200843902 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種可撓性研磨工具及其製作方法，尤 才曰一種適用於提高整體精度、增加使用壽命、降低工件 傷機率及生產成本之可撓性研磨工具及其製作方法。， 【先前技術】 (、 10 15 20 研磨拋光係使工件表面粗糙度及平坦度達到可許範 之超精密研磨技術’其常被廣泛使用於硬脆金屬、陶攻 賴及晶圓等材料表面之精密加卫，因此發展種種符^ 紅需求之研磨工具係目前極為重 衣 雖然研磨工具的製造及使用雖二歷史，仍有 ^缺t急需改善（如:、研磨顆粒附著不牢及研磨顆粒分佈 士 ：自知利用金屬或陶兗燒結、硬焊方式製作研磨工呈 :开基，容易因高溫製程而發生熱變形，0而必須擇： 變形較小之材質作為其好 ^ ^ -- 何貝作马基材，進而導致選基 :大之傷害高，其對研磨顆粒強度更有 口 丹有白知研磨工具之+厪丁说工n 私，; 士 八 < 孟屬工作面抗化性不 仫口而有研磨工具壽命較短之問題。 請參考mA至圖1B，其係為_習知研磨 程。百先’如圖1A所示，於—基材11G之工作面上 屬層丨2〇，並於該金屬層12〇 金 13。。接著，如_所示，經由二:里=個研磨顆粒 田皿處理使金屬層120熔解， 5 200843902 而該些研磨顆粒130之部分區域因而沉降於金屬層12〇中； 取後，經冷卻後，金屬層120固化，便可固定該些研磨顆粒 130於該金屬層120上，以形成—研磨工具1〇〇。其中，高溫 處理所造成之基材熱變形、研磨顆粒強度減弱、研磨:粒 5露出度控制不易、及金屬财化性不佳等問題仍有待解決。 【發明内容】 〇之主要目的係在提供—種具有較佳精度、較高 耐化性、較低生產成本、且可降丁 10 研磨工具。 ㈣機率之可撓性 為達成上述目的，本發明提供一種可 其包括：-軟基材；一黏著層’係位於該軟基材之表面. 以及禝數個研磨顆粒，係分佈於該黏著層之表面。义 15 本發明所提供之可撓性研磨工具復; 具有一工作面，且該軟其# . 土座，其 且4氣基材係位於該基座之嗲 而研磨顆粒係顯露於外。 Μ作面上， f 纟發明所提供之可撓性研磨工呈 層，係位於該基座與該軟基材之間/以匕括：―緩衝 工具於加工時所產生之康 綾衝该可撓性研磨 20 '皮士 生之應力’減少應力對該此研疳®』 4之損壞，進而降低工件到傷之機率；^研磨顆粒所 材料較佳為具彈性之發泡塑膠。 ”中，緩衝層之 於本發明所提供之可撓性研磨工且 :可為任何—具有高耐化學腐餘能力：料该黏著層之材 研磨工具之使用壽命；其中，較佳為環氧高該可 200843902 於本發明所提供之可撓性研磨工具中，該軟基材可為 =何；:具可撓性之材質，以降低精度誤差；其中，較佳為 聚對苯二甲酸乙二酯（pE丁）。 於本發明所提供之可择祕 之了祝丨生研磨工具中，該些研磨顆粒 可為任何一具高硬度性質之材質，如：氧化紹、碳化石夕、或 鑽石等，較佳為鑽石。 ▲於本务明所提供之可撓性研磨工具中，該黏著層厚 為 80/ζπι 〜300//m〇 10 15 本發明之另一目的係在提供一種可撓性研磨工具之製 =方法’以製得上述之可撓性研磨工具’並同時縮短生產 則置時間、有效降低生產成本及庫存、減少製程對可棱性 研磨工具之傷害、及降低其規格控制之困難度等等。 ，為達成上述目的，本發明提供一種可撓性研磨工具之 製作方法’其包括以下步驟：⑷提供—軟基材；⑼形成一 黏著層於該軟基材之表面上；以及（c)形成複數個研磨顆粒 於該黏著層之表面上。 於本發明所提供之可撓性研磨工具之製作方法中，於 步驟之後’更可包括-步驟（D):提供一基座，並固定該 軟基材於該基座之該工作面上，其中，該軟基材係位於該 基座與该黏著層之間，而該些研磨顆粒係顯露於外。 〜此外’於步驟⑼中更可包括：提供一緩衝層，且固定該 緩衝層於該基座與該軟基材之間，以緩衝可挽性研磨工具 於加工時所產生之應力’減少應力對該些研磨顆粒所造成 20 200843902 之抽壞’進而降低工杜 Μ ^ Λ ^ — 努之機率；其中，緩衝層之材料 季乂佺為具弹性之發泡塑膠。 η 於本發明所提供之可# . ^ j铫14研磨工具之製作方法中，步 知（c)之该些研磨顆粒 y 5 η 10 15 之表面上。該轉印步驟可;由由:轉印步驟，形成於該黏著層 主二 猎由將分佈於一黏性元件（如·®册、 表面之研磨.顆粒黏固於該 几件u幻 粒規則排列之可撓性研磨卫 ^顆 晶型較差之鑽石_，好/、外，祕研磨顆粒可為 :石顆粒’以增加可撓性研磨工具之加工效率。 、本♦明所提供之可撓性研磨工具之 驟（C)之該些研磨顆粒亦可藉 半取衣/ '，步 ^ . g 月文洛步驟’形成於該黏菩 n 表面上。該散落步驟可夢 —' 性之該黏性元件分離^使^研磨顆粒與失去點 上，以製得一呈有古力广亚固疋於該黏著層之表面 衣1于 异百同加工效牽夕"5T U· π — 較佳為，藉由一加埶戋光 70 茗工具。其中， 峨失去黏性。此、外^性元件（如：㈣膠或發 失去黏性之該黏性元件八離粒可错由-震動步驟.與 4 ! 生兀件刀離。该些研磨顆粒可 之鑽石顆粒，以降低因研磨顆粒破裂所造成之工件鮮 機Γ另外，於散落步驟中，該些研磨顆粒會自動^之 以隶小表面積沉降於今女斑装爲 轉向’ ㈣檟/儿P牛於.亥黏者層中，因而形成一 工效率之可撓性研磨工具。 土加 於本發明所提供之可撓性研磨工具之 黏著層可藉由一加熱或光照過程固化，以 此’該 粒於該黏著層上。此外，該黏著層之材料可為任； 20 200843902 回耐化學腐蝕能力之材料， 用壽命L垂… 撓性研磨工具之使 其中，較佳為環氧樹脂。 明所提供之可撓性研磨工具之製作方法中 5 10 15 ί. :需=個研磨顆粒之該軟基材可於需要時，再 β而之規格，以與基座結合，因應 勹 便可減少產品規格數，以有效降低：。見…，如此 軟二：:提:;:挽性研磨工_ 中，車父佳為聚對苯二甲酸乙二酉旨（ΡΕτ)。 、 於本發明所提供之可撓性研磨工具之 些研磨顆粒可為任何—具高硬度師之材^厂中，该 碳化石夕、或鑽石等，較佳為鑽石。 、°•氧化ί呂、 於本發明所提供之可撓性研磨工I制 黏著層厚度較佳約為⑽^ 〃衣作方法中，該 直徑較佳約為8。—。心。°^而該些研磨顆粒之 綜上所述，本發明所提供 序少，可有效降低生產成本；此外7 :二：之製作工 免傳統利用硬焊、燒結、或陶莞/、生產&度低，可避 遭破壞及產品變形之問題，並減少;粒強度 力導致研磨顆粒破裂而造成工:保顆粒表面因殘留應 明利用延遲產品規袼差異化之日士駐铸之機率。再者，本發 減少成品庫存。 、 ρ牛低Θ置時間，大量 【實施方式】 20 200843902 實施例1 °月ί考圖2A至圖2C，係為本發明一較佳具體實施例之 可祂性研磨工具之製作流程。本實施例係藉由一轉印步 驟’以製作一可撓性研磨工具2〇〇。 5 如圖2A所示，首先於一軟基材211之表面均勻塗佈一黏 著層212。接著，如圖2B所示，將黏貼於一黏性元件220之 複數個研磨顆粒213直接接觸該黏著層212之表面，隨後以 加熱=式使該黏著層212固化，以固定該些研磨顆粒213於 3黏著層2 12上。最後，如圖2C所示，直接移除該黏性元件 1〇 220，使該黏性元件220與該些研磨顆粒213分離，且該些研 磨顆粒213固定於該黏著層22〇上，以製得一可撓性研磨工 具 200。 