TW201315567A - Drill bit grinding method and drill bit grinding system - Google Patents

Drill bit grinding method and drill bit grinding system Download PDF

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TW201315567A
TW201315567A TW101149664A TW101149664A TW201315567A TW 201315567 A TW201315567 A TW 201315567A TW 101149664 A TW101149664 A TW 101149664A TW 101149664 A TW101149664 A TW 101149664A TW 201315567 A TW201315567 A TW 201315567A
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bit
grinding
drill bit
drill
height
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TW101149664A
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TWI498189B (en
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Bo-Hong Qiu
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Hotwu Technology Co Ltd
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Abstract

This invention relates to a drill bit grinding method and a drill bit grinding system. The drill bit grinding method comprises the following steps: (1) placing a drill bit on a drill bit forward/backward moving apparatus; (2) grinding the drill bit with a grinder; and (3) inspecting the drill bit to determine whether it meets the requirements; if yes, dismounting the drill bit from the drill bit forward/backward moving apparatus, and if no, returning to step (2). This invention can effectively save resource and improve the manufacturing yield.

Description

研磨鑽頭的方法與鑽頭研磨系統 Method for grinding a drill bit and a drill grinding system

本發明係關於一種研磨鑽頭的方法與鑽頭研磨系統,尤指一種可於鑽頭研磨系統內檢測鑽頭品質,並針對不符要求者進行回磨的方法與鑽頭研磨系統。 The present invention relates to a method of grinding a drill bit and a drill grinding system, and more particularly to a method and a drill grinding system that can detect the quality of the drill bit in a drill grinding system and perform back grinding for those who do not meet the requirements.

印刷線路板(PCB)的應用是非常廣泛的,甚至是造成第三次工業革命的主要因素之一。日常生活的食、衣、住、行,幾乎沒有一項是印刷線路板所不介入的。食的方面,可以加熱或烹煮食物的微波爐;衣的方面,可以清洗衣服的洗衣機;住的方面,可以照亮室內的燈具;行的方面,可以提供乘載人員的汽車。因此,如以上所述,所有日常生活每天必利用的工具,就必然有印刷線路板存在其中。 The application of printed circuit boards (PCBs) is very extensive and even one of the main factors contributing to the third industrial revolution. Almost none of the daily food, clothing, housing, and travel is printed circuit boards. In terms of food, a microwave oven that can heat or cook food; in terms of clothing, a washing machine that can clean clothes; in terms of living, it can illuminate indoor lamps; in terms of line, it can provide a car for passengers. Therefore, as described above, all the tools that must be used every day in daily life, there must be a printed circuit board.

隨著印刷電路板的應用範圍增加,由早期的單層板增加成多層板。於是,在各層之間的電路即需要有連接線路,以可讓各層板的印刷電路彼此電性連接。因此,這些貫穿於各層板的連接線路是要透過一些極端細小的鑽頭鑽孔後,才可通透於各層板間。這些細小的鑽頭其尺寸可能如頭髮一般細小,如此才可鑽出細小的孔洞,以供印刷電路板的線路通過。依據上述的需求與應用,可以得出幾個重點: As the range of applications for printed circuit boards has increased, they have been added to multi-layer boards from early single-layer boards. Thus, the circuit between the layers requires a connection line to allow the printed circuits of the layers to be electrically connected to each other. Therefore, these connecting lines running through the various layers are drilled through some extremely thin drill bits before they can penetrate between the layers. These tiny drill bits may be as small as the hair so that small holes can be drilled for the printed circuit board to pass through. Based on the above requirements and applications, several key points can be drawn:

1.需求量大:概因印刷線路板的應用廣泛,所以其週邊工業亦隨之成正比增加。 1. Large demand: Due to the wide application of printed circuit boards, the surrounding industries have also increased in proportion.

2.尺寸精準:概因應用於精密工業,故鑽頭之各種尺寸是 必須非常精準的。 所以,在鑽頭精準地去鑽孔之前,其自身的精度也必須是非常高的。若是精密度不夠而有誤差,則所鑽出來的孔會相對地誤差更大,也有可能造成鑽頭斷裂。因此,在生產製造時對鑽頭的研磨,其精密度是非常重要的。 2. Accurate size: It is applied to precision industry, so the various sizes of drill bits are Must be very precise. Therefore, before the drill bit is accurately drilled, its own precision must be very high. If the precision is not enough and there is an error, the hole drilled will have a relatively large error, and it may cause the bit to break. Therefore, the precision of grinding the drill bit during production is very important.

現有技術中已提出各種功能及設計各異的鑽頭研磨裝置,例如申請人已公告之我國新型專利M415018號以及申請人提出之專利申請案100119767號及100131638號(以上全部併入本文作參考),惟其於使用上仍有需要進行改良及優化之處。 Drill grinding devices of various functions and designs have been proposed in the prior art, such as the new type of patents M415018 issued by the applicant and the patent applications 100119767 and 100131638 filed by the applicants (all of which are incorporated herein by reference). However, there is still room for improvement and optimization in its use.

請參考第1圖,係一鑽頭中心線高度與二砂輪中心假想連接線高度之相對位置關係示意圖。如圖所示,一鑽頭座R10挟持著一鑽頭R11,該鑽頭R11的一研磨部R12被一支架U所支持著,以將鑽頭R11的一鑽頭中心線L7之高度保持與二砂輪W1與W2之一中心假想連接線L6高度相同。第1圖顯示正常的鑽頭與該二研磨砂輪的位置關係;而該研磨部R12之一端面S則是被研磨的部分。 Please refer to the first figure, which is a schematic diagram showing the relative positional relationship between the height of the centerline of a drill bit and the height of the imaginary connecting line of the center of the two grinding wheels. As shown, a drill bit R10 holds a drill bit R11, and a grinding portion R12 of the drill bit R11 is supported by a bracket U to maintain the height of a drill center line L7 of the drill bit R11 with the two grinding wheels W1 and W2. One of the center imaginary connecting lines L6 has the same height. Fig. 1 shows the positional relationship between a normal drill bit and the two grinding wheels; and one end face S of the grinding portion R12 is a portion to be ground.

請參考第2A圖與第2B圖,係一鑽頭中心線高度低於二砂輪中心假想連接線高度所研磨出之鑽頭端面示意圖與一鑽頭中心線高度高於二砂輪中心假想連接線高度所研磨出之鑽頭端面示意圖。如第1圖所示,一鑽頭之端面S(即被研磨面)與二砂輪W1與W2,實際研磨時,該端面S會直接垂直接觸砂輪W1與W2之二研磨面W11與W22。所以,第2A圖所示的二砂輪W1與W2是從側邊視之,而端 面S則是從前面視之,如此得以顯示研磨後的端面S具有四個研磨面,包括一第一被研磨面M1、一第二被研磨面N1、一第三被研磨面O1與一第四被研磨面P1。鑽頭之端面與砂輪W1與W2之詳細相對位置,將可參考本文後段說明。第2A圖中,鑽頭中心線L7高度低於二砂輪W1、W2之中心假想連接線L6高度,研磨後得出該第一被研磨面M1、該第二被研磨面N1、該第三被研磨面O1與該第四被研磨面P1,其中,第一被研磨面M1由複數個點A6、B6、C6、D6、D7、A7所圍成之區域,第二被研磨面N1由複數個點A7、D7、E7、F7所圍成之區域,第三被研磨面O1由複數個點A6、A7、F7、H7、I7、I6所圍成之區域,第四被研磨面P1由複數個點A6、I6、J6、B6所圍成之區域。顯而易見,點A6與點A7並無交於一點,第二被研磨面N1與第四被研磨面P1未有交點,所以業界稱分離。然,如第2A圖所示,以鑽頭中心線高度L7低於二砂輪中心假想連接線L6高度1μm而言,研磨的過程中在產生了第一被研磨面M1與第二被研磨面N1後,會被固定鑽頭的鑽頭座進行自體旋轉180度,以再研磨產生第三被研磨面O1與第四被研磨面P1。所以,如圖所示,當四個研磨面產生後,第二被研磨面N1與第四被研磨面P1的二邊線即差了2μm。這樣的誤差對鑽PCB上的孔而言,是不被接受的。再者,本研磨鑽頭的機器具有二個砂輪,再加上其它配合的機具,如驅動裝置、底座、砂輪座等,整體而言是非常重的。在這樣的條件下,若要調整砂輪這邊的機具1μm, 幾乎是不可能的。 Please refer to the 2A and 2B drawings, which is a schematic diagram of the end face of the drill bit which is grounded at a height lower than the height of the imaginary connecting line of the center of the two grinding wheel, and the height of a bit center line is higher than the height of the imaginary connecting line of the center of the second grinding wheel. The schematic diagram of the end face of the drill As shown in Fig. 1, the end surface S of a drill bit (i.e., the surface to be polished) and the two grinding wheels W1 and W2, when actually ground, the end surface S directly contacts the two grinding surfaces W11 and W22 of the grinding wheels W1 and W2. Therefore, the two grinding wheels W1 and W2 shown in Fig. 2A are viewed from the side, and the ends are The surface S is viewed from the front, so that the polished end surface S has four polished surfaces, including a first polished surface M1, a second polished surface N1, a third polished surface O1 and a first surface. Four polished surfaces P1. The detailed relative position of the end face of the drill bit and the grinding wheels W1 and W2 will be described later in this document. In Fig. 2A, the height of the drill center line L7 is lower than the height of the center imaginary connecting line L6 of the two grinding wheels W1, W2, and the first polished surface M1, the second ground surface N1, and the third ground are obtained after grinding. The surface O1 and the fourth surface to be polished P1, wherein the first surface to be polished M1 is surrounded by a plurality of points A6, B6, C6, D6, D7, and A7, and the second surface to be polished N1 is composed of a plurality of points. A region surrounded by A7, D7, E7, and F7, the third polished surface O1 is surrounded by a plurality of points A6, A7, F7, H7, I7, and I6, and the fourth polished surface P1 is composed of a plurality of points. The area enclosed by A6, I6, J6, and B6. Obviously, the point A6 and the point A7 do not intersect at one point, and the second surface to be polished N1 and the fourth surface to be polished P1 do not intersect, so the industry refers to separation. However, as shown in FIG. 2A, in the case where the bit center line height L7 is lower than the height of the two-wheel center imaginary connection line L6 by 1 μm, the first polished surface M1 and the second polished surface N1 are generated during the polishing. The bit holder that fixes the drill bit is rotated 180 degrees by itself to re-grind to produce the third surface to be polished O1 and the fourth surface to be polished P1. Therefore, as shown in the figure, when the four polished faces are generated, the two sides of the second polished surface N1 and the fourth polished surface P1 are 2 μm apart. Such errors are not acceptable for drilling holes in the PCB. Furthermore, the machine for grinding the drill bit has two grinding wheels, and other matching tools, such as a driving device, a base, a wheel holder, etc., are very heavy overall. Under such conditions, if you want to adjust the machine 1μm on the side of the grinding wheel, Almost impossible.

