TW201315568A - Drill bit grinding system and drill bit grinding method - Google Patents

Drill bit grinding system and drill bit grinding method Download PDF

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TW201315568A
TW201315568A TW101149665A TW101149665A TW201315568A TW 201315568 A TW201315568 A TW 201315568A TW 101149665 A TW101149665 A TW 101149665A TW 101149665 A TW101149665 A TW 101149665A TW 201315568 A TW201315568 A TW 201315568A
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grinding
height
bit
drill bit
drill
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TW101149665A
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Bo-Hong Qiu
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Hotwu Technology Co Ltd
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Abstract

A drill bit grinding method capable of accurately performing grinding, comprising: (1) grinding a drill bit mounted on a drill bit holder to define the height of an imaginary wire between the centers of circle of two grinders on a base; (2) performing a positioning operation to align the height of the central line of the drill bit to the height of the imaginary wire to define the standard height of the drill bit holder, the base or the grinders; (3) mounting another drill bit to be ground on the drill bit holder and detecting the height of the central line of the another drill bit according to the standard height; (4) performing a calibration operation to align the height of the central line of the another drill bit to the height of the imaginary wire; (5) grinding the another drill bit; and (6) determining whether there is any drill bit to be re-ground, and if yes, performing steps (3) to (5).

Description

研磨鑽頭系統及研磨鑽頭之方法 Grinding bit system and method of grinding bit

本發明係關於一種研磨鑽頭系統及研磨鑽頭方法,尤指一種能研磨出具高精密性研磨面的鑽頭之系統及方法。 The present invention relates to a method for grinding a drill bit system and a grinding bit, and more particularly to a system and method for grinding a drill bit with a high precision abrasive surface.

隨著印刷電路板的應用範圍增加,由早期單層板增加成多層板,故在各層之間的電路即需要有連接線路,以可讓各層板的印刷電路彼此電性連接。因此,這些貫穿於各層板的連接線路是要透過一些極端細小的鑽頭鑽孔後,才可通透於各層板間。這些細小的鑽頭其尺寸可能如頭髮一般細小,如此才可鑽出細小的孔洞,以供印刷電路板的線路通過。依據上述的需求與應用,可以得出幾個重點: As the application range of printed circuit boards increases, from the early single-layer boards to multi-layer boards, the circuits between the layers need to have connection lines to allow the printed circuits of the layers to be electrically connected to each other. Therefore, these connecting lines running through the various layers are drilled through some extremely thin drill bits before they can penetrate between the layers. These tiny drill bits may be as small as the hair so that small holes can be drilled for the printed circuit board to pass through. Based on the above requirements and applications, several key points can be drawn:

1.需求量大:概因印刷線路板的應用廣泛,所以其週邊工業亦隨之成正比增加。 1. Large demand: Due to the wide application of printed circuit boards, the surrounding industries have also increased in proportion.

2.尺寸精準:概因應用於精密工業,故鑽頭之各種尺寸是必須非常精準的。 2. Accurate size: The reason is applied to precision industry, so the various dimensions of the drill bit must be very precise.

因此,在鑽頭精準地去鑽孔之前,其自身的精度也必須是非常高的。若是精密度不夠而有誤差,則所鑽出來的孔會相對地誤差更大,也有可能造成鑽頭斷裂。因此,在生產製造時對鑽頭的研磨,其精密度是非常重要的。 Therefore, before the drill bit is accurately drilled, its own precision must also be very high. If the precision is not enough and there is an error, the hole drilled will have a relatively large error, and it may cause the bit to break. Therefore, the precision of grinding the drill bit during production is very important.

現有技術中已提出各種功能及設計各異的鑽頭研磨裝置,例如申請人已公告之我國新型專利M415018號以及申請人提出之專利申請案100119767號及100131638號(以 上全部併入本文作參考),惟其於使用上仍有需要進行改良及優化之處。 Various types of drill grinding devices with different functions and designs have been proposed in the prior art, such as the new patent No. M415018 issued by the applicant and the patent applications 100119767 and 100131638 proposed by the applicant. All of which are incorporated herein by reference), however, there are still areas for improvement and optimization in use.

如第6圖所示,正常情況下,一鑽頭座21挟持一鑽頭9a,且一支架210支持該鑽頭9a的一研磨部90,以將該鑽頭9a的中心線之高度h保持與二砂輪120a、120b之圓心間之假想連接線L之高度H相同,而該研磨部90之一端面90a則為研磨處。於實際研磨時,該端面90a會直接垂直接觸該砂輪120a、120b之二研磨面1200a、1200b。因此,進行多次研磨後,h將不等於H。 As shown in Fig. 6, normally, a bit holder 21 holds a drill bit 9a, and a bracket 210 supports a grinding portion 90 of the drill bit 9a to maintain the height h of the center line of the drill bit 9a with the second grinding wheel 120a. The height H of the imaginary connecting line L between the centers of 120b is the same, and one end surface 90a of the polishing portion 90 is a grinding place. During the actual grinding, the end surface 90a directly contacts the two grinding surfaces 1200a, 1200b of the grinding wheel 120a, 120b. Therefore, after multiple grindings, h will not equal H.

如第7圖所示,該鑽頭9a的中心線之高度h低於該假想連接線L之高度H。當研磨後,點A6與點A7並無交於一點,亦即第二研磨面T2(後續詳述)與第四研磨面T4(後續詳述)未有交點,而業界稱分離。 As shown in Fig. 7, the height h of the center line of the drill 9a is lower than the height H of the imaginary connecting line L. After the grinding, the point A6 and the point A7 do not intersect at one point, that is, the second polishing surface T2 (described in detail later) and the fourth polishing surface T4 (described in detail later) have no intersection, and the industry refers to separation.

