0.000 description 3
238000010438 heat treatment Methods 0.000 description 3
239000000463 material Substances 0.000 description 3
230000000149 penetrating effect Effects 0.000 description 3
229910052707 ruthenium Inorganic materials 0.000 description 3
KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
239000002253 acid Substances 0.000 description 2
239000002313 adhesive film Substances 0.000 description 2
238000005452 bending Methods 0.000 description 2
230000000052 comparative effect Effects 0.000 description 2
ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
230000000694 effects Effects 0.000 description 2
239000011521 glass Substances 0.000 description 2
239000012212 insulator Substances 0.000 description 2
238000010030 laminating Methods 0.000 description 2
238000002156 mixing Methods 0.000 description 2
229920001721 polyimide Polymers 0.000 description 2
238000012545 processing Methods 0.000 description 2
239000000758 substrate Substances 0.000 description 2
239000004593 Epoxy Substances 0.000 description 1
VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
239000005977 Ethylene Substances 0.000 description 1
CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
241000283973 Oryctolagus cuniculus Species 0.000 description 1
241000282320 Panthera leo Species 0.000 description 1
235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
235000011613 Pinus brutia Nutrition 0.000 description 1
241000018646 Pinus brutia Species 0.000 description 1
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
241000270708 Testudinidae Species 0.000 description 1
GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
239000007864 aqueous solution Substances 0.000 description 1
235000010290 biphenyl Nutrition 0.000 description 1
239000004305 biphenyl Substances 0.000 description 1
-1 carboxyphenyl Chemical group 0.000 description 1
238000006243 chemical reaction Methods 0.000 description 1
239000003795 chemical substances by application Substances 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
239000012141 concentrate Substances 0.000 description 1
238000012937 correction Methods 0.000 description 1
230000005611 electricity Effects 0.000 description 1
229920006332 epoxy adhesive Polymers 0.000 description 1
238000005530 etching Methods 0.000 description 1
239000004744 fabric Substances 0.000 description 1
238000009396 hybridization Methods 0.000 description 1
150000002466 imines Chemical class 0.000 description 1
238000009413 insulation Methods 0.000 description 1
238000011835 investigation Methods 0.000 description 1
239000005001 laminate film Substances 0.000 description 1
229910052751 metal Inorganic materials 0.000 description 1
239000002184 metal Substances 0.000 description 1
239000000203 mixture Substances 0.000 description 1
238000000465 moulding Methods 0.000 description 1
239000012788 optical film Substances 0.000 description 1
238000007254 oxidation reaction Methods 0.000 description 1
238000000059 patterning Methods 0.000 description 1
229920000768 polyamine Polymers 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
239000002243 precursor Substances 0.000 description 1
125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
229920005989 resin Polymers 0.000 description 1
239000011347 resin Substances 0.000 description 1
229910052710 silicon Inorganic materials 0.000 description 1
239000010703 silicon Substances 0.000 description 1
239000002689 soil Substances 0.000 description 1
239000007787 solid Substances 0.000 description 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
239000002023 wood Substances 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09109—Locally detached layers, e.g. in multilayer

Landscapes

Physics & Mathematics (AREA)
Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
General Physics & Mathematics (AREA)
Optics & Photonics (AREA)
Optical Integrated Circuits (AREA)
Structure Of Printed Boards (AREA)

TW096116850A 2006-05-12 2007-05-11 Optical/electronic circuit film and electronic machine including that TW200806145A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2006134495		2006-05-12

Publications (2)

Publication Number	Publication Date
TW200806145A true TW200806145A (en)	2008-01-16
TWI326571B TWI326571B (2)	2010-06-21

Family

ID=38693845

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW096116850A TW200806145A (en)	2006-05-12	2007-05-11	Optical/electronic circuit film and electronic machine including that

Country Status (7)