如第2B圖所示,鑽頭中心線L7高度高於二砂輪中心假想連接線L6高度。研磨後得出第一被研磨面M1、第二被研磨面N1、第三被研磨面O1與第四被研磨面P1,其中,第一被研磨面M1由複數個點A6、B6、C6、D6、D7所圍成之區域,第二被研磨面N1由複數個點A7、A6、D7、E7、F7所圍成之區域,第三被研磨面O1由複數個點A7、F7、H7、I7所圍成之區域,第四被研磨面P1由複數個點A6、A7、I6、J6、B6所圍成之區域。顯而易見,點A6與點A7並無交於一點,第二被研磨面N1與第四被研磨面P1各有一線段A6A7是彼此的交線,所以業界稱重疊。然,如第2B圖所示,以鑽頭中心線L7高度高於二砂輪中心假想連接線L6高度1μm而言,研磨的過程中在產生了第一被研磨面M1與第二被研磨面N1後,會被固定鑽頭的鑽頭座進行自體旋轉180度,以再研磨產生第三被研磨面O1與第四被研磨面P1。所以,如圖所示,當四個研磨面產生後,第二被研磨面N1與第四被研磨面P1的二邊線即差了2μm。 As shown in Fig. 2B, the height of the drill center line L7 is higher than the height of the imaginary connection line L6 of the center of the two grinding wheels. After polishing, the first surface to be polished M1, the second surface to be polished N1, the third surface to be polished O1 and the fourth surface to be polished P1 are obtained, wherein the first surface to be polished M1 is composed of a plurality of points A6, B6, C6, The area surrounded by D6 and D7, the second surface to be polished N1 is surrounded by a plurality of points A7, A6, D7, E7, and F7, and the third surface to be polished O1 is composed of a plurality of points A7, F7, and H7. In the region surrounded by I7, the fourth polished surface P1 is surrounded by a plurality of points A6, A7, I6, J6, and B6. Obviously, the point A6 and the point A7 do not intersect one point, and the second polished surface N1 and the fourth polished surface P1 each have a line segment A6A7 which is the intersection of each other, so the industry refers to the overlap. However, as shown in FIG. 2B, in the case where the height of the drill center line L7 is higher than the height of the two-wheel center imaginary connection line L6 by 1 μm, the first surface to be polished M1 and the second surface to be polished N1 are generated during the grinding process. The bit holder that fixes the drill bit is rotated 180 degrees by itself to re-grind to produce the third surface to be polished O1 and the fourth surface to be polished P1. Therefore, as shown in the figure, when the four polished faces are generated, the two sides of the second polished surface N1 and the fourth polished surface P1 are 2 μm apart.

總結第2A圖與第2B圖所述的誤差原因,這樣的誤差對鑽PCB上的孔而言,是不被接受的。再者,本研磨鑽頭的機器具有二個砂輪,再加上其它配合的機具,如驅動裝置、底座、砂輪座等,整體而言是非常重的。在這樣的條件下,若要調整砂輪這邊的機具1μm,幾乎是不可能的。 Summarizing the causes of the errors described in Figures 2A and 2B, such errors are not acceptable for drilling holes in the PCB. Furthermore, the machine for grinding the drill bit has two grinding wheels, and other matching tools, such as a driving device, a base, a wheel holder, etc., are very heavy overall. Under such conditions, it is almost impossible to adjust the machine 1μm on the side of the grinding wheel.

請參考第3A圖與第3B圖,係習知技術中對二砂輪之 左砂輪進行後退之二砂輪中心假想連接線之位移差示意圖與習知技術中對二砂輪之右砂輪進行前進之二砂輪中心假想連接線之位移差示意圖。承接上一段所述,考慮調整砂輪這邊的機具1μm,則如第3A圖所示,左砂輪W2後退1μm至圖中虛線位置,則二砂輪中心假想連接線L6高度會升高2.801μm;如第3B圖所示,將右砂輪W1前進1μm至圖中虛線位置,則二砂輪中心假想連接線L6高度會升高3.165μm。其高度差h之計算公式為:砂輪之移動量/(tan(∠右砂輪W1)-tan(∠左砂輪))*cos(∠移動之砂輪)=h Please refer to Figures 3A and 3B, which are related to the two grinding wheels in the prior art. The displacement difference diagram of the imaginary connecting line of the center of the two grinding wheel in which the left grinding wheel is retracted is a schematic diagram of the displacement difference of the imaginary connecting line of the center of the second grinding wheel which advances the right grinding wheel of the two grinding wheel in the prior art. As mentioned in the previous paragraph, considering adjusting the machine 1μm on the side of the grinding wheel, as shown in Figure 3A, the left grinding wheel W2 is retracted by 1μm to the dotted line position in the figure, and the height of the imaginary connecting line L6 of the second grinding wheel is increased by 2.801μm; As shown in Fig. 3B, when the right grinding wheel W1 is advanced by 1 μm to the position of the broken line in the figure, the height of the imaginary connecting line L6 of the second grinding wheel is increased by 3.165 μm. The formula for calculating the height difference h is: the amount of movement of the grinding wheel / (tan (∠ right grinding wheel W1) - tan (∠ left grinding wheel)) * cos (∠ moving wheel) = h

因此,由第2A、2B、3A與3B圖所示得知,要修正2μm的分離/重疊量,只可以調整二砂輪中心假想連接線L6其1μm的移動量。若要以機械方式調整如左砂輪W2的移動量,則只能移動0.357μm,其計算公式為:[tan(∠右砂輪W1)-tan(∠左砂輪W2)]*cos(∠左砂輪W2)*左砂輪W2移動之垂直距離(如第3A圖所顯示的垂直距離d,本處之值為1,單位為μm)。所以,以現行機械方式仍有一定難度,因為距離實在太小了。 Therefore, as shown in Figs. 2A, 2B, 3A, and 3B, it is known that the amount of separation/overlap of 2 μm is corrected, and only the movement amount of 1 μm of the two-wheel center imaginary connection line L6 can be adjusted. To mechanically adjust the amount of movement of the left grinding wheel W2, it can only move 0.357μm, and its calculation formula is: [tan (∠ right grinding wheel W1)-tan (∠ left grinding wheel W2)] *cos (∠ left grinding wheel W2 ) * The vertical distance of the left grinding wheel W2 (such as the vertical distance d shown in Figure 3A, the value of this place is 1, the unit is μm). Therefore, it is still difficult to use the current mechanical method because the distance is too small.

此外,目前若檢測出研磨後的鑽頭是不符合需求,則會將該鑽頭退料,並將不符合需求的複數鑽頭集中作廢,而造成資源的浪費。 In addition, if it is detected that the drilled bit is not in compliance with the demand, the bit will be returned, and the plurality of drill bits that do not meet the demand will be discarded, resulting in waste of resources.

於是,如何避免前述之種種問題,實是當前熟悉相關技藝之人士所需注意的一項重要課題。 Therefore, how to avoid the above-mentioned various problems is an important issue that needs to be paid attention to by those who are familiar with related art.

有鑒於上述習知技術之缺失,本發明提供一種研磨鑽頭的方法,係包括以下步驟:(1)將鑽頭置於鑽頭進退裝置上;(2)以砂輪研磨該鑽頭;以及(3)檢測該鑽頭,並判斷該鑽頭是否符合需求,若是,則從該鑽頭進退裝置上取下該鑽頭,若否,則回到步驟(2)。 In view of the above-mentioned deficiencies of the prior art, the present invention provides a method of grinding a drill bit, comprising the steps of: (1) placing a drill bit on a drill bit advance and retreat device; (2) grinding the drill bit with a grinding wheel; and (3) detecting the drill bit The drill bit determines whether the drill bit meets the demand, and if so, removes the drill bit from the drill advance and retreat device, and if not, returns to step (2).

本發明復提供一種鑽頭研磨系統,係包括:砂輪承載裝置,係包括用以研磨鑽頭的砂輪;鑽頭進退裝置,係用以承載與移動鑽頭;調校裝置,係用以檢測研磨後之該鑽頭,並判斷該鑽頭是否符合需求;以及進退料裝置,係用以將待研磨之鑽頭設置於該鑽頭進退裝置上,且若該調校裝置判斷研磨後之該鑽頭符合需求,則該進退料裝置係用以從該鑽頭進退裝置上取下該鑽頭,若該調校裝置判斷研磨後之該鑽頭不符合需求,則該砂輪再次研磨該鑽頭。 The present invention further provides a drill grinding system comprising: a grinding wheel carrying device comprising a grinding wheel for grinding a drill bit; a drill bit advance and retreat device for carrying and moving the drill bit; and a adjusting device for detecting the ground drill bit And determining whether the drill bit meets the demand; and the feeding and unloading device is configured to set the drill to be grounded on the drill advance and retreat device, and if the adjusting device determines that the drilled bit meets the demand after grinding, the feeding and unloading device The drill bit is used to remove the drill bit from the drill advance and retreat device. If the trimming device determines that the drill bit after grinding does not meet the demand, the grinding wheel grinds the drill bit again.

以下藉由特定的具體實施例說明本發明之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。 The other embodiments of the present invention will be readily understood by those skilled in the art from this disclosure.

須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用以限定本發明可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本發明所能產生之功 效及所能達成之目的下,均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時,本說明書中所引用之如「上」及「一」等之用語,亦僅為便於敘述之明瞭,而非用以限定本發明可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當亦視為本發明可實施之範疇。 It is to be understood that the structure, the proportions, the size, and the like of the present invention are intended to be used in conjunction with the disclosure of the specification, and are not intended to limit the invention. The qualifications are not technically meaningful, and any modification of the structure, change of the proportional relationship or adjustment of the size does not affect the work that can be produced by the present invention. Both the effects and the achievable objectives should still fall within the scope of the technical contents disclosed in the present invention. In the meantime, the terms "upper" and "one" as used in the specification are merely for convenience of description, and are not intended to limit the scope of the invention, and the relative relationship is changed or adjusted. Substantially changing the technical content is also considered to be within the scope of the invention.

請參閱第4A圖,係本發明之一種研磨鑽頭的方法所應用之鑽頭研磨系統之一較佳實施例立體示意圖,請參閱第4B圖與第4C圖,本發明之研磨鑽頭的方法所應用之鑽頭研磨系統之該較佳實施例上視示意圖與本發明之研磨鑽頭的方法所應用之鑽頭研磨系統之較佳實施例之鑽頭進退裝置與調校裝置之側視示意圖。該改良之鑽頭研磨系統包括:砂輪承載裝置1、鑽頭進退裝置2、調校裝置3與進退料裝置4。 Please refer to FIG. 4A, which is a perspective view of a preferred embodiment of a drill grinding system applied to a method for grinding a drill bit according to the present invention. Referring to FIGS. 4B and 4C, the method for grinding a drill bit of the present invention is applied. BRIEF DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the bit grinding system is a schematic side view of a drill bit advancement and retraction device and a aligning device of a preferred embodiment of the bit grinding system to which the method of grinding a drill bit of the present invention is applied. The improved drill grinding system comprises: a grinding wheel carrier device 1, a drill bit advance and retreat device 2, a calibration device 3 and an inlet and outlet device 4.