如第8圖所示,該鑽頭9a的中心線之高度h高於該假想連接線L之高度H。當研磨後,點A6與點A7並無交於一點,亦即該第二研磨面T2與第四研磨面T4各有一線段A6A7是彼此的交線,而業界稱重疊。 As shown in Fig. 8, the height h of the center line of the drill 9a is higher than the height H of the imaginary connecting line L. After the grinding, the point A6 and the point A7 do not intersect at one point, that is, the second polishing surface T2 and the fourth polishing surface T4 each have a line segment A6A7 which is the intersection of each other, and the industry refers to the overlap.

不論高於或低於之情況,若h與H差距為1μm,於研磨過程中因先形成第一研磨面T1(後續詳述)與第二研磨面T2後,該鑽頭座21進行自轉180度,再研磨產生第三研磨面T3(後續詳述)與第四研磨面T4。因此,該第二研磨面T2與第四研磨面T4的二邊線即誤差2μm,而對於鑽PCB上的孔而言,此誤差是不符合要求。 Regardless of the above or below, if the difference between h and H is 1 μm, the bit holder 21 is rotated 180 degrees after the first polishing surface T1 (described in detail later) and the second polishing surface T2 are formed in the grinding process. Then, grinding further produces a third polishing surface T3 (described in detail later) and a fourth polishing surface T4. Therefore, the error of the two sides of the second polishing surface T2 and the fourth polishing surface T4 is 2 μm, and this error is not satisfactory for the hole in the drill PCB.

再者,習知研磨鑽頭的機器具有二個砂輪120a、120b, 再加上其它配合的機具,如驅動裝置、底座、砂輪座等,整體而言是非常沉重的。在此條件下,幾乎無法調整該砂輪120a、120b之誤差。理由如下:如第9圖所示,調整左邊之砂輪120b位移一距離d,使該砂輪120b後退1μm至圖中虛線位置,則該假想連接線L之高度H會升高一高度值r(r=2.801μm);如第10圖所示,調整右邊之砂輪120a位移一距離d’,使該砂輪120a前進1μm至圖中虛線位置,則該假想連接線L之高度H會升高一高度值r’(r’=3.165μm)。其高度值r,r’之計算公式為:r,r’=砂輪之移動量/[tan(∠右砂輪)-tan(∠左砂輪)]×cos(∠移動之砂輪) Moreover, the machine for grinding a drill bit has two grinding wheels 120a, 120b, In addition, other matching tools, such as the drive unit, the base, the wheel holder, etc., are very heavy overall. Under this condition, the error of the grinding wheels 120a, 120b can hardly be adjusted. The reason is as follows: as shown in Fig. 9, when the grinding wheel 120b on the left side is displaced by a distance d so that the grinding wheel 120b is retracted by 1 μm to the position of the broken line in the figure, the height H of the imaginary connecting line L is raised by a height value r (r). =2.801μm); as shown in Fig. 10, the grinding wheel 120a on the right side is displaced by a distance d', and the grinding wheel 120a is advanced by 1 μm to the position of the broken line in the figure, and the height H of the imaginary connecting line L is raised by a height value. r' (r' = 3.165 μm). The calculation formula of the height value r, r' is: r, r' = the amount of movement of the grinding wheel / [tan (∠ right grinding wheel) - tan (∠ left grinding wheel)] × cos (∠ moving wheel)

由第7至10圖得知,要修正2μm的分離/重疊量,只可調整該假想連接線L的移動量1μm。然而,若要以機械方式調整左砂輪120b,則僅能調整移動量0.357μm,其計算公式為:[tan(∠右砂輪)-tan(∠左砂輪)]×cos(∠左砂輪)×左砂輪移動之垂直距離(如第9圖所示的垂直距離d,其值為1μm)。 It is understood from the seventh to tenth drawings that the amount of separation/overlap of 2 μm is corrected, and only the movement amount of the virtual connection line L can be adjusted by 1 μm. However, if the left grinding wheel 120b is to be mechanically adjusted, only the movement amount of 0.357 μm can be adjusted, and the calculation formula is: [tan (∠ right grinding wheel)-tan (∠ left grinding wheel)] × cos (∠ left grinding wheel) × left The vertical distance the grinding wheel moves (as shown in Figure 9, the vertical distance d, which is 1 μm).

由上可知,因移動量(即0.357μm)極小,故以現行機械方式(如手指撥動)極具難度,亦即幾乎無法調整該砂輪120a、120b之誤差。 As can be seen from the above, since the amount of movement (i.e., 0.357 μm) is extremely small, it is extremely difficult to use the current mechanical method (such as finger movement), that is, the error of the grinding wheel 120a, 120b can hardly be adjusted.

因此,如何克服習知技術中之種種問題,實已成目前亟欲解決的課題。 Therefore, how to overcome various problems in the prior art has become a problem that is currently being solved.

本發明之主要目的在於提供一種研磨鑽頭系統及研磨鑽頭方法,以可以判斷鑽頭研磨面分離或重疊狀況的產生,又可以進行鑽頭中心線高度不準的校正,以研磨出具有高度精密性的研磨面的鑽頭。 The main object of the present invention is to provide a method for grinding a drill bit system and a grinding bit to judge the separation or overlapping of the grinding surface of the drill bit, and to correct the height of the center line of the drill bit to grind the grinding with high precision. Drill bit.

