TW201009775A - Device with a multi-layer board and light-emitting diodes - Google Patents

Device with a multi-layer board and light-emitting diodes Download PDF

Info

Publication number
TW201009775A
TW201009775A TW098113765A TW98113765A TW201009775A TW 201009775 A TW201009775 A TW 201009775A TW 098113765 A TW098113765 A TW 098113765A TW 98113765 A TW98113765 A TW 98113765A TW 201009775 A TW201009775 A TW 201009775A
Authority
TW
Taiwan
Prior art keywords
layer
layers
diode
light
panel
Prior art date
Application number
TW098113765A
Other languages
English (en)
Chinese (zh)
Inventor
Christoph Becher
Original Assignee
Alcan Tech & Man Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcan Tech & Man Ltd filed Critical Alcan Tech & Man Ltd
Publication of TW201009775A publication Critical patent/TW201009775A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/184—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
    • F21V33/006—General building constructions or finishing work for buildings, e.g. roofs, gutters, stairs or floors; Garden equipment; Sunshades or parasols
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/092—Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
TW098113765A 2008-04-25 2009-04-24 Device with a multi-layer board and light-emitting diodes TW201009775A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008021014A DE102008021014A1 (de) 2008-04-25 2008-04-25 Vorrichtung mit einer Mehrschichtplatte sowie Licht emittierenden Dioden

Publications (1)

Publication Number Publication Date
TW201009775A true TW201009775A (en) 2010-03-01

Family

ID=41021022

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098113765A TW201009775A (en) 2008-04-25 2009-04-24 Device with a multi-layer board and light-emitting diodes

Country Status (7)

Country Link
EP (1) EP2272103A1 (fr)
JP (1) JP2011519155A (fr)
KR (1) KR20110038608A (fr)
CN (1) CN102027605A (fr)
DE (1) DE102008021014A1 (fr)
TW (1) TW201009775A (fr)
WO (1) WO2009129947A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009004724A1 (de) 2009-01-15 2010-07-22 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauteils und optoelektronisches Bauteil
DE102011101805B4 (de) 2011-05-17 2016-08-25 Fela Holding Gmbh Schaltungsträger
WO2013117198A1 (fr) * 2012-02-08 2013-08-15 Scanled Ipr Aps Ensemble panneau de construction et diode électroluminescente
CN105789938B (zh) * 2014-12-23 2020-08-04 南京中兴软件有限责任公司 机架内部供电方法、总线式供电板以及通信设备
DE102015006619A1 (de) * 2015-05-24 2016-11-24 Technische Universität Chemnitz Aus einem hybriden Werkstoffverbund bestehendes Achsbauteil in Verbindung mit einem Straßenfahrzeug oder einem Straßenfahrzeug oder einem mobilen Arbeitsgerät
WO2017121430A1 (fr) * 2016-01-11 2017-07-20 Led Ibond International Aps Module d'alimentation électrique
EP3532772B1 (fr) 2016-10-31 2022-05-11 LED iBond International A/S Modul d'alimentation éléctrique
WO2023041136A1 (fr) 2021-09-20 2023-03-23 LED iBond International A/S Prise mâle de del
DE102022116234A1 (de) * 2022-06-29 2024-01-04 Pfanner Schutzbekleidung Gmbh Flächige Anzeigevorrichtung

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4039034A1 (de) 1990-12-07 1992-06-11 Heiland Bernd Gross-display
WO2003017435A1 (fr) 2001-08-13 2003-02-27 Didriksen, Torben Adaptateur de transfert de puissance
JP2006128512A (ja) * 2004-10-29 2006-05-18 Ngk Spark Plug Co Ltd 発光素子用セラミック基板
TWI251301B (en) 2004-11-29 2006-03-11 Unimicron Technology Corp Substrate core and method for fabricating the same
JP2006156747A (ja) * 2004-11-30 2006-06-15 Ngk Spark Plug Co Ltd 配線基板
US7952112B2 (en) * 2005-04-29 2011-05-31 Philips Lumileds Lighting Company Llc RGB thermal isolation substrate
DE102006014808A1 (de) 2005-06-03 2007-03-22 Mediamesh Gbr (Vertretungsberechtigte Gesellschafter: Gkd Ag Metallgewebe, Anordnung eines Metallgewebes und Verfahren zum Illuminieren
KR100638876B1 (ko) * 2005-07-22 2006-10-27 삼성전기주식회사 보호 소자의 배치 구성을 개선한 측면형 발광 다이오드
JP5214128B2 (ja) * 2005-11-22 2013-06-19 シャープ株式会社 発光素子及び発光素子を備えたバックライトユニット
US8643195B2 (en) * 2006-06-30 2014-02-04 Cree, Inc. Nickel tin bonding system for semiconductor wafers and devices
TW200810145A (en) 2006-08-04 2008-02-16 Chiang Cheng Ting A lighting structure with light emitting diodes and the method thereof

Also Published As

Publication number Publication date
CN102027605A (zh) 2011-04-20
WO2009129947A1 (fr) 2009-10-29
EP2272103A1 (fr) 2011-01-12
KR20110038608A (ko) 2011-04-14
JP2011519155A (ja) 2011-06-30
DE102008021014A1 (de) 2009-10-29

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