本實施例之可撓性研磨工具2 〇 〇係在掃描式電子顯微 鏡（SEM)下進行外觀解析。圖3A、及_分別係本實施例 15單一研磨顆粒之放大影像圖、以及可撓性研磨工具2〇〇之工 作面影像圖。200843902 IX. Description of the Invention: [Technical Field] The present invention relates to a flexible abrasive tool and a method for fabricating the same, and is particularly suitable for improving overall accuracy, increasing service life, reducing workpiece injury rate and production cost. Flexible abrasive tool and method of making the same. [Prior Art] (10 15 20 Grinding and polishing system makes the surface roughness and flatness of the workpiece reach the ultra-precision grinding technology of the specification. It is often used in the surface of hard and brittle metals, ceramics and wafers. Precision and edging, so the development of various types of grinding tools is currently extremely heavy. Although the manufacturing and use of grinding tools is still in the history, there are still urgent needs to improve (such as: the adhesion of abrasive particles is not strong and the distribution of abrasive particles Shi: I know that the use of metal or ceramic sinter sintering, brazing method to make the grinding machine: open base, easy to thermal deformation due to high temperature process, 0 must choose: less deformed material as its good ^ ^ -- He Bei As a horse substrate, which leads to the selection of the base: the damage of the big one is high, and the strength of the abrasive particles is more versatile. There is a white grinding tool + 厪丁说工 n 私,; 士八< 孟属面面化化不仫There is a problem that the grinding tool has a short life. Please refer to mA to Fig. 1B, which is a conventional grinding process. The first one is as shown in Fig. 1A, and is on the working surface of the substrate 11G. And in the metal layer 12 sheet metal 13 . Next, as indicated by _, the metal layer 120 is melted by the treatment of the second abrasive grain processing, 5 200843902, and a part of the abrasive particles 130 is thus deposited in the metal layer 12〇; after being cooled, after cooling The metal layer 120 is cured, and the abrasive particles 130 can be fixed on the metal layer 120 to form a grinding tool 1 . Among them, the substrate is thermally deformed by the high temperature treatment, the strength of the abrasive particles is weakened, and the grinding is performed. 5 The problem of difficulty in controlling the degree of exposure and the poor metallization of the metal remains to be solved. [Summary of the Invention] The main purpose of the invention is to provide a kind of better precision, higher chemical resistance, lower production cost, and (4) The flexibility of the machine. To achieve the above object, the present invention provides a method comprising: - a soft substrate; an adhesive layer is located on the surface of the soft substrate; and a plurality of abrasive particles, Is distributed on the surface of the adhesive layer. The flexible abrasive tool provided by the present invention has a working surface, and the soft surface thereof, and the 4-gas substrate is located at the base of the base Abrasive particle system Exposed on the surface, the flexible abrasive layer provided by the invention is located between the base and the soft substrate/to the extent that: “The buffer tool is produced during processing.