本發明提供一種研磨鑽頭方法,係包括:(1)將一裝設於鑽頭座上之鑽頭進行研磨,以定義出設於一座體上之兩砂輪之圓心間之一假想連接線之一高度;(2)定位作業,使該鑽頭之中心線之高度與該假想連接線之高度相同,以定義出該鑽頭座、座體或砂輪之標準高度;(3)將待研磨之另一鑽頭裝設於該鑽頭座,並依該標準高度檢測出該另一鑽頭之中心線高度;(4)校正作業,使該另一鑽頭之中心線高度與該假想連接線之高度相同;(5)研磨該另一鑽頭;以及(6)判斷是否有其它鑽頭需研磨,若有,則進行步驟(3)至(5)。 The invention provides a method for grinding a drill bit, comprising: (1) grinding a drill bit mounted on a drill bit to define a height of one of the imaginary connecting lines between the centers of the two grinding wheels disposed on the body; (2) Positioning operation such that the height of the center line of the drill bit is the same as the height of the imaginary connecting line to define the standard height of the bit holder, the seat body or the grinding wheel; (3) installing another drill bit to be ground In the bit holder, and detecting the height of the center line of the other bit according to the standard height; (4) correcting the operation so that the height of the center line of the other bit is the same as the height of the imaginary connecting line; (5) grinding the Another drill bit; and (6) determine if there are other drill bits to be ground, and if so, perform steps (3) through (5).

本發明提供一種研磨鑽頭系統,係包括:一砂輪承載裝置,係包含一座體、設於該座體上之一第一砂輪及一第二砂輪,該第一砂輪具有一第一研磨面及與該第一研磨面位於同側之一第一圓心,且該第二砂輪具有一第二研磨面及與該第二研磨面位於同側之一第二圓心,而該第一圓心與第二圓心之間係假想相連而定義為一假想連接線,又該砂輪承載裝置係沿該假想連接線之方向作往復式移動;一鑽頭進退裝置,係以旋轉方式位移鑽頭,該鑽頭進退裝置包含至少二用以固定鑽頭之鑽頭座,當其中一鑽頭座移至該第一與第二砂輪進行研磨時,其它鑽頭座將位於一預備 處;以及一調校裝置,係用以對固定於該些鑽頭座上之已研磨或待研磨之鑽頭進行監測與調整;及當研磨一鑽頭時,利用該調校裝置進行校正,使該鑽頭之中心線高度與該假想連接線之高度相同,以定義出一標準高度,俾供後續研磨其它鑽頭時,該研磨鑽頭系統以該標準高度進行對位。 The present invention provides a grinding bit system comprising: a grinding wheel carrying device comprising a body, a first grinding wheel and a second grinding wheel disposed on the seat body, the first grinding wheel having a first grinding surface and The first grinding surface is located at a first center of the same side, and the second grinding wheel has a second grinding surface and a second center on the same side as the second polishing surface, and the first center and the second center The imaginary connection is defined as an imaginary connecting line, and the grinding wheel carrying device moves reciprocally along the direction of the imaginary connecting line; a drill advance and retreat device rotates the drill bit in a rotating manner, and the drill advance and retreat device comprises at least two The bit holder for fixing the drill bit, when one of the bit holders is moved to the first and second grinding wheels for grinding, the other bit holders will be located in a preliminary preparation And a calibration device for monitoring and adjusting the drilled or to-be-polished drill bit fixed to the drill bit holders; and when grinding a drill bit, using the adjustment device for correction to make the drill bit The height of the centerline is the same as the height of the imaginary link to define a standard height at which the drill bit system is aligned for subsequent grinding of other drill bits.

第1A、1B圖係本發明之鑽頭研磨系統之兩實施例之立體示意圖,該鑽頭研磨系統包括:一砂輪承載裝置1、一鑽頭進退裝置2、一調校裝置3以及一進退料裝置4。 1A and 1B are perspective views of two embodiments of the drill grinding system of the present invention. The drill grinding system includes a grinding wheel carrier device 1, a drill bit advance and retreat device 2, a calibration device 3, and an inlet and outlet device 4.

所述之砂輪承載裝置1係包含一座體(於此係為一底座11與一砂輪座12之組合)、第一驅動裝置13與一第二驅動裝置14,該砂輪座12係裝設於該底座11之一上平面11a上,且於該砂輪座12上係延著該底座11之上平面11a之一假想長軸Y排列配置一第一砂輪121與一第二砂輪122,而該第一與第二驅動裝置13、14係分別驅動該第一與第二砂輪121、122。 The grinding wheel carrier device 1 includes a body (in this case, a combination of a base 11 and a wheel base 12), a first driving device 13 and a second driving device 14, and the wheel housing 12 is mounted thereon. The first grinding wheel 121 and the second grinding wheel 122 are arranged on the upper surface 11a of the base 11 and the first grinding wheel 121 and the second grinding wheel 122 are arranged on the imaginary long axis Y of the upper surface 11a of the base 11. The first and second grinding wheels 121, 122 are driven separately from the second driving devices 13, 14.

兩實施例之主要差異在於該砂輪座12之結構,如第1A圖所示之砂輪座12係同時承載該第一與第二砂輪121、122,而如第1B圖所示之兩砂輪座12’係分別承載該第一與第二砂輪121、122。 The main difference between the two embodiments is the structure of the wheel base 12, as shown in Fig. 1A, the wheel base 12 simultaneously carries the first and second grinding wheels 121, 122, and the two wheel bases 12 as shown in Fig. 1B. The first and second grinding wheels 121, 122 are respectively carried.

於本實施例中,該第一砂輪121具有一第一研磨面121a及與該第一研磨面121a位於同側之一第一圓心A,且該第二砂輪122具有一第二研磨面122a及與該第二研磨 面122a位於同側之一第二圓心B,而該第一圓心A與該第二圓心B係假想相連而定義為一假想連接線AB,令該假想連接線AB係平行該假想長軸Y。 In the embodiment, the first grinding wheel 121 has a first polishing surface 121a and a first center A on the same side as the first polishing surface 121a, and the second grinding wheel 122 has a second polishing surface 122a and With the second grinding The surface 122a is located at a second center B of the same side, and the first center A and the second center B are imaginarily connected to each other and defined as an imaginary connecting line AB such that the imaginary connecting line AB is parallel to the imaginary long axis Y.