該砂輪承載裝置1係具有一底座11、一砂輪座12與二驅動裝置13、14,該砂輪座12係裝設於該底座11之一上平面111上,且砂輪座12具有一第一砂輪121與一第二砂輪122,該二砂輪121、122係沿著底座11之該上平面111之一假想長軸Y’以排列配置,且該第一砂輪121與該第二砂輪122之一第一圓心A與一第二圓心B的一假想連接線AB係與該假想長軸Y’平行,第一砂輪121與第二砂輪122之一第一研磨面1211與一第二研磨面1221分別與該假想連接線AB平行,該第一研磨面1211與該第二研磨面1221分別與底座11之上平面111呈現一第一角度α與一第二角度β之傾斜,本實施例之該第一角度α係小於該 第二角度β,該二驅動裝置係一第一驅動裝置13與一第二驅動裝置14,且分別驅動第一砂輪121與第二砂輪122,該砂輪承載裝置1係可利用一驅動軸15進行與假想長軸Y’平行的方向作往復式的移動。 The wheel carrier device 1 has a base 11, a wheel base 12 and two driving devices 13, 14. The wheel base 12 is mounted on an upper surface 111 of the base 11, and the wheel base 12 has a first grinding wheel. 121 and a second grinding wheel 122, the two grinding wheels 121, 122 are arranged along the imaginary long axis Y' of the upper plane 111 of the base 11, and the first grinding wheel 121 and the second grinding wheel 122 are An imaginary connecting line AB of a center A and a second center B is parallel to the imaginary long axis Y', and the first grinding surface 1211 and the second grinding surface 1221 of the first grinding wheel 121 and the second grinding wheel 122 respectively The imaginary connecting line AB is parallel, and the first grinding surface 1211 and the second grinding surface 1221 respectively exhibit a tilt between the first angle α and the second angle β of the upper surface 111 of the base 11 , which is the first of the embodiment. Angle α is less than this The second driving unit is a first driving device 13 and a second driving device 14 and drives a first grinding wheel 121 and a second grinding wheel 122 respectively. The grinding wheel carrier device 1 can be driven by a driving shaft 15 . The direction parallel to the imaginary long axis Y' is reciprocatingly moved.

該鑽頭進退裝置2係一旋轉裝置,以將裝設於其上的一鑽頭固定裝置21進行平行於砂輪承載裝置1之底座11之上平面111的擺動,該鑽頭固定裝置21具有一第一鑽頭座211與一第二鑽頭座212,該第一鑽頭座211與該第二鑽頭座212係可分別固定一待研磨之鑽頭D,以準備進行研磨,且在第一鑽頭座211擺動至第一砂輪121與第二砂輪122進行研磨時,第二鑽頭座212可在一可更換鑽頭的位置,以將一研磨好的鑽頭更換下,而裝上另一待研磨的鑽頭。 The drill advancing and retracting device 2 is a rotating device for oscillating a bit fixing device 21 mounted thereon parallel to the upper surface 111 of the base 11 of the grinding wheel carrier 1, the drill fixing device 21 having a first drill bit The first bit holder 211 and the second bit holder 212 respectively fix a drill D to be ground to prepare for grinding, and swing to the first bit 211 to the first position. When the grinding wheel 121 and the second grinding wheel 122 are ground, the second bit holder 212 can be placed at a position of the replaceable drill bit to replace a ground drill bit with another drill bit to be ground.

該調校裝置3係具有一第一影像擷取調校裝置31與一第二影像擷取調校裝置32,該第一影像擷取調校裝置31包括一第一攝像裝置311與一第一電荷耦合裝置(CCD)312,係經由該第一攝像裝置311對鑽頭影像的攝影及該第一電荷耦合裝置312對鑽頭影像的擷取,以從垂直於砂輪承載裝置1之底座11之上平面111的方向檢測第一鑽頭座211與第二鑽頭座212,以對固定於第一鑽頭座211與第二鑽頭座212之已經研磨好與待研磨之複數個鑽頭之每一個鑽頭的相關尺寸、與固定於第一鑽頭座211與第二鑽頭座212時之鑽頭各相關位置進行檢測與調整,該第二影像擷取調校裝置32包括一第二攝像裝置321與一第二電荷耦合裝置 (CCD)322,係經由該第二攝像裝置321對鑽頭影像的攝影及該第二電荷耦合裝置322對鑽頭影像的擷取,以係從平行於砂輪承載裝置1之底座11之上平面111的方向檢測第一鑽頭座211與第二鑽頭座212,以對固定於第一鑽頭座211與第二鑽頭座212之已經研磨好與待研磨之複數個鑽頭之每一個鑽頭的相關尺寸、與固定於第一鑽頭座211與第二鑽頭座212時之各相關位置進行檢測與調整,其中,該第二攝像裝置321更具有一環狀光源裝置3211,以對鑽頭提供一環型光源(圖中未示),概因鑽頭之頂部很細,必須使用環型光源照射,才可提供無死角的照射,以進行精密的檢測。 The calibration device 3 has a first image capturing and adjusting device 31 and a second image capturing and adjusting device 32. The first image capturing and adjusting device 31 includes a first camera device 311 and a first device. The charge coupled device (CCD) 312 captures the image of the drill bit through the first camera device 311 and the image of the drill bit image by the first charge coupled device 312 to be perpendicular to the plane above the base 11 of the wheel carrier device 1 . The direction of 111 detects the first bit holder 211 and the second bit holder 212 to be related to the size of each of the plurality of bits of the plurality of bits that have been ground to the first bit holder 211 and the second bit holder 212, The detection and adjustment are performed on the respective positions of the drill bit fixed to the first bit holder 211 and the second bit holder 212. The second image capturing and adjusting device 32 includes a second imaging device 321 and a second charge coupled device. (CCD) 322, the image of the bit image and the bit image of the second charge coupled device 322 are captured by the second image capturing device 321 to be parallel to the plane 111 above the base 11 of the wheel carrier device 1. Directionally detecting the first bit holder 211 and the second bit holder 212 for the relevant size and fixing of each of the plurality of drill bits fixed to the first bit holder 211 and the second bit holder 212 that have been ground and to be ground. Detecting and adjusting at each relevant position of the first bit holder 211 and the second bit holder 212, wherein the second camera device 321 further has an annular light source device 3211 for providing a ring-shaped light source to the drill bit (not shown) The reason is that the top of the drill bit is very thin and must be illuminated with a ring-shaped light source to provide a blind-free illumination for precise inspection.

該進退料裝置4係包括一鑽頭翻轉裝置41及一鑽頭交換裝置42,其中,當一待研磨之鑽頭從外部送入時,該待研磨之鑽頭之一長軸向是與該砂輪承載裝置1之該底座11之該上平面111呈現垂直的方向送入,該鑽頭翻轉裝置41將該待研磨之鑽頭翻轉方向,使鑽頭之該長軸向(本文以後相關方向描述皆係「長軸向」)呈現與上平面111平行的方向,該鑽頭交換裝置42於是夾取待研磨之鑽頭,並將待研磨之鑽頭裝設於該第一鑽頭座211或該第二鑽頭座212上,於是,該鑽頭進退裝置2進行一定角度的擺動,以將裝上待研磨之鑽頭的第一鑽頭座211或第二鑽頭座212運送至該第一砂輪121與該第二砂輪122處進行研磨,且鑽頭進退裝置2對運送第一鑽頭座211與第二鑽頭座212所作的二偏轉方向是相反的,再者,當第一鑽頭座211 或第二鑽頭座212進行裝設待研磨之鑽頭時,另一裝設於第一鑽頭座211或第二鑽頭座212之鑽頭正進行被研磨著,當裝設於第一鑽頭座211或第二鑽頭座212之待研磨之鑽頭進行被運送至第一砂輪121與第二砂輪122處之時,該另一裝設於第一鑽頭座211或第二鑽頭座212之鑽頭已經研磨完畢,並正在被運送至鑽頭交換裝置42處,再經由鑽頭交換裝置42將已經研磨好之鑽頭從第一鑽頭座211或第二鑽頭座212中夾取出,此時夾取出之研磨好之鑽頭呈現與上平面111平行的方向,鑽頭交換裝置42再將研磨好之鑽頭運送至鑽頭翻轉裝置41,鑽頭翻轉裝置41再將研磨好之鑽頭翻轉方向,使研磨好之鑽頭與上平面111呈現垂直的方向,以待取出至該外部。 The feeding and unloading device 4 includes a bit turning device 41 and a bit changing device 42. When a bit to be ground is fed from the outside, one of the long axes of the bit to be ground is associated with the wheel carrier 1 The upper plane 111 of the base 11 is fed in a vertical direction, and the drill turning device 41 reverses the direction of the drill to be ground to make the long axis of the drill bit (the related directions are described later as "long axial direction"). In the direction parallel to the upper plane 111, the bit exchange device 42 then grips the drill bit to be ground and mounts the drill bit to be ground on the first bit holder 211 or the second bit holder 212, so that The drill advance and retreat device 2 swings at an angle to transport the first drill bit 211 or the second drill bit 212 loaded with the drill bit to be ground to the first grinding wheel 121 and the second grinding wheel 122 for grinding, and the drill bit advances and retreats. The device 2 is opposite to the two deflection directions of the first bit holder 211 and the second bit holder 212. Further, when the first bit holder 211 When the second bit holder 212 is mounted with the bit to be polished, another bit mounted on the first bit holder 211 or the second bit holder 212 is being ground, when mounted on the first bit holder 211 or the first When the drill bit to be grounded by the second bit holder 212 is transported to the first grinding wheel 121 and the second grinding wheel 122, the other bit mounted on the first bit holder 211 or the second bit holder 212 has been ground, and Is being transported to the bit exchange device 42 and then the drill bit that has been ground is removed from the first bit holder 211 or the second bit holder 212 via the bit exchange device 42. In the direction parallel to the plane 111, the bit changing device 42 transports the ground bit to the bit turning device 41. The bit turning device 41 reverses the direction of the ground bit so that the ground bit and the upper surface 111 are perpendicular. Wait to be taken out to the outside.