绫 该 该 该 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可The buffer layer is provided by the flexible abrasive provided by the present invention and may be any having high chemical resistance: the service life of the material grinding tool of the adhesive layer; wherein, preferably, the ring Oxygen high can be 200843902 In the flexible abrasive tool provided by the present invention, the soft substrate can be: ho; flexible material to reduce precision error; wherein, preferably, polyethylene terephthalate Ethylene glycol (pE). In the Zhu Yusheng abrasive tool provided by the present invention, the abrasive particles may be any material having high hardness properties, such as oxidized, carbonized stone, or diamond, preferably diamond. ▲In the flexible abrasive tool provided by the present invention, the adhesive layer has a thickness of 80/ζπι~300//m〇10 15 Another object of the present invention is to provide a method for manufacturing a flexible abrasive tool. 'To obtain the above-mentioned flexible abrasive tool' and at the same time shorten the production time, effectively reduce the production cost and inventory, reduce the damage of the process to the prismatic grinding tool, and reduce the difficulty of its specification control. To achieve the above object, the present invention provides a method of fabricating a flexible abrasive tool comprising the steps of: (4) providing a soft substrate; (9) forming an adhesive layer on the surface of the soft substrate; and (c) forming A plurality of abrasive particles are on the surface of the adhesive layer. In the manufacturing method of the flexible abrasive tool provided by the present invention, after the step, the method may further include: step (D): providing a pedestal and fixing the soft substrate on the working surface of the pedestal, Wherein, the soft substrate is located between the susceptor and the adhesive layer, and the abrasive particles are exposed. Further, in the step (9), the method further includes: providing a buffer layer, and fixing the buffer layer between the pedestal and the soft substrate to buffer the stress generated by the traversable abrasive tool during processing. The grinding particles caused the damage of 20 200843902, which in turn reduced the probability of the work, and the material of the buffer layer was elastic foamed plastic. η In the method for producing the abrasive tool provided by the present invention, the surface of the abrasive particles y 5 η 10 15 of the step (c) is stepped. The transfer step can be performed by: a transfer step, formed on the adhesive layer, the main two hunting will be distributed on a viscous element (eg, the surface of the surface, the granules are adhered to the several pieces of u magic particle rule Arranged for flexible grinding and polishing of diamonds with poor crystal form _, good /, outside, the secret grinding particles can be: stone particles 'to increase the processing efficiency of flexible grinding tools. The abrasive particles of the grinding tool (C) may also be formed on the surface of the clay by using a half-coating/', step ^. g yuwenluo step. The scattering step may be dreamy-' Separation of the viscous element ^Make the granules and the lost points, so as to produce a surface coating of the cohesive layer of the cosmopolitan granules in the surface of the same layer of processing effect "5T U · π - compared Good, with a Twilight 70 茗 tool. Among them, 峨 loses its viscosity. This, external element (such as: (4) glue or the viscous component that loses its viscosity, the granules can be wrong - vibration Steps and 4! Raw knives are separated. These abrasive particles can be used to reduce the freshness of the workpiece caused by the rupture of the abrasive particles. In addition, in the scattering step, the abrasive particles are automatically settled in a small surface area, and the current female spot is installed as a turn "(4) 槚 / 儿 P 牛 in the 黏 黏 layer, thus forming a work efficiency flexibility Abrasive tool. The adhesive layer of the flexible abrasive tool provided by the present invention can be cured by a heating or light process, so that the particle is on the adhesive layer. Further, the material of the adhesive layer can be any 20 200843902 Back to chemical resistance material, use life L.... Among the flexible abrasive tools, epoxy resin is preferred. 5 10 15 ί. The soft substrate that needs to be a grinding particle can be combined with the pedestal when needed, and the number of product specifications can be reduced according to the 勹, so as to effectively reduce: See..., so soft two: :;: Pulling abrasive _, the father of the car is polyethylene terephthalate (ΡΕτ). The abrasive particles of the flexible abrasive tool provided by the present invention may be any high hardness In the material of the division, the carbonized stone, or diamond, etc. Preferably, it is a diamond. The thickness of the adhesive layer of the flexible abrasive I provided by the present invention is preferably about (10). The diameter of the adhesive is preferably about 8. In view of the above-mentioned abrasive particles, the invention provides fewer orders and can effectively reduce the production cost; in addition, the production of the 7:2: is free of traditional use of brazing, sintering, or pottery/manufacturing Low degree, avoiding the problem of damage and product deformation, and reducing; the strength of the grain causes the rupture of the abrasive particles and causes the work: the surface of the granules should be distinguished by the residual product. Furthermore, the present invention reduces the inventory of finished products. ρ 牛 low set time, a large number of embodiments [Embodiment] 20 200843902 Embodiment 1 ° month 考 Figure 2A to 2C, which is a preferred embodiment of the present invention The process of making his sexual grinding tools. This embodiment employs a transfer step to