又,該第一與第二研磨面121a,122a分別與該底座11之上平面11a呈現第一角度α之傾斜與第二角度β之傾斜,且該第一角度α係小於該第二角度β。 Moreover, the first and second grinding surfaces 121a, 122a respectively exhibit a tilt of the first angle α and a tilt of the second angle β with respect to the upper plane 11a of the base 11, and the first angle α is smaller than the second angle β. .

另外,該砂輪承載裝置1係可利用一驅動軸15沿該假想長軸Y(即該假想連接線AB)的方向作往復式移動。 Further, the grinding wheel carrier 1 can be reciprocally moved in the direction of the imaginary long axis Y (i.e., the imaginary connecting line AB) by a drive shaft 15.

所述之鑽頭進退裝置2係包含一旋轉機構20、設於該旋轉機構20上之第一鑽頭座21a與一第二鑽頭座21b,以將裝設於該旋轉機構20上的第一與第二鑽頭座21a、21b進行平行於該底座11之上平面11a的擺動(如箭頭S方向),且該第一與第二鑽頭座21a、21b係能固定一待研磨之鑽頭9,而以旋轉方式位移該鑽頭9並準備進行研磨。 The drill advancing and retracting device 2 includes a rotating mechanism 20, a first bit seat 21a and a second bit seat 21b disposed on the rotating mechanism 20, to be mounted on the rotating mechanism 20 The two bit holders 21a, 21b are oscillated parallel to the upper surface 11a of the base 11 (as indicated by the arrow S direction), and the first and second bit holders 21a, 21b are capable of fixing a drill bit 9 to be ground, and are rotated The drill 9 is displaced in a manner and ready for grinding.

於本實施例中,當該第二鑽頭座21b擺動至該第一與第二砂輪121、122進行研磨時,該第一鑽頭座21a可位在一預備處,該預備處可依需求作規劃,例如,對應該調校裝置3或對應該進退料裝置4。 In this embodiment, when the second bit holder 21b is swung to the first and second grinding wheels 121, 122 for grinding, the first bit holder 21a can be placed at a preparation point, and the preparation portion can be planned according to requirements. For example, the device 3 should be adjusted or the device 4 should be fed in and out.

所述之調校裝置3係用以對固定於該第一與第二鑽頭座21a、21b上之已研磨或待研磨之鑽頭9進行監測與調整。 The adjusting device 3 is used for monitoring and adjusting the drilled or to be ground bit 9 fixed to the first and second bit holders 21a, 21b.

於本實施例中,該調校裝置3係包含一位移單元30、一第一影像擷取調校單元31與一第二影像擷取調校單元32。該位移單元30係用以升降該第一與第二砂輪121、122, 以調整該假想連接線AB之高度H,如第3圖所示。 In this embodiment, the calibration device 3 includes a displacement unit 30, a first image capture adjustment unit 31, and a second image capture adjustment unit 32. The displacement unit 30 is configured to lift the first and second grinding wheels 121, 122, To adjust the height H of the imaginary connecting line AB, as shown in FIG.

再者,該第一影像擷取調校單元31具有一第一攝像器311與一第一電荷耦合器(CCD)312,藉由該第一攝像器311對鑽頭影像的攝影及該第一電荷耦合器312對鑽頭影像的擷取,以從垂直於該底座11之上平面11a的方向監測該第一與第二鑽頭座21a、21b,而能對固定於該第一與第二鑽頭座21a、21b之已研磨或待研磨之鑽頭9的相關尺寸與相關位置進行監測與調整。 Furthermore, the first image capturing and aligning unit 31 has a first camera 311 and a first charge coupled device (CCD) 312, and the first image of the bit image and the first charge by the first camera 311 The coupler 312 captures the bit image to monitor the first and second bit holders 21a, 21b from a direction perpendicular to the upper surface 11a of the base 11, and is fixed to the first and second bit holders 21a. The relevant dimensions and associated positions of the drill bit 9 of 21b which has been ground or to be ground are monitored and adjusted.

又,該第二影像擷取調校單元32包含一第二攝像器321與一第二電荷耦合器(CCD)322,藉由該第二攝像器321對鑽頭影像的攝影及該第二電荷耦合器322對鑽頭影像的擷取,以從平行於該底座11之上平面11a的方向監測該第一與第二鑽頭座21a、21b,而能對固定於該第一與第二鑽頭座21a、21b之已研磨或待研磨之鑽頭9的相關尺寸與相關位置進行監測與調整。 The second image capturing and calibrating unit 32 includes a second camera 321 and a second charge coupled device (CCD) 322. The second camera 321 captures the bit image and the second charge coupled. The 322 captures the bit image to monitor the first and second bit holders 21a, 21b from a direction parallel to the upper surface 11a of the base 11, and is fixed to the first and second bit holders 21a, The relevant dimensions and associated positions of the bit 9 of the ground or to be ground 21b are monitored and adjusted.

另外,該第二攝像器321更具有一環狀光源結構3211(如第3圖所示),以對鑽頭9提供一環型光源(圖中未示),概因該鑽頭9之頂部很細,必須使用環型光源照射,才可提供無死角的照射,以進行精密的檢測。 In addition, the second camera 321 further has an annular light source structure 3211 (as shown in FIG. 3) to provide a ring-shaped light source (not shown) to the drill bit 9, because the top of the drill bit 9 is very thin. It must be illuminated with a toroidal source to provide a blind-free illumination for precise inspection.

所述之進退料裝置4係用以於一鑽頭取放處取放該第一與第二鑽頭座21a、21b上之鑽頭9。於本實施例中,該進退料裝置4包含一鑽頭翻轉單元41及一鑽頭交換單元42。 The feeding and unloading device 4 is used for picking up the drill bit 9 on the first and second bit holders 21a, 21b at a bit pick-and-place. In the present embodiment, the feeding and unloading device 4 includes a drill reversing unit 41 and a drill exchange unit 42.