以下將第4B圖與第4C圖地以更邏輯式的描述以將整個系統是如何以先後次序進行研磨的程序。第4B圖與第4C圖中,待研磨之鑽頭從一輸送裝置5之一入料輸送帶51運送至一機械手臂52,該機械手臂52於是將待研磨之鑽頭夾取運送至鑽頭翻轉裝置41,此時鑽頭是與上平面111呈現垂直的方向,故鑽頭翻轉裝置41將鑽頭翻轉成與上平面111平行的方向,鑽頭交換裝置42於是可以取得待研磨之鑽頭,並接著偏轉一角度θ 3(或有另一實施方式,即鑽頭翻轉裝置41可以平移),此時,一X軸向位移裝置25則往調校裝置3移動,並接近到第二攝像裝置321所在之處,待研磨之鑽頭於是被轉送至且固定於第一鑽頭座211之一頭端,第一攝像裝置311、第一電荷耦合裝置312 與第二攝像裝置321、第二電荷耦合裝置322並配合環狀光源裝置3211對待研磨之鑽頭D提供的環型光源,對待研磨之鑽頭D的相關尺寸與固定於第一鑽頭座211時之各相關位置進行檢測,與透過一Z軸大行程位移裝置23、一旋轉軸26(旋轉角度θ 1)、該X軸向位移裝置25、一Z軸微調位移裝置24與一迴轉軸裝置22(旋轉角度θ 2)調整彼此間的動作配合,進行各種調整,調校完成後,該迴轉軸裝置22進行一角度的迴轉,以將待研磨之鑽頭D移動至介於第一圓心A與第一砂輪121與第二砂輪122之中間位置M之間,此時,砂輪承載裝置1會沿著假想長軸Y’往第4B圖所示的該輸送裝置5的方向移動,待研磨之鑽頭D於是會先後經過第一研磨面1211與第二研磨面1221,以進行第一次研磨,當經過第一次研磨之待研磨之鑽頭D位於介於第二圓心B與第一砂輪121與第二砂輪122之中間位置M之間時,砂輪承載裝置1會沿著假想長軸Y’往第4B圖所示的輸送裝置5的相反方向移動,以令經過第一次研磨之鑽頭D移動回到介於第一圓心A與第一砂輪121與第二砂輪122之中間位置M之間,該旋轉軸26會旋轉角度θ 1度(本實施例係180度),以轉換鑽頭D另一側尚未研磨的部分而進行第二次研磨,此時,砂輪承載裝置1會再沿著假想長軸Y’往第4B圖所示的輸送裝置5的方向移動,待研磨之鑽頭D於是會再先後經過第一研磨面1211與第二研磨面1221,以進行第二次研磨,當經過第二次研磨之已經研磨好之鑽頭D再度位於介於第二圓心B與第一 砂輪121與第二砂輪122之中間位置M之間時,砂輪承載裝置1會再度沿著假想長軸Y’往第4B圖所示的輸送裝置5的相反方向移動,以令經過第二次研磨之鑽頭D移動而再度回到介於第一圓心A與第一砂輪121與第二砂輪122之中間位置M之間,接著,砂輪承載裝置1停止移動,迴轉軸裝置22再進行一角度的迴轉,以將研磨好之鑽頭D移動至剛剛進行調校的位置,第一攝像裝置311、第一電荷耦合裝置312與第二攝像裝置321、第二電荷耦合裝置322並配合環狀光源裝置3211對研磨好之鑽頭D提供的環型光源,對鑽頭D的相關尺寸進行檢測,檢測完畢後,鑽頭交換裝置42會將固定於第一鑽頭座211之該頭端的研磨好之鑽頭D取下,再偏轉一角度θ 3以移至鑽頭翻轉裝置41附近處(或有另一實施方式,即鑽頭翻轉裝置41可以平移回來),此時鑽頭D與上平面111平行,鑽頭翻轉裝置41將鑽頭D自鑽頭交換裝置42取下並翻轉90度,以使鑽頭D與上平面111垂直,以方便機械手臂52將研磨好之鑽頭D夾取運送至一出料輸送帶53,並運送出去。以上所述係單一之鑽頭從待研磨到研磨好的整個程序,而另一安裝於第二鑽頭座212之一頭端則是相反的。亦即,當安裝於第一鑽頭座211之頭端的鑽頭正在被研磨著時,第二鑽頭座212之頭端正在安裝另一待研磨之鑽頭;當安裝於第一鑽頭座211之頭端的鑽頭研磨完畢而進行自第一鑽頭座211之頭端卸載時,安裝於第二鑽頭座212之頭端的鑽頭正在被研磨著,如此則可以往復地運用。值得注意的是, 第一鑽頭座211移動至研磨位置時,鑽頭進退裝置2所擺動的方向恰與第二鑽頭座212移動至研磨位置時,鑽頭進退裝置2所擺動的方向相反,如第4A圖中之往復箭頭所示。 The following is a more logical description of Figures 4B and 4C to illustrate how the entire system is ground in a sequential order. In FIGS. 4B and 4C, the drill to be ground is transported from a feed conveyor belt 51 of a conveyor device 5 to a robot arm 52, which then grips the drill bit to be ground to the drill bit turning device 41. At this time, the drill bit is in a direction perpendicular to the upper plane 111, so that the bit turning device 41 turns the drill bit into a direction parallel to the upper plane 111, and the bit exchange device 42 can then take the drill bit to be ground and then deflect an angle θ 3 (Or another embodiment, that is, the bit turning device 41 can be translated), at this time, an X-axis displacement device 25 moves to the adjusting device 3 and approaches to where the second camera device 321 is located, to be ground. The drill bit is then transferred to and fixed to one of the head ends of the first bit holder 211, the first camera 311, and the first charge coupled device 312. And the second image pickup device 321 and the second charge coupled device 322 cooperate with the annular light source provided by the annular light source device 3211 for the drill D to be ground, the relevant size of the drill D to be ground and each fixed to the first bit holder 211 The relevant position is detected, and a Z-axis large stroke displacement device 23, a rotating shaft 26 (rotation angle θ 1), the X-axis displacement device 25, a Z-axis fine adjustment displacement device 24 and a rotary shaft device 22 (rotation) The angle θ 2) adjusts the motion cooperation with each other, and performs various adjustments. After the adjustment is completed, the rotary shaft device 22 performs an angle rotation to move the drill D to be ground to between the first center A and the first grinding wheel. Between 121 and the intermediate position M of the second grinding wheel 122, at this time, the grinding wheel carrier 1 will move along the imaginary long axis Y' in the direction of the conveying device 5 shown in FIG. 4B, and the drill D to be ground will The first grinding surface 1211 and the second grinding surface 1221 are successively passed to perform the first grinding. When the first grinding ground D to be ground is located between the second center B and the first grinding wheel 121 and the second grinding wheel 122 Grinding wheel between the middle position M The carrier device 1 moves along the imaginary long axis Y' in the opposite direction of the conveying device 5 shown in FIG. 4B to move the bit D that has undergone the first grinding back to the first center A and the first wheel 121. Between the intermediate position M of the second grinding wheel 122, the rotating shaft 26 is rotated by an angle of θ 1 degree (180 degrees in this embodiment), and the second grinding is performed by converting the unmilled portion on the other side of the drill bit D. When the grinding wheel carrier device 1 moves along the imaginary long axis Y' to the conveying device 5 shown in FIG. 4B, the drill bit D to be polished then passes through the first grinding surface 1211 and the second grinding surface 1221. For the second grinding, when the second grinding has been ground, the drill D is again located between the second center B and the first When between the grinding wheel 121 and the intermediate position M of the second grinding wheel 122, the grinding wheel carrier 1 will again move along the imaginary long axis Y' in the opposite direction of the conveying device 5 shown in Fig. 4B, so that the second grinding is performed. The drill bit D moves back to between the first center A and the intermediate position M between the first grinding wheel 121 and the second grinding wheel 122. Then, the grinding wheel carrier 1 stops moving, and the rotary shaft device 22 performs another angle of rotation. The first imaging device 311, the first charge coupled device 312 and the second imaging device 321 and the second charge coupled device 322 are coupled to the annular light source device 3211 to move the drill bit D to the position just adjusted. The ring-shaped light source provided by the drill bit D is ground, and the relevant size of the drill bit D is detected. After the detection, the bit exchange device 42 removes the ground drill D fixed to the head end of the first bit holder 211, and then An angle θ 3 is deflected to move to the vicinity of the bit turning device 41 (or another embodiment, that is, the bit turning device 41 can be translated back), at which time the drill bit D is parallel to the upper plane 111, and the bit turning device 41 will drill the bit D from drill Converting means 42 is removed and turned 90 degrees to the drill bit D and the vertical plane 111, the robot arm 52 in order to facilitate better gripping of the milling bit D conveyed to an outfeed conveyor 53, and conveyed out. As described above, the single bit is from the entire process to be ground to the grinding, and the other end of the second bit holder 212 is opposite. That is, when the drill bit mounted at the head end of the first bit holder 211 is being ground, another bit to be ground is being installed at the head end of the second bit holder 212; when the bit is mounted at the head end of the first bit holder 211 When the grinding is completed and the tip end of the first bit holder 211 is unloaded, the drill bit attached to the tip end of the second bit holder 212 is being ground, and thus can be used reciprocally. It is worth noting that When the first bit holder 211 is moved to the grinding position, the direction in which the bit advancing and retracting device 2 swings is just opposite to the direction in which the bit advancing and retracting device 2 is swung when the second bit holder 212 is moved to the grinding position, as shown in FIG. 4A. Shown.