Country	Link
US (1)	US7844143B2 (2)
EP (1)	EP2019327A4 (2)
JP (1)	JP4418508B2 (2)
KR (1)	KR101027206B1 (2)
CN (1)	CN101421648B (2)
TW (1)	TW200806145A (2)
WO (1)	WO2007132751A1 (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI451141B (zh) *	2008-06-10	2014-09-01	Sumitomo Bakelite Co	電子機器、行動電話機、可撓電纜、光波導形成體之製造方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPWO2009096067A1 (ja) *	2008-02-01	2011-05-26	日立化成工業株式会社	光電気混載基板及び電子機器
JP5109934B2 (ja) *	2008-11-07	2012-12-26	日立化成工業株式会社	フレキシブル光電気混載基板及び電子機器
JPWO2010058476A1 (ja)	2008-11-21	2012-04-12	日立化成工業株式会社	光電気混載基板及び電子機器
JP5321077B2 (ja) *	2009-01-19	2013-10-23	住友ベークライト株式会社	光導波路および光導波路モジュール
JP2010204609A (ja) *	2009-03-06	2010-09-16	Mitsumi Electric Co Ltd	フィルム光導波路
JP5262977B2 (ja) *	2009-05-14	2013-08-14	住友ベークライト株式会社	光導波路組立体および電子機器
JP5278225B2 (ja) *	2009-07-29	2013-09-04	住友ベークライト株式会社	光導波路、光配線、光電気混載基板および電子機器
JP5558905B2 (ja) *	2010-05-07	2014-07-23	日本電信電話株式会社	光導波路フィルム
JP2013228467A (ja) *	2012-04-24	2013-11-07	Nippon Mektron Ltd	光電気混載フレキシブルプリント配線板、及びその製造方法
JP5574001B2 (ja) *	2013-03-22	2014-08-20	住友ベークライト株式会社	光導波路
KR102355459B1 (ko)	2015-08-11	2022-01-26	삼성전자주식회사	스타일러스 펜 및 이를 포함하는 전자장치
JP7101454B2 (ja) *	2016-12-28	2022-07-15	日東電工株式会社	光電気混載基板

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2813713B2 (ja)	1990-04-27	1998-10-22	日本電信電話株式会社	ポリイミド系光導波路
JPH05335696A (ja) *	1992-05-29	1993-12-17	Nippon Mektron Ltd	折曲げ容易な可撓性回路基板及びその製造法
JP2001201670A (ja)	2000-01-18	2001-07-27	Sony Corp	光モジュール
EP1286194A3 (en) *	2001-08-21	2004-05-19	Canon Kabushiki Kaisha	Optical waveguide apparatus
JP2003258390A (ja) *	2002-03-06	2003-09-12	Sumitomo Electric Printed Circuit Inc	フレキシブルプリント配線板
JP4243456B2 (ja)	2002-06-13	2009-03-25	京セラ株式会社	半導体装置
JP2004118117A (ja) *	2002-09-27	2004-04-15	Toshiba Corp	光導波路アレイフィルム
JP3990389B2 (ja)	2003-07-24	2007-10-10	Ｎｅｃアクセステクニカ株式会社	フレキシブル基板および電子装置
JP4112448B2 (ja) *	2003-07-28	2008-07-02	株式会社東芝	電気光配線基板及び半導体装置
US7184617B2 (en) *	2004-03-12	2007-02-27	Matsushita Electric Industrial Co., Ltd.	Portable device
JP4252022B2 (ja)	2004-09-14	2009-04-08	三井化学株式会社	光導波路基板、および光電気混載基板
JP4214406B2 (ja)	2004-09-27	2009-01-28	日本電気株式会社	光信号入出力機構を有する半導体装置
JP2006134495A (ja)	2004-11-08	2006-05-25	Matsushita Electric Ind Co Ltd	属性情報管理システム
JP2006171625A (ja) *	2004-12-20	2006-06-29	Japan Aviation Electronics Industry Ltd	光導波路及び電気配線混載回路、及びその製造方法

2007
- 2007-05-11 KR KR1020087027220A patent/KR101027206B1/ko not_active Expired - Fee Related
- 2007-05-11 TW TW096116850A patent/TW200806145A/zh not_active IP Right Cessation
- 2007-05-11 US US12/300,368 patent/US7844143B2/en not_active Expired - Fee Related
- 2007-05-11 EP EP07743145A patent/EP2019327A4/en not_active Withdrawn
- 2007-05-11 WO PCT/JP2007/059710 patent/WO2007132751A1/ja not_active Ceased
- 2007-05-11 JP JP2008515525A patent/JP4418508B2/ja not_active Expired - Fee Related
- 2007-05-11 CN CN2007800131449A patent/CN101421648B/zh not_active Expired - Fee Related