具體地運作,當一待研磨之鑽頭從外部送入時,該待 研磨之鑽頭之長軸向與該砂輪承載裝置1之底座11之上平面11a呈現垂直的方向送入,該鑽頭翻轉單元41將該待研磨之鑽頭翻轉方向,使鑽頭之長軸向(以下簡稱長軸向)呈現與上平面11a平行的方向,再以該鑽頭交換單元42挾取待研磨之鑽頭,並將待研磨之鑽頭裝設於該第一鑽頭座21a或該第二鑽頭座21b上。接著,該鑽頭進退裝置2進行一定角度的擺動,以將該第一鑽頭座21a或第二鑽頭座21b運送至該第一砂輪121與該第二砂輪122處進行研磨,且該第一鑽頭座21a與第二鑽頭座21b的偏轉方向是相反。 Specifically, when a drill to be ground is fed from the outside, the waiting The long axis of the drill bit is fed in a direction perpendicular to the upper surface 11a of the base 11 of the grinding wheel carrier 1, and the bit reversing unit 41 reverses the direction of the bit to be ground to make the long axis of the bit (hereinafter referred to as The long axial direction is in a direction parallel to the upper plane 11a, and the drill bit to be ground is taken by the drill bit exchange unit 42 and the drill bit to be ground is mounted on the first drill bit 21a or the second drill bit 21b. . Then, the drill advancing and retracting device 2 swings at an angle to transport the first bit holder 21a or the second bit holder 21b to the first grinding wheel 121 and the second grinding wheel 122 for grinding, and the first bit holder The direction of deflection of 21a and the second bit holder 21b is opposite.

再者,當該第一鑽頭座21a進行裝設待研磨之鑽頭時,另一裝設於該第二鑽頭座21b之鑽頭正進行研磨。接著,當該第一鑽頭座21a之待研磨之鑽頭運送至該第一砂輪121與第二砂輪122處之時,該另一裝設於該第二鑽頭座21b之鑽頭已研磨完成,並正運送至該鑽頭交換單元42處,再經由該鑽頭交換單元42將已研磨好之鑽頭從該第二鑽頭座21b中取出,此時,取出之鑽頭呈現與該上平面11a平行的方向。之後,該鑽頭交換單元42將該鑽頭運送至該鑽頭翻轉單元41,該鑽頭翻轉單元41再將該鑽頭翻轉方向,使該鑽頭與該上平面11a呈現垂直的方向,以待取出至該外部。 Further, when the first bit holder 21a is mounted with the drill to be ground, the other bit mounted on the second bit holder 21b is being ground. Then, when the drill bit to be grounded of the first bit holder 21a is transported to the first grinding wheel 121 and the second grinding wheel 122, the other bit mounted on the second bit holder 21b is ground and finished. The drill bit is transported to the bit exchange unit 42, and the drilled bit is taken out from the second bit holder 21b via the bit exchange unit 42. At this time, the extracted bit presents a direction parallel to the upper plane 11a. Thereafter, the bit exchange unit 42 carries the bit to the bit reversing unit 41, which in turn reverses the bit so that the bit and the upper plane 11a assume a vertical direction to be taken out to the outside.

一併參照第2、3圖,將更清楚描述單一鑽頭9從待研磨至研磨好的整個研磨程序。 Referring to Figures 2 and 3 together, the entire grinding procedure from a single drill bit 9 to grinding will be more clearly described.

首先,待研磨之鑽頭9(亦可為鑽頭9’)從一輸送裝 置5之一入料輸送帶51運送至一機械手臂52,以將待研磨之鑽頭9挾取運送至該鑽頭翻轉單元41,此時,該鑽頭9與該上平面11a呈現垂直的方向,故該鑽頭翻轉單元41將該鑽頭9翻轉成與該上平面11a平行的方向,使該鑽頭交換單元42可取得待研磨之鑽頭9。 First, the drill bit 9 to be ground (also the drill bit 9') is transported from a conveyor One of the feed conveyor belts 51 is transported to a robot arm 52 to transport the drill bit 9 to be ground to the drill bit reversing unit 41. At this time, the drill bit 9 and the upper plane 11a are perpendicular to each other. The bit reversing unit 41 inverts the drill bit 9 in a direction parallel to the upper plane 11a, so that the bit exchange unit 42 can take the drill bit 9 to be ground.

接著,該鑽頭交換單元42偏轉一角度θ 3(或有另一實施方式,即該鑽頭交換單元42平移),此時,該第一與第二鑽頭座21a、21b藉由一X軸向位移裝置25往該調校裝置3移動,並接近至該第二攝像裝置321所在之處。 Next, the bit exchange unit 42 is deflected by an angle θ 3 (or another embodiment, that is, the bit exchange unit 42 translates), at which time the first and second bit holders 21a, 21b are displaced by an X-axis. The device 25 moves toward the calibration device 3 and approaches where the second camera device 321 is located.

接著,將待研磨之鑽頭9轉送至且固定於該第一鑽頭座21a之一頭端,使該第一攝像器311、第一電荷耦合器312、第二攝像器321與第二電荷耦合器322並配合該環狀光源結構3211進行監測該鑽頭9的相關尺寸與固定於該第一鑽頭座21a時之各相關位置之作業,同時,藉由一Z軸大行程位移裝置23、一旋轉軸26(旋轉角度θ 1)調整、該X軸向位移裝置25、一Z軸微調位移裝置24與一迴轉軸裝置22(旋轉角度θ 2)彼此間的動作配合,進行各種調整。 Next, the drill bit 9 to be ground is transferred to and fixed to one of the head ends of the first bit holder 21a, so that the first camera 311, the first charge coupler 312, the second camera 321 and the second charge coupler 322 And the annular light source structure 3211 is used to monitor the relevant size of the drill bit 9 and the relevant positions fixed to the first bit holder 21a, and at the same time, a Z-axis large stroke displacement device 23 and a rotating shaft 26 are provided. (Rotation angle θ 1) adjustment, the X-axis displacement device 25, a Z-axis fine adjustment displacement device 24, and a rotary axis device 22 (rotation angle θ 2) are coordinated with each other to perform various adjustments.