請參閱第5A圖至第5D圖,係本發明之研磨鑽頭的方法之一鑽頭之一端面成型之步驟圖。如第5A圖所示,鑽頭的端面在研磨後共有四個研磨面,係一第一被研磨面M、一第二被研磨面N、一第三被研磨面O與一第四被研磨面P,其中,該第一被研磨面M係由一直線A2B2、一曲線B2C1、一曲線C1D2、一曲線D2D3與一直線D3A2所圍成之區域,該第二被研磨面N係由該直線A2D3、一曲線D3E1、一直線E1F1與一直線F1A2所圍成之區域,該第三被研磨面O係由該直線A2F1、一曲線F1H1、一曲線H1I2、一曲線I2I3及一直線I3A2所圍成之區域,該第四被研磨面P係由該直線A2I3、一直線I3J1、一直線J1B2及該直線B2A2圍成之區域。如第5A圖所示,當鑽頭端面經過該第一研磨面1211時,會研磨出一直線A1B1、一曲線B1C1、一曲線C1D1及一直線D1A1所圍成之區域;如第5B圖所示,當鑽頭端面經過該第二研磨面1221時,會研磨出一直線A1'D3、一曲線D3E1、一直線E1F1’及一直線F1’A1’所圍成之區域;如此,整體鑽頭會經由第一鑽頭座211與第二鑽頭座212進行180°的自轉,鑽頭端面會再經過該第一研磨面1211研磨,而得出如第5C圖所示,由一直線G1F1、一曲線F1H1、一曲線H1I1及一直線I1G1 所圍成之區域;如第5D圖所示,當鑽頭端面經過該第二研磨面1221時,會研磨出由一直線A2I3、一曲線I3J1、一直線J1B2及一直線B2A2所圍成之區域。因在研磨時會有超出各被研磨面的範圍,故有依次研磨出的被研磨面與完全磨出的四個被研磨面所呈現的範圍稍有不一樣。 Please refer to FIGS. 5A to 5D, which are diagrams showing the steps of one end face forming of one of the drills of the method for grinding a drill bit according to the present invention. As shown in FIG. 5A, the end surface of the drill has a total of four polished surfaces after polishing, and is a first polished surface M, a second polished surface N, a third polished surface O and a fourth polished surface. P, wherein the first surface to be polished M is a region surrounded by a straight line A2B2, a curved line B2C1, a curved line C1D2, a curved line D2D3, and a straight line D3A2, and the second polished surface N is composed of the straight line A2D3, one The area surrounded by the curve D3E1, the straight line E1F1 and the straight line F1A2, the third surface to be polished O is an area surrounded by the straight line A2F1, a curve F1H1, a curve H1I2, a curve I2I3 and a straight line I3A2, the fourth The surface to be polished P is a region surrounded by the straight line A2I3, the straight line I3J1, the straight line J1B2, and the straight line B2A2. As shown in FIG. 5A, when the end face of the drill passes through the first polishing surface 1211, a region surrounded by a straight line A1B1, a curved line B1C1, a curved line C1D1, and a straight line D1A1 is ground; as shown in FIG. 5B, when the drill bit is drilled When the end surface passes through the second polishing surface 1221, a region surrounded by a straight line A1'D3, a curve D3E1, a straight line E1F1', and a straight line F1'A1' is polished; thus, the entire drill bit passes through the first bit holder 211 and the first bit The two bit holder 212 performs 180° rotation, and the end face of the drill bit is further polished by the first grinding surface 1211, and as shown in FIG. 5C, the straight line G1F1, a curve F1H1, a curve H1I1, and a straight line I1G1 are obtained. The enclosed area; as shown in Fig. 5D, when the end face of the drill passes through the second polished surface 1221, a region surrounded by a straight line A2I3, a curved line I3J1, a straight line J1B2, and a straight line B2A2 is ground. Since there is a range beyond the surface to be polished at the time of polishing, the surface to be polished which is sequentially polished is slightly different from the range in which the four surfaces to be polished are completely polished.

然而,上述各研磨面的形成,是在鑽頭整體或端面之中心線高度等於第一砂輪121與第二砂輪122之假想連接線AB的高度,才不會有第二被研磨面N與第四被研磨面P分離或重疊的狀況發生。本發明之研磨鑽頭的方法即在於可以避免鑽頭整體或端面之中心線高度高於或低於第一砂輪121與第二砂輪122之假想連接線AB的高度,而不致有第二研磨面N與第四被研磨面P分離或重疊的狀況發生。請參閱第6A-1與6A-2圖,係本發明之研磨鑽頭的方法之一第一較佳實施例之步驟圖式。該方法包括以下步驟:(1)開始;(2)將該待研磨之第一鑽頭裝設於第一鑽頭座211,並將第一鑽頭送至二砂輪121、122間作研磨,並完成研磨;(3)利用第一鑽頭之四個研磨面定義出該二砂輪121、122之圓心A、B間一假想連接線AB之高度H,如第5D圖所示的第四被研磨面P之兩點A2、I3連成之線段其高度,即為二砂輪121、122之圓心A、B間之假想連接線AB之高度H;(4)判斷該完成研磨之第一鑽頭之一中心線高度H1(圖中未 示)是否與該二砂輪之假想連接線之高度H不同,若是,進入步驟(5),若否,進入步驟(10);(5)判斷該中心線高度H1是否高於二砂輪之假想連接線之高度H,若是,則是重疊,進入步驟(6),若否,進入步驟(7);(6)利用一Z軸微調位移裝置24將該鑽頭座211降低,並進入步驟(9);(7)中心線高度H1低於二砂輪121、122之假想連接線AB之高度H,則是分離;(8)利用該Z軸微調位移裝置24將該鑽頭座211升高,並進入步驟(9);(9)將該第一鑽頭送至二砂輪121、122間作研磨,並完成研磨,進入步驟(4);(10)中心線高度H1等於二砂輪121、122之假想連接線之高度H;(11)記錄該鑽頭座211此時之高度P(圖中未示),得出鑽頭座211之一標準高度;(12)將該待研磨之第二鑽頭裝設於鑽頭座211,利用Z軸微調位移裝置24調整鑽頭座211至一標準高度P,並檢測得到鑽頭之一中心線高度H2(圖中未示);(13)判斷該鑽頭之一中心線高度H2是否與一二砂輪121、122之二圓心A、B之假想連接線AB高度H不同,若是,進入步驟(14),若否,進入步驟(18);(14)判斷該中心線高度H2是否高於二砂輪121、122之假 想連接線AB之高度H,若是,進入步驟(15),若否,進入步驟(16);(15)利用Z軸微調位移裝置24將鑽頭座211降低,以達中心線高度H2等於二砂輪121、122之假想連接線AB之高度H,並進入步驟(19);(16)中心線高度H2低於二砂輪121、122之假想連接線AB之高度H;(17)利用Z軸微調位移裝置24將鑽頭座211升高,以達中心線高度H2等於二砂輪121、122之假想連接線AB之高度H,並進入步驟(19);(18)中心線高度H2等於二砂輪121、122之假想連接線AB之高度H;(19)將鑽頭送至該二砂輪121、122間作研磨,並完成研磨;(20)退出完成研磨之鑽頭;(21)是否尚有鑽頭待研磨,若是,進入步驟(12),若否,進入步驟(22);以及(22)結束。 However, each of the above-mentioned polishing surfaces is formed such that the height of the center line of the entire drill or the end surface is equal to the height of the imaginary connection line AB of the first grinding wheel 121 and the second grinding wheel 122, so that there is no second surface to be polished N and the fourth. A condition in which the polished surface P is separated or overlapped occurs. The method for grinding the drill bit of the present invention is to prevent the height of the center line of the whole or the end surface of the drill bit from being higher or lower than the height of the imaginary connection line AB of the first grinding wheel 121 and the second grinding wheel 122 without the second grinding surface N and The fourth separated surface P is separated or overlapped. Please refer to Figures 6A-1 and 6A-2 for the step diagram of a first preferred embodiment of the method of grinding a drill bit of the present invention. The method comprises the following steps: (1) starting; (2) mounting the first drill to be ground on the first bit holder 211, and feeding the first bit to the two grinding wheels 121, 122 for grinding and finishing grinding (3) Defining the height H of an imaginary connecting line AB between the centers A and B of the two grinding wheels 121 and 122 by using the four grinding faces of the first drill bit, as shown in the fifth polished surface P of FIG. The height of the line connecting the two points A2 and I3 is the height H of the imaginary connecting line AB between the centers A and B of the two grinding wheels 121 and 122; (4) determining the height of the center line of the first drill bit which is finished grinding H1 (not in the picture Is it different from the height H of the imaginary connecting line of the two grinding wheels, if yes, proceed to step (5), if not, proceed to step (10); (5) determine whether the center line height H1 is higher than the imaginary connection of the two grinding wheels The height H of the line, if yes, overlaps, proceeds to step (6), if not, proceeds to step (7); (6) lowers the bit holder 211 by a Z-axis fine adjustment displacement device 24, and proceeds to step (9) (7) the center line height H1 is lower than the height H of the imaginary connection line AB of the two grinding wheels 121, 122, and is separated; (8) the bit seat 211 is raised by the Z-axis fine adjustment displacement device 24, and the steps are advanced. (9); (9) the first drill bit is sent to the two grinding wheels 121, 122 for grinding, and the grinding is completed, and the step (4) is entered; (10) the center line height H1 is equal to the imaginary connecting line of the two grinding wheels 121, 122. Height H; (11) record the height P (not shown) of the bit holder 211 at this time, and obtain a standard height of the bit holder 211; (12) install the second bit to be ground on the bit holder 211, using the Z-axis fine adjustment displacement device 24 to adjust the bit holder 211 to a standard height P, and detecting a center line height H2 of the drill bit (not shown); (13) determining the Is the center line height H2 of the head different from the imaginary connection line AB height H of the two centers A and B of the two or two grinding wheels 121, 122, and if so, proceeds to step (14), and if not, proceeds to step (18); (14) Determine whether the center line height H2 is higher than the false ones of the two grinding wheels 121, 122 If you want to connect the height H of the line AB, if yes, go to step (15), if not, go to step (16); (15) use the Z-axis fine adjustment displacement device 24 to lower the bit holder 211 to reach the center line height H2 equal to the two-wheel The height H of the imaginary connection line AB of 121, 122, and proceeds to step (19); (16) the center line height H2 is lower than the height H of the imaginary connection line AB of the two grinding wheels 121, 122; (17) the Z-axis fine adjustment displacement The device 24 raises the bit holder 211 so that the center line height H2 is equal to the height H of the imaginary connecting line AB of the two grinding wheels 121, 122, and proceeds to step (19); (18) the center line height H2 is equal to the two grinding wheels 121, 122 The imaginary connection line AB height H; (19) the drill bit is sent to the two grinding wheels 121, 122 for grinding and finishing grinding; (20) exiting the finished grinding bit; (21) whether there is any bit to be ground, if Go to step (12), if no, go to step (22); and (22) end.