fabricate a flexible abrasive tool 2''. As shown in Fig. 2A, an adhesive layer 212 is uniformly coated on the surface of a soft substrate 211. Next, as shown in FIG. 2B, a plurality of abrasive particles 213 adhered to a viscous member 220 are directly in contact with the surface of the adhesive layer 212, and then the adhesive layer 212 is cured by heating to fix the abrasive particles 213. On the 3 adhesive layer 2 12 . Finally, as shown in FIG. 2C, the adhesive element 1〇220 is directly removed, the adhesive element 220 is separated from the abrasive particles 213, and the abrasive particles 213 are fixed on the adhesive layer 22〇. A flexible abrasive tool 200 is obtained. The flexible abrasive tool 2 of the present embodiment was subjected to visual analysis under a scanning electron microscope (SEM). 3A and 3 are enlarged image views of a single abrasive particle of the present embodiment 15 and a working image image of the flexible abrasive tool 2, respectively.
20 於本實施例中，該黏著層212係—厚度約為1〇〇㈣〜細 之環氧樹脂；該軟基材211之材料為聚對苯二甲酸乙二 酿（PET);該黏性元件22〇係—膠帶；該些研磨顆粒213係為 晶型較差之鑽石顆粒，其直徑約為l3〇#m。 據此，藉由本實施例之轉印步驟，可輕易控制該些研 磨顆粒213於該黏著層212上之排列狀況。此外，本實施例 採用晶型較差之鑽石顆*，可使該可撓性研磨工I·之工 作面2_更具加工效率。再者，本實施例採用環氧樹脂作 10 200843902 為黏著層212，可大幅增加工作面2〇〇&之耐化性，以增加產 品之使用壽命。 實施例2 5 冑參考圖4A至圖4C，係、為本發明另-較佳具體實施例 之可撓I生研磨工具之製作流程。纟實施例係藉由一散落步 驟，以製作一可撓性研磨工具2〇〇。 ^如圖4A所示，首先於一軟基材211之表面均勻塗佈一黏 + 並長:仏表面黏貼有複數個研磨顆粒213之黏性 10兀件220。接著，如圖4B所示，利用一加熱過程，使表面黏 貼有複數個研磨顆粒213之黏性元件2戰去黏性，隨後震 動该黏性元件220，使該些研磨顆粒213與該黏性元件22〇分 離並自動散落於该黏著層212上，其中，該些研磨顆粒 會自動轉向，以最小表面積沉降於該黏著層212中。最後， 15如圖4C所示，藉由一加熱過程，使該黏著層212固化，而該 些研磨顆粒213則固定於該黏著層212上，以製得一可撓性 研磨工具2〇〇。 本實施例之可撓性研磨工具2〇〇係在掃描式電子顯微 鏡（SEM)下進行外觀解析。圖5係本實施例單一研磨顆粒之 20 放大影像圖。 於本貫施例中，該黏著層212係一厚度為1〇〇 # m〜2〇〇 //m之環氧樹脂；該軟基材211之材料為聚對苯二甲酸乙二 醋（PET)’·義性元件220係一發泡# ;該些研磨顆粒213係 為晶型較佳之鑽石顆粒，其直徑約為13〇//m。 11 200843902 據此，藉由本實施例之散落步驟，該些散落於該黏著 層212之研磨顆粒213將自動轉向，以最小表面積之晶面構 成該可撓性研磨工具2〇〇之工作面2〇〇a，使該可撓性研磨工 具200之工作面2〇〇a具更高之加工效率。 5 實施例3 本實施例之可撓性研磨工具之製作流程，與實施例2相 較’本實施例除了所使用之黏性元件22〇係為紫外膠（uv 膠），且利用一光照過程使黏性元件22〇失去黏性外，其餘 10 完全相同於實施例2中圖4A至圖4C所述之製作流程。 如圖4A所示，首先於一軟基材211之表面均勻塗佈一黏 著層212，並提供一表面黏貼有複數個研磨顆粒213之黏性 元件220。接著，如圖4B所示，利用一光照過程，使表面黏 貼有複數個研磨顆粒213之黏性元件220失去黏性，隨後震 15動該黏性元件220，使該些研磨顆粒213與該黏性元件220分 離，並自動散洛於該黏著層212上，其中，該些研磨顆粒2 j 3 會自動轉向，以最小表面積沉降於該黏著層2丨2中。最後， 如圖4C所示，藉由一加熱過程，使該黏著層212固化，而該 些研磨顆粒213則固定於該黏著層212上。 20 實施例4 請參考圖6A〜6C及圖7A〜7B，實施例丨所製得之可撓性 研磨工具200可進一步與一基座23〇結合，以製得一具有一 基座230之可撓性研磨工具3〇〇。 12 200843902 首先，請參考圖6A至6C，將實施例1所製得之可撓性 研磨工具200(如圖6A所示）裁切成所需規格（如圖6B及6C所 示）。 接著，請參考圖7A至圖7B，將該可撓性研磨工具200 5 之該軟基材211直接黏貼於一基座230之工作面230a上，以 製得鑽石顆粒規則排列且具高加工效率之可撓性研磨工具 300，如圖7B所示。 本實施例之可撓性研磨工具300係在掃描式電子顯微 鏡（SEM)下進行外觀解析。圖8係可撓性研磨工具300之外觀 10 影像圖。 於本實施例中，該基座230之工作面230a係一凸曲面， 而該軟基材211因具有極佳之可撓性，故可完全伏貼於該基 座230之工作面230a上，以有效降低精度誤差。 15 實施例5 請參考圖6A〜6C及圖9A〜9B，實施例2所製得之可撓性 研磨工具200可進一步與一基座250及一緩衝層240結合，以 製得一具有一基座250及一緩衝層240之可撓性研磨工具 400 ° 2〇 請參考圖6A至6C，將實施例2所製得之可撓性研磨工 具200,經由如實施例4所述之裁切步驟，裁切成所需規格。 接著，請參考圖9A至圖9B，依序固定一緩衝層240及 實施例2所製得之可撓性研磨工具200於一基座250之平坦 工作面250a上，以得到一具有高加工效率，且具有一基座 25 250及一緩衝層240之可撓性研磨工具400，如圖9B所示。 13 200843902 於本實施例中，該緩衝層24〇 膠，其可有效緩衝該可撓性研磨工^為具彈性之發泡塑 力’以減少應力對該些研磨 、广〇工時所產生之應 傷之機率。 