於調校完成之後,該迴轉軸裝置22進行一角度的迴轉,以將待研磨之鑽頭9移動至介於該第一圓心A與兩砂輪之中間位置M之間,此時,該砂輪承載裝置1會沿著假想長軸Y往該輸送裝置5的方向移動,使該鑽頭9會依序經過該第一研磨面121a與第二研磨面122a,以進行第一次研磨。 After the adjustment is completed, the rotary shaft device 22 performs an angle rotation to move the drill bit 9 to be grounded between the first center A and the intermediate position M of the two grinding wheels. At this time, the grinding wheel carrier device 1 moves along the imaginary long axis Y in the direction of the conveying device 5, so that the drill 9 passes through the first polishing surface 121a and the second polishing surface 122a in sequence to perform the first polishing.

當經過第一次研磨之後,該鑽頭9位於該第二圓心B 與該中間位置M之間,此時,該砂輪承載裝置1會沿著假想長軸Y往反方向移動(往復運動),以令該鑽頭9移回原先位於該第一圓心A與該中間位置M之間,該旋轉軸26會旋轉一角度θ 1(本實施例係180度),以轉換該鑽頭9之另一側尚未研磨的部分而進行如第一次研磨方式之第二次研磨。 The drill bit 9 is located at the second center B after the first grinding Between the intermediate position M and the intermediate position M, the grinding wheel carrier 1 will move in the opposite direction (reciprocating motion) along the imaginary long axis Y to move the drill bit 9 back to the first center A and the intermediate position. Between M, the rotating shaft 26 is rotated by an angle θ 1 (180 degrees in this embodiment) to convert the unpolished portion of the other side of the drill 9 to perform the second grinding as in the first grinding mode.

當經過第二次研磨之鑽頭9回到介於該第一圓心A與該中間位置M之間時,該砂輪承載裝置1停止移動。 When the drill bit 9 after the second grinding is returned between the first center A and the intermediate position M, the grinding wheel carrier 1 stops moving.

接著,該迴轉軸裝置22進行一角度的迴轉,以將研磨好之鑽頭9移動至剛剛進行調校的位置(即該調校裝置3之處),再以該第一與第二影像擷取調校單元31、32對該鑽頭9的相關尺寸進行監測。 Then, the rotary shaft device 22 performs an angle rotation to move the ground drill 9 to the position just adjusted (ie, the adjustment device 3), and then capture the first and second images. The calibrating units 31, 32 monitor the relevant dimensions of the drill bit 9.

待監測完畢後,該鑽頭交換單元42會將固定於第一鑽頭座21a之研磨好之鑽頭9取下,使該鑽頭9與該上平面11a平行,再偏轉一角度θ 3以移至該鑽頭翻轉單元41附近處(或平移該鑽頭翻轉單元41),再以該鑽頭翻轉單元41將鑽頭9取下並翻轉90度,使該鑽頭9與該上平面11a垂直,以便於該機械手臂52將研磨好之鑽頭9取送至一出料輸送帶53而輸出。 After the monitoring is completed, the bit exchange unit 42 removes the ground bit 9 fixed to the first bit holder 21a, so that the bit 9 is parallel to the upper plane 11a, and then deflects by an angle θ 3 to move to the drill bit. Near the flip unit 41 (or translate the bit flip unit 41), the bit 9 is removed and turned 90 degrees by the bit flip unit 41, so that the bit 9 is perpendicular to the upper plane 11a, so that the robot arm 52 will The ground drill 9 is taken to an discharge conveyor 53 for output.

再者,相對於該第一鑽頭座21a,安裝於該第二鑽頭座21b之另一鑽頭9’的作業則是錯開的,如第2圖所示。當該第一鑽頭座21a之鑽頭9正研磨時,該第二鑽頭座21b正在安裝另一待研磨之鑽頭9’。當該第一鑽頭座21a之鑽頭9研磨完成而自該第一鑽頭座21a卸載時,該第二鑽頭 座21b之鑽頭9’正在研磨。藉此可連續運用。 Further, with respect to the first bit holder 21a, the operation of the other drill bit 9' attached to the second bit holder 21b is shifted, as shown in Fig. 2. When the drill bit 9 of the first bit holder 21a is being ground, the second bit holder 21b is mounting another bit 9' to be ground. When the drill bit 9 of the first drill bit 21a is ground and unloaded from the first drill bit 21a, the second drill bit The drill bit 9' of the seat 21b is being ground. This can be used continuously.

值得注意的是,當該第一鑽頭座21a移動至研磨位置時,該鑽頭進退裝置2所擺動的方向係為逆時鐘方向,而當該第二鑽頭座21b移動至研磨位置時,鑽頭進退裝置2所擺動的方向係為順時鐘方向,如第1圖中之往復箭頭S所示。 It should be noted that when the first bit holder 21a is moved to the grinding position, the direction in which the bit advance and retract device 2 swings is in the counterclockwise direction, and when the second bit holder 21b is moved to the grinding position, the bit advance and retreat device The direction in which the two swings is in the clockwise direction is as indicated by the reciprocating arrow S in Fig. 1.

