TW200806568A - Method for production of a micromechanical component - Google Patents

Method for production of a micromechanical component Download PDF

Info

Publication number
TW200806568A
TW200806568A TW96112267A TW96112267A TW200806568A TW 200806568 A TW200806568 A TW 200806568A TW 96112267 A TW96112267 A TW 96112267A TW 96112267 A TW96112267 A TW 96112267A TW 200806568 A TW200806568 A TW 200806568A
Authority
TW
Taiwan
Prior art keywords
cavity
opening
plate
film
layer
Prior art date
Application number
TW96112267A
Other languages
English (en)
Chinese (zh)
Inventor
Roman Schlosser
Heribert Weber
Christoph Schelling
Stefan Weiss
Nicolaus Ulbrich
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of TW200806568A publication Critical patent/TW200806568A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00158—Diaphragms, membranes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2410/00—Microphones

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
TW96112267A 2006-04-10 2007-04-09 Method for production of a micromechanical component TW200806568A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200610016811 DE102006016811A1 (de) 2006-04-10 2006-04-10 Verfahren zur Herstellung eines mikromechanischen Bauelements

Publications (1)

Publication Number Publication Date
TW200806568A true TW200806568A (en) 2008-02-01

Family

ID=38336843

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96112267A TW200806568A (en) 2006-04-10 2007-04-09 Method for production of a micromechanical component

Country Status (4)

Country Link
EP (1) EP2008497A1 (de)
DE (1) DE102006016811A1 (de)
TW (1) TW200806568A (de)
WO (1) WO2007115914A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008040597A1 (de) 2008-07-22 2010-01-28 Robert Bosch Gmbh Mikromechanisches Bauelement mit Rückvolumen
DE102009028177A1 (de) * 2009-07-31 2011-02-10 Robert Bosch Gmbh Bauelement mit einer mikromechanischen Mikrofonstruktur und Verfahren zur Herstellung eines solchen Bauelements
US11873212B2 (en) * 2020-03-02 2024-01-16 Xintec Inc. Chip package and manufacturing method thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6741709B2 (en) * 2000-12-20 2004-05-25 Shure Incorporated Condenser microphone assembly
DE10160830A1 (de) * 2001-12-11 2003-06-26 Infineon Technologies Ag Mikromechanische Sensoren und Verfahren zur Herstellung derselben

Also Published As

Publication number Publication date
DE102006016811A1 (de) 2007-10-11
EP2008497A1 (de) 2008-12-31
WO2007115914A1 (de) 2007-10-18

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