研細立之知破’進而降低工件到 5 综上所述，本發明所提供之可繞 序少，可有效降低生產成本；此外，之製作工 免傳統利用硬焊、燒結、或 ::、產〉皿度低’可避 遭破壞及產品變形H /造成研磨顆粒強度 P力導致研磨顆粒破裂，進而迭成H磨顆粒表面因殘留應 10 本發明利用延遲產品規格差2之傷之機率。再者， 大量減少成品庫存。異化之時點’降低前置時間， 上述實施例僅係為了方# 主張之權利範圍自應以申舉例而已，本發明所 於上述實施例。 I專利孝巳圍所述為準，而非僅限 15 【圖式簡單說明】 圖1A至圖1B係習知研磨工具之製作流程。 圖2A至圖2C係本發明一鲈杜每^ U車又佳貫施例之可撓性研磨 製作流程。 '< 20 圖3A及圖3B分別係本發明—較佳實施例之單—研磨顆 之放大影像圖以及可撓性研磨工具之工作面影像圖。、 圖4A至圖4C係本發明另一鲈杜曰a — 力車乂佳具體實施例之可撓性研声 工具之製作流程。 ^ 14 200843902 圖5係本發明另—較佳實施例之單 圖。 磨顆粒之放大影像 祕至圖㈣本發明可撓性研紅具之俯視圖。 圖7A至圖7B係本發明—較佳實 製作流程。 又了說性研磨工具之 圖8係本發明—較佳實施例之可撓性研磨 1具之外觀影像 圖。 圖9A至圖9B係本發明另一較佳實施例之可撓性研磨工呈 之製作流程。 /、 10 主要元件符號說明In this embodiment, the adhesive layer 212 is an epoxy resin having a thickness of about 1 〇〇 (four) to fine; the material of the soft substrate 211 is polyethylene terephthalate (PET); The element 22 is a tethered tape; the abrasive particles 213 are diamond particles of poor crystal form and have a diameter of about 13 〇 #m. Accordingly, the arrangement of the abrasive particles 213 on the adhesive layer 212 can be easily controlled by the transfer step of this embodiment. In addition, in this embodiment, the diamond element* having a poor crystal form is used, so that the working surface 2_ of the flexible grinder I can be more processed. Furthermore, in this embodiment, an epoxy resin is used as the adhesive layer 212 of 200843902, which can greatly increase the chemical resistance of the working surface 2〇〇& to increase the service life of the product. Embodiment 2 5 Referring to Figures 4A to 4C, a manufacturing process of a flexible I raw abrasive tool according to another preferred embodiment of the present invention is shown. The 纟 embodiment uses a scattering step to make a flexible abrasive tool 2〇〇. As shown in FIG. 4A, a surface of a soft substrate 211 is first uniformly coated with a viscous + length: a viscous 10 兀 member 220 having a plurality of abrasive particles 213 adhered to the surface. Next, as shown in FIG. 4B, a viscous member 2 having a plurality of abrasive particles 213 adhered to the surface is viscous by a heating process, and then the viscous member 220 is vibrated to make the abrasive particles 213 and the viscous property. The element 22 is separated and automatically scattered on the adhesive layer 212, wherein the abrasive particles are automatically deflected to settle in the adhesive layer 212 with a minimum surface area. Finally, as shown in Fig. 4C, the adhesive layer 212 is cured by a heating process, and the abrasive particles 213 are fixed to the adhesive layer 212 to produce a flexible abrasive tool. The flexible abrasive tool 2 of the present embodiment was subjected to appearance analysis under a scanning electron microscope (SEM). Figure 5 is an enlarged view of a single abrasive particle of the present embodiment. In the present embodiment, the adhesive layer 212 is an epoxy resin having a thickness of 1 〇〇#m~2〇〇//m; the soft substrate 211 is made of polyethylene terephthalate (PET). The functional element 220 is a foaming type of diamond particles having a diameter of about 13 Å/m. According to the scattering step of the embodiment, the abrasive particles 213 scattered on the adhesive layer 212 will be automatically turned, and the working surface of the flexible abrasive tool 2 is formed by the crystal face of the smallest surface area. 