一併參照第4A至4D圖。如第4D圖所示,該鑽頭9的端面在研磨後共有四個研磨面,即以中心處O所劃分之一第一研磨面T1、一第二研磨面T2、一第三研磨面T3與一第四研磨面T4,且四個研磨面係對稱平均分佈;然而,目前市售的鑽頭亦有非對稱分佈的研磨面,本發明亦可生產出該非對稱分佈的研磨面。 Refer to Figures 4A through 4D together. As shown in FIG. 4D, the end surface of the drill bit 9 has four polishing surfaces after grinding, that is, one of the first polishing surface T1, the second polishing surface T2, and the third polishing surface T3 which are divided by the center O. A fourth abrasive surface T4, and the four abrasive surfaces are symmetrically distributed; however, currently commercially available drill bits also have an asymmetrically distributed abrasive surface, and the present invention can also produce the asymmetrically distributed abrasive surface.

如第4A圖所示,當該鑽頭9之端面於第一次研磨時經過該第一研磨面121a時,會研磨出由點A1至點A4所圍成之區域。 As shown in Fig. 4A, when the end face of the drill 9 passes through the first polishing surface 121a at the time of the first polishing, the region surrounded by the point A1 to the point A4 is polished.

如第4B圖所示,當該鑽頭9之端面於第一次研磨時經過該第二研磨面122a時,會研磨出由點B1至點B4所圍成之區域。 As shown in Fig. 4B, when the end face of the drill 9 passes through the second polishing surface 122a at the time of the first polishing, the region surrounded by the point B1 to the point B4 is ground.

如第4C圖所示,當該鑽頭9之端面於第二次研磨時經過該第一研磨面121a時,會研磨出由點C1至點C4所圍成之區域。 As shown in Fig. 4C, when the end face of the drill 9 passes through the first polishing surface 121a at the time of the second polishing, the region surrounded by the point C1 to the point C4 is polished.

如第4D圖所示,當該鑽頭9之端面於第二次研磨時經過該第二研磨面122a時,會研磨出由點D1至點D4所圍成之區域。 As shown in Fig. 4D, when the end surface of the drill 9 passes through the second polishing surface 122a at the time of the second polishing, the region surrounded by the point D1 to the point D4 is polished.

再者,因研磨時會有超出各研磨面的範圍,故研磨出的研磨面與預計範圍略有不同。 Further, since the polishing surface is out of the range of the respective polishing surfaces, the polished surface to be polished is slightly different from the expected range.

又,當形成各研磨面時,該鑽頭9整體或端面之中心線高度h1等於該假想連接線AB的高度H,如第3、4D圖,才不會發生第二研磨面T2與第四研磨面T4分離或重疊的狀況。 Further, when the respective polishing faces are formed, the center line height h1 of the entire or end face of the drill bit 9 is equal to the height H of the imaginary connecting line AB, as in the 3rd and 4Dth drawings, the second grinding surface T2 and the fourth grinding are not generated. The condition in which the face T4 is separated or overlapped.

本發明之研磨鑽頭方法之目的係在於避免該鑽頭9之中心線高度h1高於或低於該假想連接線AB的高度H,因而能防止該第二研磨面T2與第四研磨面T4分離或重疊的狀況。 The purpose of the grinding bit method of the present invention is to prevent the center line height h1 of the drill bit 9 from being higher or lower than the height H of the imaginary connecting line AB, thereby preventing the second grinding surface T2 from being separated from the fourth grinding surface T4 or Overlapping conditions.

如第5圖所示之研磨鑽頭方法之步驟圖。 A step diagram of the method of grinding a drill as shown in Fig. 5.

(1)將一裝設於該第一鑽頭座21a上之鑽頭9進行研磨,以定義出該假想連接線AB之高度H。具體流程如下: (1) A drill 9 mounted on the first bit holder 21a is ground to define a height H of the imaginary connecting line AB. The specific process is as follows:

(11)將該待研磨之鑽頭9裝設於該第一鑽頭座21a上,且將該鑽頭9送至該第一與第二砂輪121、122間作研磨,並完成研磨。 (11) The drill bit 9 to be ground is mounted on the first bit holder 21a, and the bit 9 is sent to the first and second grinding wheels 121, 122 for grinding, and the grinding is completed.

(12)利用該鑽頭9之四個研磨面定義出該假想連接線AB之高度H,即第4D圖所示之第四研磨面T4之兩點D1、D4連成之線段之高度。 (12) The height H of the virtual connecting line AB is defined by the four polishing faces of the drill bit 9, that is, the height of the line segment where the two points D1 and D4 of the fourth polishing surface T4 shown in Fig. 4D are connected.

(2)定位作業,使該鑽頭9之中心線之高度h1與該假想連接線AB之高度H相同,以定義出該第一與第二鑽頭座21a、21b、座體(如砂輪座12)或第一與第二砂輪121、122之標準高度。本實施例係以第一與第二砂輪121、122之標準高度為例,具體流程如下: (2) Positioning operation such that the height h1 of the center line of the drill bit 9 is the same as the height H of the imaginary connection line AB to define the first and second bit holders 21a, 21b and the seat body (such as the wheel holder 12). Or the standard height of the first and second grinding wheels 121, 122. In this embodiment, the standard heights of the first and second grinding wheels 121 and 122 are taken as an example, and the specific process is as follows:

(21)判斷該鑽頭9之中心線高度h1是否與該假想連接線AB之高度H相同,若不同,進入步驟(22),若相同,進入步驟(26)。 (21) It is judged whether or not the center line height h1 of the drill bit 9 is the same as the height H of the virtual connection line AB. If it is different, the process proceeds to step (22). If the same, the process proceeds to step (26).

(22)判斷該鑽頭9之中心線高度h1係高於或低於該假想連接線AB之高度H,若高於,則是重疊而需進入步驟(23),若低於,則則是分離而需進入步驟(24)。 (22) determining that the center line height h1 of the drill bit 9 is higher or lower than the height H of the imaginary connection line AB. If it is higher, it overlaps and needs to enter step (23). If it is lower, it is separated. And need to go to step (24).