請參閱第6B-1與6B-2圖,係本發明之研磨鑽頭的方法之一第二較佳實施例之步驟圖式。該方法包括以下步驟:(1’)開始;(2’)將該待研磨之第一鑽頭裝設於第一鑽頭座211,並將第一鑽頭送至二砂輪121、122間作研磨,並完成研磨;(3’)利用第一鑽頭之四個研磨面定義出該二砂輪121、122 之圓心A、B間一假想連接線AB之高度H,如第5D圖所示的第四被研磨面P之兩點A2、I3連成之線段其高度,即為二砂輪121、122之圓心A、B間之假想連接線AB之高度H;(4’)判斷該完成研磨之第一鑽頭之一中心線高度H1(圖中未示)是否與該二砂輪之假想連接線之高度H不同,若是,進入步驟(5’),若否,進入步驟(10’);(5’)判斷該中心線高度H1是否高於二砂輪之假想連接線之高度H,若是,則是重疊,進入步驟(6’),若否,進入步驟(7’);(6’)利用該Z軸微調位移裝置24將該承載二砂輪之砂輪座12提高,並進入步驟(9’);(7’)中心線高度H1低於二砂輪121、122之假想連接線AB之高度H,則是分離;(8’)利用該Z軸微調位移裝置24將該砂輪座12降低,並進入步驟(9’);(9’)將該第一鑽頭送至二砂輪121、122間作研磨,並完成研磨,進入步驟(4’);(10’)中心線高度H1等於二砂輪121、122之假想連接線之高度H;(11’)記錄該砂輪座12此時之高度P(圖中未示),得出砂輪座12之一標準高度;(12’)將該待研磨之第二鑽頭裝設於鑽頭座211,利用Z軸微調位移裝置24調整砂輪座12至一標準高度P’,並檢 測得到鑽頭之一中心線高度H2(圖中未示);(13’)判斷該鑽頭之一中心線高度H2是否與二砂輪121、122之二圓心A、B之假想連接線AB高度H不同,若是,進入步驟(14’),若否,進入步驟(18’);(14’)判斷該中心線高度H2是否高於二砂輪121、122之假想連接線AB之高度H,若是,進入步驟(15’),若否,進入步驟(16’);(15’)利用Z軸微調位移裝置24將砂輪座12升高,以達中心線高度H2等於二砂輪121、122之假想連接線AB之高度H,並進入步驟(19’);(16’)中心線高度H2低於二砂輪121、122之假想連接線AB之高度H;(17’)利用Z軸微調位移裝置24將砂輪座12降低,以達中心線高度H2等於二砂輪121、122之假想連接線AB之高度H,並進入步驟(19’);(18’)中心線高度H2等於二砂輪121、122之假想連接線AB之高度H;(19’)將鑽頭送至該二砂輪121、122間作研磨,並完成研磨;(20’)退出完成研磨之鑽頭;(21’)是否尚有鑽頭待研磨,若是,進入步驟(12’),若否,進入步驟(22’);以及(22’)結束。 Please refer to Figures 6B-1 and 6B-2 for the step diagram of a second preferred embodiment of the method of grinding a drill bit of the present invention. The method comprises the steps of: (1') starting; (2') mounting the first drill to be ground on the first bit holder 211, and sending the first bit to the two grinding wheels 121, 122 for grinding, and Finishing the grinding; (3') defining the two grinding wheels 121, 122 by using the four grinding faces of the first drill bit The height H of the imaginary connecting line AB between the centers A and B, and the height of the line connecting the two points A2 and I3 of the fourth ground surface P as shown in FIG. 5D, which is the center of the two grinding wheels 121 and 122 (4') determining whether the center line height H1 (not shown) of the first drill bit that is finished grinding is different from the height H of the imaginary connection line of the two grinding wheels If yes, proceed to step (5'), if not, proceed to step (10'); (5') determine whether the centerline height H1 is higher than the height H of the imaginary connecting line of the two grinding wheels, and if so, overlap and enter Step (6'), if not, proceeding to step (7'); (6') using the Z-axis fine adjustment displacement device 24 to raise the wheel holder 12 carrying the two-wheel, and proceeding to step (9'); (7' The center line height H1 is lower than the height H of the imaginary connection line AB of the two grinding wheels 121, 122, and is separated; (8') the Z wheel axis fine adjustment displacement device 24 is used to lower the wheel head 12, and the step (9' is entered. (9') the first drill bit is sent to the two grinding wheels 121, 122 for grinding, and the grinding is completed, and the step (4') is entered; (10') the center line height H1 is equal to the two grinding wheel 121 The height H of the imaginary connecting line of 122; (11') records the height P (not shown) of the wheel head 12 at this time, and obtains a standard height of the wheel head 12; (12') the first to be ground The second drill bit is mounted on the drill bit holder 211, and the grinding wheel base 12 is adjusted to a standard height P' by the Z-axis fine adjustment displacement device 24, and is inspected. One center line height H2 of the drill bit is measured (not shown); (13') determines whether the center line height H2 of the drill bit is different from the imaginary connection line AB height H of the two centers A and B of the two grinding wheels 121, 122. If yes, proceed to step (14'), if not, proceed to step (18'); (14') determine whether the centerline height H2 is higher than the height H of the imaginary connecting line AB of the two grinding wheels 121, 122, and if so, enter Step (15'), if not, proceed to step (16'); (15') raise the wheel base 12 by the Z-axis fine adjustment displacement device 24 to reach the center line height H2 equal to the imaginary connection line of the two grinding wheels 121, 122 The height H of AB, and proceeds to step (19'); (16') the center line height H2 is lower than the height H of the imaginary connecting line AB of the two grinding wheels 121, 122; (17') the grinding wheel is adjusted by the Z-axis fine adjustment displacement device 24. The seat 12 is lowered so that the center line height H2 is equal to the height H of the imaginary connecting line AB of the two grinding wheels 121, 122, and proceeds to step (19'); (18') the center line height H2 is equal to the imaginary connection of the two grinding wheels 121, 122 The height H of the line AB; (19') the drill bit is sent to the two grinding wheels 121, 122 for grinding, and the grinding is completed; (20') exits the grinding drill ; (21 ') is yet to be ground drill, if yes, proceeds to step (12'), and if not, proceeds to step (22 '); and (22') ends.

該第一實施例之步驟係調整鑽頭座之高度,該第二實 施例之步驟係調整砂輪座之高度,以令待研磨鑽頭之中心線高度等於二砂輪之假想連接線之高度相同。但要補充說明的是,第二實施例之調整砂輪座之高度之目的主要是令待研磨鑽頭之中心線高度等於二砂輪之假想連接線之高度相同,所以本發明之研磨鑽頭的方法與鑽頭研磨系統亦可不調整砂輪座之高度,而僅直接調整其中一砂輪之高度,惟其具體實施方式係本發明所屬技術領域具有通常知識者依據本說明書而能瞭解者,故不在此加以贅述。 The step of the first embodiment adjusts the height of the bit holder, the second The step of the embodiment adjusts the height of the wheel base so that the height of the center line of the drill to be ground is equal to the height of the imaginary connection line of the two grinding wheels. However, it should be additionally noted that the purpose of adjusting the height of the wheel base of the second embodiment is mainly to make the height of the center line of the drill to be ground equal to the height of the imaginary connection line of the two grinding wheels, so the method of grinding the drill bit and the drill bit of the present invention The grinding system may not adjust the height of the grinding wheel seat, but only adjust the height of one of the grinding wheels directly. However, the specific embodiment is known to those skilled in the art to which the present invention pertains, and therefore will not be described herein.

因此,由以上步驟得知,本發明之研磨鑽頭的方法具有以下兩種優點: Therefore, it is known from the above steps that the method of grinding a drill bit of the present invention has the following two advantages:

1.判斷鑽頭研磨面分離或重疊狀況是否發生。 1. Determine whether the separation or overlap of the grinding surface of the drill bit occurs.

2.校正鑽頭中心線高度。 如此,本發明可以確實解決習知技術中所產生的『分離』與『重疊』的狀況,進而達到先找出砂輪中心線之標準高度,再對每一隻待研磨的鑽頭其中心線高度的校正的功效。 2. Correct the height of the drill centerline. In this way, the present invention can surely solve the situation of "separation" and "overlap" generated in the prior art, thereby first finding the standard height of the center line of the grinding wheel, and then the height of the center line of each bit to be ground. The effectiveness of the correction.

再者,第5A圖至第5D圖所顯示的四個被研磨面M、N、O、P係屬對稱平均分佈之勢;然,目前市售的鑽頭亦有非對稱分佈的被研磨面,本發明之研磨鑽頭的方法亦可以生產出該非對稱分佈的被研磨面。 Furthermore, the four polished surfaces M, N, O, and P shown in Figures 5A to 5D are symmetrically distributed; however, currently available drill bits have asymmetrically distributed surfaces to be polished. The method of grinding a drill bit of the present invention can also produce the asymmetrically distributed surface to be polished.

此外,為了避免習知之將檢測後的不符合需求的鑽頭直接退料並丟棄而浪費資源,請參閱第7圖,係本發明之研磨鑽頭的方法之一第三較佳實施例之步驟圖式,該研磨鑽頭的方法可使用於本發明之鑽頭研磨系統,但不以此為 限,以下將詳細說明該研磨鑽頭的方法。 In addition, in order to avoid the waste of resources by directly returning and discarding the undesired drill bit after detection, please refer to FIG. 7 , which is a step diagram of a third preferred embodiment of the method for grinding a drill bit according to the present invention. The method of grinding a drill bit can be used in the drill grinding system of the present invention, but not Limitations, the method of grinding the drill bit will be described in detail below.

首先,一開始先進入步驟S1,將鑽頭置於鑽頭進退裝置上,接著進至步驟S2;在步驟S2中,以砂輪研磨該鑽頭,接著進至步驟S3;在步驟S3中,檢測該鑽頭,並判斷該鑽頭是否符合需求,若是,則進至步驟S4,若否,則回到步驟S2;在步驟S4中,從該鑽頭進退裝置上取下該鑽頭,然後結束本發明之研磨鑽頭的方法。 First, initially, the process proceeds to step S1, the drill bit is placed on the drill advance and retreat device, and then proceeds to step S2; in step S2, the drill bit is ground by the grinding wheel, and then proceeds to step S3; in step S3, the drill bit is detected. And determining whether the drill bit meets the demand, if yes, proceeding to step S4, if not, returning to step S2; in step S4, removing the drill bit from the drill advance and retreat device, and then ending the method of grinding the drill bit of the present invention .

要補充說明的是,前述實施例係以旋轉方式移動鑽頭後並進行再次研磨(即回磨),但本發明之鑽頭研磨系統的鑽頭移動方式亦可為直線性方式,如第8圖所示,裝有待研磨鑽頭的鑽頭進退裝置首先從進料裝置出發,並依序通過第一站之調校裝置、第二站之砂輪承載裝置、第三站之調校裝置與第四站之砂輪承載裝置,最後到達出料裝置。於第一站中,調校裝置針對待研磨鑽頭進行端面及側面檢測,以提供研磨數據;於第二站中,砂輪承載裝置進行首次研磨;於第三站中,調校裝置進行首次研磨後的鑽頭品質檢測,如品質不良,則檢測鑽頭的端面及側面,以提供再次研磨時所需的數據;於第四站中,砂輪承載裝置對品質不良的鑽頭進行再次研磨,但如果在第三站時檢測為良品之鑽頭,則不進行再次研磨。前述鑽頭進退裝置可採用輸送帶之移動方式。又雖第8圖係示意為四站型式之鑽頭研磨系統,但本發明之實施並不以此為限。 It should be noted that the foregoing embodiment moves the drill bit in a rotating manner and performs re-grinding (ie, back grinding), but the bit movement mode of the drill grinding system of the present invention may also be a linear manner, as shown in FIG. The drill advance and retreat device equipped with the drill to be ground first starts from the feeding device, and sequentially passes through the adjusting device of the first station, the grinding wheel carrying device of the second station, the adjusting device of the third station and the grinding wheel of the fourth station. The device finally reaches the discharge device. In the first station, the calibrating device performs end face and side detection on the drill to be ground to provide grinding data; in the second station, the grinding wheel carrier performs the first grinding; in the third station, the calibrating device performs the first grinding Drill quality inspection, if the quality is poor, the end face and side of the drill bit are tested to provide the data required for re-grinding; in the fourth station, the grinding wheel carrier re-grinds the poor quality drill bit, but if in the third If the bit is detected as a good bit at the station, it will not be re-ground. The aforementioned drill advance and retreat device can adopt a moving mode of the conveyor belt. Further, although FIG. 8 is a schematic diagram of a four-station type drill grinding system, the implementation of the present invention is not limited thereto.