〇a, the working surface 2〇〇a of the flexible abrasive tool 200 has a higher processing efficiency. 5 Embodiment 3 The manufacturing process of the flexible abrasive tool of this embodiment is compared with that of the second embodiment. In addition to the adhesive element 22 used in the present embodiment, the adhesive element 22 is made of ultraviolet glue (uv glue), and a light process is utilized. The remaining 10 is identical to the fabrication process described in Figures 4A through 4C of Example 2, except that the viscous element 22 is rendered viscous. As shown in Fig. 4A, an adhesive layer 212 is uniformly coated on the surface of a soft substrate 211, and a viscous member 220 having a plurality of abrasive particles 213 adhered to the surface is provided. Next, as shown in FIG. 4B, the viscous component 220 having a plurality of abrasive particles 213 adhered to the surface is lost in viscosity by a light irradiation process, and then the viscous component 220 is shaken to make the abrasive particles 213 and the adhesive. The sexual element 220 is separated and automatically dispersed on the adhesive layer 212, wherein the abrasive particles 2 j 3 are automatically turned to settle in the adhesive layer 2丨2 with a minimum surface area. Finally, as shown in Fig. 4C, the adhesive layer 212 is cured by a heating process, and the abrasive particles 213 are fixed to the adhesive layer 212. 20 Embodiment 4 Referring to FIGS. 6A to 6C and FIGS. 7A to 7B, the flexible abrasive tool 200 obtained in the embodiment can be further combined with a base 23 to obtain a base 230. Flexible abrasive tool 3〇〇. 12 200843902 First, referring to Figs. 6A to 6C, the flexible abrasive tool 200 (shown in Fig. 6A) obtained in the embodiment 1 is cut to a desired size (as shown in Figs. 6B and 6C). Next, referring to FIG. 7A to FIG. 7B, the soft substrate 211 of the flexible abrasive tool 200 5 is directly adhered to the working surface 230a of the susceptor 230 to obtain regular arrangement of diamond particles and high processing efficiency. The flexible abrasive tool 300 is shown in Figure 7B. The flexible abrasive tool 300 of the present embodiment is subjected to appearance analysis under a scanning electron microscope (SEM). Figure 8 is an image 10 of the appearance of the flexible abrasive tool 300. In this embodiment, the working surface 230a of the susceptor 230 is a convex curved surface, and the soft substrate 211 is completely affixed to the working surface 230a of the pedestal 230 because of its excellent flexibility. Effectively reduce accuracy errors. 