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI451141B (zh) *	2008-06-10	2014-09-01	Sumitomo Bakelite Co	電子機器、行動電話機、可撓電纜、光波導形成體之製造方法

Also Published As

Publication number	Publication date
CN101421648A (zh)	2009-04-29
KR101027206B1 (ko)	2011-04-06
US7844143B2 (en)	2010-11-30
JPWO2007132751A1 (ja)	2009-09-24
EP2019327A4 (en)	2012-09-05
WO2007132751A1 (ja)	2007-11-22
US20090317048A1 (en)	2009-12-24
KR20090007746A (ko)	2009-01-20
TWI326571B (2)	2010-06-21
CN101421648B (zh)	2010-12-15
EP2019327A1 (en)	2009-01-28
JP4418508B2 (ja)	2010-02-17

Legal Events

Date	Code	Title	Description
2018-03-21	MM4A	Annulment or lapse of patent due to non-payment of fees

Publication	Publication Date	Title
TW200806145A (en)	2008-01-16	Optical/electronic circuit film and electronic machine including that
KR100921866B1 (ko)	2009-10-13	광도파로 필름 및 광전기 혼재 필름
EP0961139A1 (en)	1999-12-01	Polymer optical waveguide, optical integrated circuit, optical module and optical communication apparatus
KR101180619B1 (ko)	2012-09-06	이방 도전 접속용 필름 및 릴체
KR102601787B1 (ko)	2023-11-13	접속 구조체의 제조 방법, 및 접속 구조체, 그리고 필름 구조체, 및 필름 구조체의 제조 방법
EP2202549A1 (en)	2010-06-30	Polymeric optical waveguide film
WO2008066159A1 (fr)	2008-06-05	Rotateur de polarisation et procédé de fabrication afférent
CN102197481B (zh)	2015-03-18	具有凹槽的微电子芯片与绳式配线元件的组件及装配方法
JP2013038379A (ja)	2013-02-21	折曲部を有する軟性回路基板及びその製造方法｛ＦＰＣＢｈａｖｉｎｇｂｅｎｄｉｎｇｐａｒｔａｎｄｍｅｔｈｏｄｔｈｅｓａｍｅ｝
CN101253433B (zh)	2012-10-10	光波导膜及其制造方法、包含它的光电混载膜及电子设备
CN101069111A (zh)	2007-11-07	光配线基板及光电混载基板
CN114207496A (zh)	2022-03-18	光电复合传输模块
KR102092437B1 (ko)	2020-03-23	광전기 혼재 모듈
JP2009103860A (ja)	2009-05-14	光導波路および光導波路製造方法
JP2007241162A (ja)	2007-09-20	光導波路素子および光電気混載素子
KR20080036053A (ko)	2008-04-24	도파로 필름 케이블
JP2006091500A (ja)	2006-04-06	光導波路が嵌め込まれた光導波路基板および光電気混載基板
CN120282701A (zh)	2025-07-08	一种压电传感器及其制备方法
KR20230157536A (ko)	2023-11-16	접속 구조체의 제조 방법, 및 접속 구조체, 그리고 필름 구조체, 및 필름 구조체의 제조 방법
JP2004286829A (ja)	2004-10-14	光モジュール、及びその製造方法
JP2001074953A (ja)	2001-03-23	平坦化層を備えた樹脂製光導波路、その製造方法および光部品
JP2009211979A (ja)	2009-09-17	フラットケーブルの製造方法
JP2001074957A (ja)	2001-03-23	コア位置を顕現化する被覆層を備えた光導波路、その製造方法および光部品
JP2010009994A (ja)	2010-01-14	同軸ケーブルアレイ及びその製造方法
JP2001074958A (ja)	2001-03-23	平坦化層を備えた樹脂製光導波路、その製造方法および光部品

TW200806145A - Optical/electronic circuit film and electronic machine including that - Google Patents

Info

Links

Classifications

Landscapes

Applications Claiming Priority (1)

Publications (2)

Family

ID=38693845

Family Applications (1)

Country Status (7)

Cited By (1)

Families Citing this family (12)

Family Cites Families (14)

Cited By (1)

Also Published As

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