由上可知,由於本發明之研磨鑽頭的方法與鑽頭研磨系統係於判斷研磨後之鑽頭不符合需求時,再次研磨該鑽 頭(即回磨該鑽頭),直到符合需求為止,故不會丟棄任何鑽頭,而有效節省資源,且整體良率可達100%;此外,本發明係於判斷研磨後之鑽頭不符合需求後,不進行出料動作,而立即在鑽頭研磨系統上再次進行研磨,所以可完全自動化,使整體效率極高。 It can be seen from the above that since the method of grinding the drill bit of the present invention and the drill grinding system are to determine that the drill bit after grinding does not meet the demand, the drill is ground again. The head (that is, the drill bit is honed) until it meets the demand, so no drill bit is discarded, and resources are effectively saved, and the overall yield can reach 100%; in addition, the present invention is to judge that the drill bit after grinding does not meet the demand The material is sprayed again on the drill grinding system without the discharge operation, so it can be fully automated, making the overall efficiency extremely high.

於是,本發明專利申請案係利用發明人豐富的經驗,以極富創意的構思,設計出簡單卻能充分解決習知技術的問題。因此,本發明專利申請案的功能,確實符合具有新穎性與進步性的專利要件。 Thus, the patent application of the present invention utilizes the inventor's rich experience to design a simple but fully problematic solution to the conventional technology with a very creative concept. Therefore, the function of the patent application of the present invention does meet the patent requirements of novelty and progress.

唯以上所述者,僅為本發明之較佳實施例,當不能以之限制本發明範圍。即大凡依本發明申請專利範圍所做之均等變化及修飾,仍將不失本發明之要義所在,亦不脫離本發明之精神和範圍,故都應視為本發明的進一步實施狀況。 The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto. It is to be understood that the scope of the present invention is not limited by the spirit and scope of the present invention, and should be considered as a further embodiment of the present invention.

S‧‧‧端面 S‧‧‧ end face

W1‧‧‧砂輪 W1‧‧‧ grinding wheel

W2‧‧‧砂輪 W2‧‧‧ grinding wheel

W11‧‧‧研磨面 W11‧‧‧Grinding surface

W22‧‧‧研磨面 W22‧‧‧Grinding surface

M1‧‧‧第一被研磨面 M1‧‧‧ first ground surface

N1‧‧‧第二被研磨面 N1‧‧‧Second ground surface

O1‧‧‧第三被研磨面 O1‧‧‧ third polished surface

P1‧‧‧第四被研磨面 P1‧‧‧ fourth polished surface

L7‧‧‧鑽頭中心線 L7‧‧‧bit centerline

L6‧‧‧砂輪中心假想連接線 L6‧‧‧ Grinding wheel center imaginary connection line

R10‧‧‧鑽頭座 R10‧‧‧ bit holder

R11‧‧‧鑽頭 R11‧‧‧ drill bit

R12‧‧‧研磨部 R12‧‧‧ Grinding Department

U‧‧‧支架 U‧‧‧ bracket

S‧‧‧端面 S‧‧‧ end face

A6‧‧‧點 A6‧‧‧ points

B6‧‧‧點 B6‧‧‧ points

C6‧‧‧點 C6‧‧‧ points

D6‧‧‧點 D6‧‧‧ points

D7‧‧‧點 D7‧‧ points

A7‧‧‧點 A7‧‧ points

F7‧‧‧點 F7‧‧ points

H7‧‧‧點 H7‧‧ points

I7‧‧‧點 I7‧‧ points

I6‧‧‧點 I6‧‧ points

J6‧‧‧點 J6‧‧ points

d‧‧‧垂直距離 D‧‧‧vertical distance

D‧‧‧鑽頭 D‧‧‧Drill

Y’‧‧‧假想長軸 Y’‧‧‧ imaginary long axis

M‧‧‧第一被研磨面 M‧‧‧First ground surface

N‧‧‧第二被研磨面 N‧‧‧Second ground surface

O‧‧‧第三被研磨面 O‧‧‧The third surface to be polished

P‧‧‧第四被研磨面 P‧‧‧Four polished surface

A2‧‧‧點 A2‧‧ points

B2‧‧‧點 B2‧‧ points

C1‧‧‧點 C1‧‧ points

D2‧‧‧點 D2‧‧ points

D3‧‧‧點 D3‧‧‧ points

E1‧‧‧點 E1‧‧‧ points

F1‧‧‧點 F1‧‧ points

H1‧‧‧點 H1‧‧‧ points

I2‧‧‧點 I2‧‧ points

I3‧‧‧點 I3‧‧ points

J1‧‧‧點 J1‧‧ points

G1‧‧‧點 G1‧‧‧ points

I1‧‧‧點 I1‧‧‧ points

F1’‧‧‧點 F1’‧‧‧ points

A1’‧‧‧點 A1’‧‧‧ points

1‧‧‧砂輪承載裝置 1‧‧‧Wheel carrier

11‧‧‧底座 11‧‧‧Base

111‧‧‧上平面 111‧‧‧Upper plane

12‧‧‧砂輪座 12‧‧‧ wheel seat

121‧‧‧第一砂輪 121‧‧‧First grinding wheel

1211‧‧‧第一研磨面 1211‧‧‧First ground surface

122‧‧‧第二砂輪 122‧‧‧Second grinding wheel

1221‧‧‧第二研磨面 1221‧‧‧Second ground surface

13‧‧‧第一驅動裝置 13‧‧‧First drive

14‧‧‧第二驅動裝置 14‧‧‧Second drive

15‧‧‧驅動軸 15‧‧‧Drive shaft

2‧‧‧鑽頭進退裝置 2‧‧‧Drill advance and retreat device

21‧‧‧鑽頭固定裝置 21‧‧‧Drill fixing device

211‧‧‧第一鑽頭座 211‧‧‧First bit holder

212‧‧‧第二鑽頭座 212‧‧‧Second bit holder

22‧‧‧迴轉軸裝置 22‧‧‧Rotary shaft device

23‧‧‧Z軸大行程位移裝置 23‧‧‧Z-axis large stroke displacement device

24‧‧‧Z軸微調位移裝置 24‧‧‧Z-axis fine-tuning displacement device

25‧‧‧X軸向位移裝置 25‧‧‧X axial displacement device

26‧‧‧旋轉軸 26‧‧‧Rotary axis

3‧‧‧調校裝置 3‧‧‧ Calibration device

31‧‧‧第一影像擷取調校裝置 31‧‧‧First image capture adjustment device

311‧‧‧第一攝像裝置 311‧‧‧First camera

312‧‧‧第一電荷耦合裝置 312‧‧‧First charge coupled device

32‧‧‧第二影像擷取調校裝置 32‧‧‧Second image capture adjustment device

321‧‧‧第二攝像裝置 321‧‧‧second camera

3211‧‧‧環狀光源裝置 3211‧‧‧Circular light source device

322‧‧‧第二電荷耦合裝置 322‧‧‧Second charge coupled device

4‧‧‧進退料裝置 4‧‧‧Incoming and unloading device

41‧‧‧鑽頭翻轉裝置 41‧‧‧Drill bit turning device

42‧‧‧鑽頭交換裝置 42‧‧‧Drill exchange device

5‧‧‧輸送裝置 5‧‧‧Conveyor

51‧‧‧入料輸送帶 51‧‧‧Feed conveyor belt

52‧‧‧機械手臂 52‧‧‧ Robotic arm

θ 3‧‧‧角度 θ 3‧‧‧ angle

θ 1‧‧‧旋轉角度 θ 1‧‧‧ rotation angle

θ 2‧‧‧旋轉角度 θ 2‧‧‧Rotation angle

(1)~(22)、(1’)~(22’)、S1~S4‧‧‧步驟 (1)~(22), (1’)~(22’), S1~S4‧‧

第1圖係一鑽頭中心線高度低於二砂輪中心假想連接線高度之相對位置關係示意圖;第2A圖係一鑽頭中心線高度低於二砂輪中心假想連接線高度所研磨出之鑽頭端面示意圖;第2B圖係一鑽頭中心線高度高於二砂輪中心假想連接線高度所研磨出之鑽頭端面示意圖;第3A圖係習知技術中對二砂輪之左砂輪進行後退之二砂輪中心假想連接線之位移差示意圖; 第3B圖係習知技術中對二砂輪之右砂輪進行前進之二砂輪中心假想連接線之位移差示意圖;第4A圖係本發明之一種研磨鑽頭的方法所應用之鑽頭研磨系統之一較佳實施例立體示意圖;第4B圖係本發明之研磨鑽頭的方法所應用之鑽頭研磨系統之該較佳實施例上視示意圖;第4C圖係本發明之研磨鑽頭的方法所應用之鑽頭研磨系統之較佳實施例之鑽頭進退裝置與調校裝置之側視示意圖;第5A圖至第5D圖係本發明之研磨鑽頭的方法之一鑽頭之一端面成型之步驟圖;第6A-1與6A-2圖係本發明之研磨鑽頭的方法之一第一較佳實施例之步驟圖式;第6B-1與6B-2圖係本發明之研磨鑽頭的方法之一第二較佳實施例之步驟圖式;第7圖係本發明之研磨鑽頭的方法之一第三較佳實施例之步驟圖式;以及第8圖係本發明之鑽頭研磨系統的示意圖。 Figure 1 is a schematic diagram showing the relative positional relationship between the height of the centerline of a drill bit and the height of the imaginary connecting line of the center of the second grinding wheel; Figure 2A is a schematic view of the end face of the drill bit which is grounded at a height lower than the height of the imaginary connecting line of the center of the second grinding wheel; 2B is a schematic diagram of the end face of the drill bit which is grounded by the height of the center line of the drill bit higher than the height of the imaginary connecting line of the center of the second grinding wheel; FIG. 3A is a schematic connection line of the center of the second grinding wheel which is retracted from the left grinding wheel of the second grinding wheel in the prior art. Schematic diagram of the displacement difference; FIG. 3B is a schematic diagram showing the displacement difference of the center imaginary connecting line of the two grinding wheels for advancing the right grinding wheel of the two grinding wheel in the prior art; FIG. 4A is a preferred one of the bit grinding systems applied to the method for grinding the drill bit of the present invention. 3B is a schematic top view of the preferred embodiment of the bit grinding system to which the method of grinding a drill bit of the present invention is applied; and FIG. 4C is a bit grinding system to which the method of grinding a drill bit of the present invention is applied A side view of the drill advancement and retreat device and the aligning device of the preferred embodiment; FIGS. 5A to 5D are diagrams showing the step of forming one end face of the drill bit of the method for grinding the drill bit of the present invention; FIGS. 6A-1 and 6A- 2 is a step diagram of a first preferred embodiment of the method for grinding a drill bit of the present invention; and FIGS. 6B-1 and 6B-2 are diagrams showing a second preferred embodiment of the method for grinding a drill bit of the present invention. Figure 7 is a schematic view of a third preferred embodiment of the method of grinding a drill bit of the present invention; and Figure 8 is a schematic view of the drill grinding system of the present invention.