15 Embodiment 5 Referring to FIGS. 6A to 6C and FIGS. 9A to 9B, the flexible abrasive tool 200 obtained in Embodiment 2 can be further combined with a susceptor 250 and a buffer layer 240 to obtain a base. The flexible abrasive tool 400 of the holder 250 and a buffer layer 240, please refer to FIGS. 6A to 6C, and the flexible abrasive tool 200 obtained in Embodiment 2 is subjected to the cutting step as described in Embodiment 4. , cut to the required specifications. Next, referring to FIG. 9A to FIG. 9B, a buffer layer 240 and the flexible abrasive tool 200 obtained in Embodiment 2 are sequentially fixed on a flat working surface 250a of a susceptor 250 to obtain a high processing efficiency. And a flexible abrasive tool 400 having a base 25 250 and a buffer layer 240, as shown in FIG. 9B. 13 200843902 In the embodiment, the buffer layer 24 is glued, which can effectively buffer the flexible abrasive body to be elastic foaming plastic force to reduce the stress generated by the grinding and the wide working hours. The probability of being injured. In order to reduce the number of workpieces, the invention can reduce the production cost lessly; in addition, the manufacturer can avoid the traditional use of brazing, sintering, or:: Production > low degree 'can avoid damage and product deformation H / cause the grinding particle strength P force causes the grinding particles to rupture, and then the surface of the H-grinding particles is left to be residual. 10 The invention utilizes the probability of delaying the product specification difference 2 . Furthermore, the finished product inventory is greatly reduced. The point of the alienation is reduced by the lead time. The above embodiments are only for the purpose of claiming the scope of the claims. The present invention is based on the above embodiments. I patent filial piety is subject to the above, not limited to 15 [Simple description of the drawings] Figure 1A to Figure 1B are the production process of the conventional grinding tool. 2A to 2C show the flexible grinding process of the present invention. < 20 Figures 3A and 3B are enlarged image views of a single-abrasive particle of the present invention, respectively, and a working surface image of the flexible abrasive tool. 4A to 4C show the manufacturing process of the flexible sounding tool of another embodiment of the present invention. ^ 14 200843902 Figure 5 is a block diagram of another preferred embodiment of the present invention. A magnified image of the abrasive particles. (4) A top view of the flexible red researcher of the present invention. 7A through 7B are the present invention - a preferred embodiment of the process. Further, Fig. 8 is a view showing the appearance of the flexible abrasive 1 of the preferred embodiment of the present invention. 9A to 9B show a manufacturing process of a flexible grinder according to another preferred embodiment of the present invention. /, 10 main component symbol description
100 研磨工具 110 基材 120 金屬層 130, 213 研磨 顆粒 2〇〇, 300, 400可撓性研磨工具 200a，230a，250a 工作 面 211 軟基材 212 黏著 層 220 黏性元件 230, 250 基座 240 緩衝層 15100 Abrasive tool 110 Substrate 120 Metal layer 130, 213 Abrasive particles 2〇〇, 300, 400 Flexible abrasive tool 200a, 230a, 250a Working surface 211 Soft substrate 212 Adhesive layer 220 Adhesive element 230, 250 Base 240 Buffer layer 15