TW201309146A - 多層基板的製造方法、多層基板以及半導體封裝基板 - Google Patents

多層基板的製造方法、多層基板以及半導體封裝基板 Download PDF

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Publication number: TW201309146A
Authority: TW; Taiwan
Prior art keywords: layer; group; plated; polymer; substrate
Prior art date: 2011-07-29

Application number

TW101123005A

Other languages

English (en)

Chinese (zh)

Inventor

Tokihiko Matsumura

Takeyoshi Kano

Hirohisa Hokazono

Takeshi Hama

Original Assignee

Fujifilm Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2011-07-29

Filing date

2012-06-27

Publication date

2013-02-16

2012-06-27 Application filed by Fujifilm Corp filed Critical Fujifilm Corp

2013-02-16 Publication of TW201309146A publication Critical patent/TW201309146A/zh

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229920000069 polyphenylene sulfide Polymers 0.000 description 1
229920001155 polypropylene Polymers 0.000 description 1
239000011591 potassium Substances 0.000 description 1
229910052700 potassium Inorganic materials 0.000 description 1
239000012286 potassium permanganate Substances 0.000 description 1
238000001556 precipitation Methods 0.000 description 1
125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
238000003672 processing method Methods 0.000 description 1
239000000047 product Substances 0.000 description 1
BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
FVSKHRXBFJPNKK-UHFFFAOYSA-N propionitrile Chemical compound CCC#N FVSKHRXBFJPNKK-UHFFFAOYSA-N 0.000 description 1
229940116423 propylene glycol diacetate Drugs 0.000 description 1
239000003223 protective agent Substances 0.000 description 1
239000011241 protective layer Substances 0.000 description 1
125000004076 pyridyl group Chemical group 0.000 description 1
125000005493 quinolyl group Chemical group 0.000 description 1
238000010526 radical polymerization reaction Methods 0.000 description 1
239000011541 reaction mixture Substances 0.000 description 1
230000009257 reactivity Effects 0.000 description 1
238000010992 reflux Methods 0.000 description 1
238000011160 research Methods 0.000 description 1
230000000717 retained effect Effects 0.000 description 1
229910052703 rhodium Inorganic materials 0.000 description 1
239000010948 rhodium Substances 0.000 description 1
MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
238000007142 ring opening reaction Methods 0.000 description 1
239000005060 rubber Substances 0.000 description 1
230000035945 sensitivity Effects 0.000 description 1
239000010944 silver (metal) Substances 0.000 description 1
239000012279 sodium borohydride Substances 0.000 description 1
229910000033 sodium borohydride Inorganic materials 0.000 description 1
239000011780 sodium chloride Substances 0.000 description 1
XHFLOLLMZOTPSM-UHFFFAOYSA-M sodium;hydrogen carbonate;hydrate Chemical class [OH-].[Na+].OC(O)=O XHFLOLLMZOTPSM-UHFFFAOYSA-M 0.000 description 1
238000001228 spectrum Methods 0.000 description 1
239000007858 starting material Substances 0.000 description 1
238000006467 substitution reaction Methods 0.000 description 1
125000004434 sulfur atom Chemical group 0.000 description 1
239000004250 tert-Butylhydroquinone Substances 0.000 description 1
125000006318 tert-butyl amino group Chemical group [H]N(*)C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
FQFILJKFZCVHNH-UHFFFAOYSA-N tert-butyl n-[3-[(5-bromo-2-chloropyrimidin-4-yl)amino]propyl]carbamate Chemical compound CC(C)(C)OC(=O)NCCCNC1=NC(Cl)=NC=C1Br FQFILJKFZCVHNH-UHFFFAOYSA-N 0.000 description 1
235000019281 tert-butylhydroquinone Nutrition 0.000 description 1
238000005979 thermal decomposition reaction Methods 0.000 description 1
229920002803 thermoplastic polyurethane Polymers 0.000 description 1
YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical group C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
239000013008 thixotropic agent Substances 0.000 description 1
DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
238000012546 transfer Methods 0.000 description 1
230000009466 transformation Effects 0.000 description 1
229960002622 triacetin Drugs 0.000 description 1
ZYKRZWPMUVFJDA-UHFFFAOYSA-N triphenylphosphanium trifluoride Chemical compound [F-].[F-].[F-].C1(=CC=CC=C1)[PH+](C1=CC=CC=C1)C1=CC=CC=C1.C1(=CC=CC=C1)[PH+](C1=CC=CC=C1)C1=CC=CC=C1.C1(=CC=CC=C1)[PH+](C1=CC=CC=C1)C1=CC=CC=C1 ZYKRZWPMUVFJDA-UHFFFAOYSA-N 0.000 description 1
229920001567 vinyl ester resin Polymers 0.000 description 1
125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
239000003021 water soluble solvent Substances 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing Of Printed Wiring (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)