S1~S4‧‧‧步驟 S1~S4‧‧‧ steps

Claims (9)

一種研磨鑽頭的方法,係包括以下步驟:(1)將鑽頭置於鑽頭進退裝置上;(2)以砂輪研磨該鑽頭;以及(3)檢測該鑽頭,並判斷該鑽頭是否符合需求,若是,則從該鑽頭進退裝置上取下該鑽頭,若否,則回到步驟(2)。 A method of grinding a drill bit, comprising the steps of: (1) placing a drill bit on a drill bit advance and retreat device; (2) grinding the drill bit with a grinding wheel; and (3) detecting the drill bit and determining whether the drill bit meets a demand, and if so, Then, the drill bit is removed from the drill advance and retreat device, and if not, the process returns to step (2). 如申請專利範圍第1項所述之研磨鑽頭的方法,其中,步驟(2)之流程係包括:將該鑽頭送至二該砂輪間作研磨,以定義出二研磨砂輪裝置之圓心間之一假想連接線之一高度;以及校正該鑽頭之一中心線之一高度與二該砂輪之圓心間之假想連接線之高度成相同高度,以定義出一承載該鑽頭之鑽頭座之一標準高度。 The method of grinding a drill bit according to claim 1, wherein the step (2) comprises: feeding the drill bit to the grinding wheel to perform grinding to define one of the centers of the two grinding wheel devices. The height of one of the imaginary connecting lines; and the height of one of the centerlines of one of the drill bits is the same height as the height of the imaginary connecting line between the centers of the grinding wheels to define a standard height of a bit holder carrying the bit. 如申請專利範圍第2項所述之研磨鑽頭的方法,其中,將該鑽頭送至二該砂輪間作研磨,以定義出二研磨砂輪裝置之圓心間之一假想連接線之一高度之流程係包括:將該待研磨之鑽頭裝設於該鑽頭座,並將該鑽頭送至二該砂輪間作研磨,並完成研磨;以及利用該鑽頭之四個研磨面定義出二該砂輪之圓心間之假想連接線之高度。 The method of grinding a drill bit according to claim 2, wherein the drill bit is sent to the grinding wheel to perform grinding to define a height of one of the imaginary connecting lines between the centers of the two grinding wheel devices. The method comprises: installing the drill bit to be ground on the drill bit seat, sending the drill bit to the grinding wheel to perform grinding, and completing the grinding; and defining four grinding surfaces of the grinding wheel to define the center of the grinding wheel The height of the imaginary connection line. 如申請專利範圍第2項所述之研磨鑽頭的方法,其中,校正該鑽頭之一中心線之一高度與二該砂輪之圓心間 之假想連接線之高度成相同高度,以定義出一承載該鑽頭之鑽頭座之一標準高度係包括以下步驟:(41)判斷該完成研磨之鑽頭之該中心線之該高度是否與二砂輪之假想連接線之高度不同,若是,則進入步驟(42),若否,則進入步驟(46);(42)判斷該中心線之高度是否高於二砂輪之假想連接線之高度,若是,則進入步驟(43),若否,則進入步驟(44);(43)將該鑽頭座之高度降低,並進入步驟(45);(44)將該鑽頭座之高度升高,並進入步驟(45);(45)將該鑽頭送至二砂輪間作研磨,並完成研磨,進入步驟(41);以及(46)記錄該鑽頭座此時之高度,而得出該鑽頭座之標準高度。 The method of grinding a drill bit according to claim 2, wherein the height of one of the center lines of the drill bit is corrected to be between the center of the grinding wheel The height of the imaginary connecting line is at the same height to define a standard height of a bit holder carrying the drill bit, comprising the following steps: (41) determining whether the height of the center line of the drill bit that is finished grinding is equal to the two grinding wheel If the height of the imaginary connecting line is different, if yes, proceed to step (42), if not, proceed to step (46); (42) determine whether the height of the center line is higher than the height of the imaginary connecting line of the second grinding wheel, and if so, Proceed to step (43), if not, proceed to step (44); (43) lower the height of the bit holder, and proceed to step (45); (44) raise the height of the bit holder and enter the step ( 45); (45) the drill bit is sent to the second grinding wheel for grinding, and the grinding is completed, the step (41) is entered; and (46) the height of the bit seat is recorded at this time, and the standard height of the bit holder is obtained. 一種鑽頭研磨系統,係包括:砂輪承載裝置,係包括用以研磨鑽頭的砂輪;鑽頭進退裝置,係用以承載與移動鑽頭;調校裝置,係用以檢測研磨後之該鑽頭,並判斷該鑽頭是否符合需求;以及進退料裝置,係用以將待研磨之鑽頭設置於該鑽頭進退裝置上,且若該調校裝置判斷研磨後之該鑽頭符合需求,則該進退料裝置係用以從該鑽頭進退裝置上取下該鑽頭,若該調校裝置判斷研磨後之該鑽頭不符合需求,則該砂輪再次研磨該鑽頭。 A drill grinding system includes: a grinding wheel carrying device comprising a grinding wheel for grinding a drill bit; a drill bit advance and retreat device for carrying and moving the drill bit; and a adjusting device for detecting the drilled bit, and determining the Whether the drill bit meets the requirements; and the feeding and unloading device is configured to set the drill to be grounded on the drill advance and retreat device, and if the adjusting device determines that the drilled bit meets the demand after grinding, the feeding and unloading device is used to The drill bit is removed from the drill bit advance and retreat device, and if the trimming device determines that the drill bit after grinding does not meet the demand, the grinding wheel grinds the drill bit again. 如申請專利範圍第5項所述之鑽頭研磨系統,其中,該砂輪承載裝置係具有底座、砂輪座與驅動裝置,該砂輪座係裝設於該底座之一上平面上,且該砂輪座上設有該砂輪,該驅動裝置係驅動該砂輪。 The drill grinding system of claim 5, wherein the grinding wheel carrier has a base, a wheel base and a driving device, the grinding wheel seat is mounted on an upper surface of the base, and the grinding wheel seat The grinding wheel is provided, and the driving device drives the grinding wheel. 如申請專利範圍第6項所述之鑽頭研磨系統,其中,該鑽頭進退裝置係一旋轉裝置,以將裝設於其上的一鑽頭固定裝置進行平行於砂輪承載裝置之底座之上平面的擺動,該鑽頭固定裝置具有至少一鑽頭座,該鑽頭座係用以固定該鑽頭。 The drill grinding system of claim 6, wherein the drill advancement and retraction device is a rotating device for aligning a drill fixing device mounted thereon parallel to a plane above the base of the grinding wheel carrier device. The drill bit fixture has at least one bit holder for securing the drill bit. 如申請專利範圍第7項所述之鑽頭研磨系統,其中,該調校裝置係具有至少一影像擷取調校裝置,該影像擷取調校裝置包括攝像裝置與電荷耦合裝置,經由該攝像裝置對鑽頭影像的攝影及該電荷耦合裝置對鑽頭影像的擷取,以檢測該鑽頭座上的該鑽頭。 The drill grinding system of claim 7, wherein the adjusting device has at least one image capturing and adjusting device, and the image capturing and adjusting device comprises an image capturing device and a charge coupled device, via the image capturing device The photographing of the bit image and the capture of the bit image by the charge coupled device to detect the bit on the bit holder. 如申請專利範圍第8項所述之鑽頭研磨系統,其中,該進退料裝置係包括一鑽頭翻轉裝置及一鑽頭交換裝置,當一待研磨之鑽頭從外部送入時,該待研磨之鑽頭之一長軸向是與該砂輪承載裝置之該底座之該上平面呈現垂直的方向送入,該鑽頭翻轉裝置將該待研磨之鑽頭翻轉方向,使鑽頭之該長軸向呈現與上平面平行的方向,該鑽頭交換裝置於是夾取待研磨之鑽頭,並將待研磨之鑽頭裝設於該鑽頭座上,於是,該鑽頭進退裝置進行一定角度的擺動,以將裝上待研磨之鑽頭的鑽頭座運送至該研磨砂輪裝置處進行研磨,再者,當該鑽頭已經研磨 完畢且符合需求時,將該鑽頭運送至鑽頭交換裝置處,再經由鑽頭交換裝置將該鑽頭從鑽頭座中夾取出,此時夾取出之研磨好之鑽頭呈現與上平面平行的方向,該鑽頭交換裝置再將研磨好之鑽頭運送至鑽頭翻轉裝置,該鑽頭翻轉裝置再將研磨好之鑽頭翻轉方向,使研磨好之鑽頭與上平面呈現垂直的方向,以待取出至該外部。 The bit grinding system of claim 8, wherein the feeding and unloading device comprises a bit turning device and a bit changing device, and when the bit to be ground is fed from the outside, the bit to be ground is a long axial direction is fed in a direction perpendicular to the upper plane of the base of the grinding wheel carrier, and the drill turning device reverses the direction of the drill to be ground so that the long axial direction of the drill bit is parallel to the upper plane In the direction, the bit exchange device then grips the drill bit to be ground, and installs the drill bit to be ground on the drill bit seat, so that the drill advance and retreat device swings at an angle to load the drill bit to be drilled The seat is transported to the grinding wheel device for grinding, and further, when the bit has been ground When it is completed and meets the requirements, the drill bit is transported to the bit exchange device, and the drill bit is taken out from the bit holder through the bit exchange device. At this time, the drilled bit that is taken out of the clamp presents a direction parallel to the upper plane, and the drill bit is in a direction parallel to the upper plane. The exchange device then transports the ground bit to the bit turning device, which in turn reverses the direction of the ground bit so that the ground bit is perpendicular to the upper plane to be removed to the exterior.
TW101149664A 2012-12-25 2012-12-25 Drill bit grinding method and drill bit grinding system TW201315567A (en)

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WO2014101484A1 (en) * 2012-12-25 2014-07-03 Chiu Po Horng Drill grinding method and drill grinding system

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