TW101123005A 2011-07-29 2012-06-27 多層基板的製造方法、多層基板以及半導體封裝基板 TW201309146A (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2011167609		2011-07-29
JP2012075462A JP2013051391A (ja)	2011-07-29	2012-03-29	多層基板の製造方法

Publications (1)

Publication Number	Publication Date
TW201309146A true TW201309146A (zh)	2013-02-16

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TW101123005A TW201309146A (zh)	2011-07-29	2012-06-27	多層基板的製造方法、多層基板以及半導體封裝基板

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JP (1)	JP2013051391A (ja)
TW (1)	TW201309146A (ja)
WO (1)	WO2013018456A1 (ja)

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KR102365911B1 (ko)	2014-10-17	2022-02-22	삼성디스플레이 주식회사	유기 발광 표시 장치 및 그 제조 방법
CN112154175B (zh) *	2018-05-18	2023-01-17	国立大学法人大阪大学	表面处理聚合物的制造方法、聚合物、金属镀覆聚合物及粘接层叠体、以及它们的制造方法
CN111128685B (zh) *	2019-12-30	2021-09-03	广州粤芯半导体技术有限公司	半导体器件及其制造方法
JP7512122B2 (ja) *	2020-08-06	2024-07-08	新光電気工業株式会社	配線基板の製造方法
TW202442431A (zh) *	2023-03-20	2024-11-01	日商Ｍｇｃ電子科技股份有限公司	印刷配線板之製造方法
JP2025005590A (ja)	2023-06-28	2025-01-17	富士フイルム株式会社	タッチセンサの製造方法およびタッチセンサ

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JP2005347423A (ja) *	2004-06-01	2005-12-15	Fuji Photo Film Co Ltd	金属パターン形成方法、及び導電性パターン材料
JP2005345649A (ja) *	2004-06-01	2005-12-15	Fuji Photo Film Co Ltd	導電性パターン材料及び導電性パターンの形成方法
JP2007017910A (ja) *	2005-07-11	2007-01-25	Fujifilm Holdings Corp	グラフトパターン材料、導電性パターン材料及びこれらの形成方法
US8293846B2 (en) *	2008-09-26	2012-10-23	Fujifilm Corporation	Composition for forming layer to be plated, method of producing metal pattern material, metal pattern material
JP2010157590A (ja) *	2008-12-26	2010-07-15	Fujifilm Corp	多層配線基板の製造方法
JP5295931B2 (ja) *	2009-10-30	2013-09-18	パナソニック株式会社	回路基板の製造方法、及び前記製造方法により得られた回路基板

2012
- 2012-03-29 JP JP2012075462A patent/JP2013051391A/ja active Pending
- 2012-06-21 WO PCT/JP2012/065890 patent/WO2013018456A1/ja not_active Ceased
- 2012-06-27 TW TW101123005A patent/TW201309146A/zh unknown

Also Published As

Publication number	Publication date
JP2013051391A (ja)	2013-03-14
WO2013018456A1 (ja)	2013-02-07

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