(23)降低該中心線高度h1;或者利用該位移單元30升高該第一與第二砂輪121、122或其中一者,以升高該假想連接線之高度H,藉以使該鑽頭9之中心線高度h1等於該假想連接線之高度H,並進入步驟(25)。 (23) lowering the center line height h1; or raising the first and second grinding wheels 121, 122 or one of the displacement units 30 to raise the height H of the imaginary connecting line, thereby making the drill bit 9 The center line height h1 is equal to the height H of the imaginary connection line, and proceeds to step (25).

(24)升高該中心線高度h1;或者利用該位移單元30降低該第一與第二砂輪121、122或其中一者,以降低該假想連接線之高度H,藉以使該鑽頭9之中心線高度h1等於該假想連接線之高度H,並進入步驟(25)。 (24) raising the center line height h1; or using the displacement unit 30 to lower the first and second grinding wheels 121, 122 or one of them to lower the height H of the imaginary connecting line, thereby making the center of the drill bit 9 The line height h1 is equal to the height H of the imaginary connection line, and proceeds to step (25).

(25)將該鑽頭9送至該第一與第二砂輪121、122之間進行再研磨,並於完成研磨之後,進入步驟(21)。 (25) The drill 9 is sent to the first and second grinding wheels 121, 122 for re-polishing, and after completion of the grinding, the process proceeds to step (21).

(26)該鑽頭9之中心線高度h1等於該假想連接線AB之高度H,並記錄該第一與第二砂輪121、122此時之高度,得出該第一與第二砂輪121、122之標準高度。 (26) The center line height h1 of the drill bit 9 is equal to the height H of the imaginary connecting line AB, and the heights of the first and second grinding wheels 121, 122 are recorded at this time, and the first and second grinding wheels 121, 122 are obtained. The standard height.

(3)將待研磨之另一鑽頭9’裝設於該第二鑽頭座21b,利用該位移單元30調整該第一與第二砂輪121、122至該標準高度,並依該標準高度檢測得到該另一鑽頭9’之中心線高度h2(圖略)。 (3) The other drill bit 9' to be ground is mounted on the second drill bit 21b, and the first and second grinding wheels 121, 122 are adjusted to the standard height by the displacement unit 30, and detected according to the standard height. The height of the center line of the other drill bit 9' is h2 (not shown).

(4)校正作業,使該另一鑽頭9’之中心線高度h2與該 假想連接線AB之高度H相同。具體流程如下: (4) correcting the operation so that the center line height h2 of the other drill bit 9' is The height H of the imaginary connecting line AB is the same. The specific process is as follows:

(41)判斷該另一鑽頭9’之中心線高度h2是否與該假想連接線AB之高度H相同,若不相同,進入步驟(42),若相同,進入步驟(5)。 (41) It is judged whether or not the center line height h2 of the other drill bit 9' is the same as the height H of the virtual connection line AB. If not, the process proceeds to step (42), and if it is the same, the process proceeds to step (5).

(42)判斷該另一鑽頭9’之中心線高度h2係高於或低於該假想連接線AB之高度H,若高於,則進入步驟(43),若低於,則進入步驟(44)。 (42) determining that the center line height h2 of the other drill bit 9' is higher or lower than the height H of the imaginary connection line AB. If it is higher, the process proceeds to step (43). If it is lower, the process proceeds to step (44). ).

(43)降低該中心線高度h1;或者利用該位移單元30調高該第一與第二砂輪121、122或其中一者,以調高該假想連接線AB之高度H至與該另一鑽頭9’之中心線高度h2相同,並進入步驟(5)。 (43) lowering the center line height h1; or using the displacement unit 30 to raise the first and second grinding wheels 121, 122 or one of them to increase the height H of the imaginary connecting line AB to the other bit The centerline height h2 of 9' is the same and proceeds to step (5).

(44)升高該中心線高度h1;或者利用該位移單元30降低該第一與第二砂輪121、122或其中一者,以降低該假想連接線AB之高度H至與該另一鑽頭9’之中心線高度h2相同,並進入步驟(5)。 (44) raising the centerline height h1; or lowering the first and second grinding wheels 121, 122 or one by the displacement unit 30 to lower the height H of the imaginary connecting line AB to the other drill bit 9 'The center line height h2 is the same and go to step (5).

(5)將該另一鑽頭9’送至該第一與第二砂輪121、122間作研磨,並完成研磨;之後,退出該另一鑽頭9’。 (5) The other drill bit 9' is sent to the first and second grinding wheels 121, 122 for grinding, and the grinding is completed; after that, the other drill bit 9' is withdrawn.

(6)判斷是否有其它鑽頭需研磨,若有,則進行步驟(3)至(5)。 (6) Determine if there are other drill bits to be ground, and if so, perform steps (3) to (5).

綜上所述,本發明係藉由調整該假想連接線之高度,例如調整該第一與第二砂輪之高度,以令假想連接線之高度等於該待研磨鑽頭之中心線高度,故能判斷鑽頭研磨面是否發生分離或重疊狀況,且能校正鑽頭中心線高度。藉此,本發明可確實解決習知技術中所產生的『分離』與『重 疊』的狀況,且能達到先定義砂輪中心線之標準高度,再對每一待研磨的鑽頭之中心線高度進行校正。 In summary, the present invention can determine the height of the imaginary connecting line, for example, adjusting the heights of the first and second grinding wheels so that the height of the imaginary connecting line is equal to the height of the center line of the bit to be ground. Whether the grinding surface of the drill bit is separated or overlapped, and the center line height of the drill bit can be corrected. Therefore, the present invention can surely solve the "separation" and "heavy" generated in the prior art. The condition of the stack can be determined by first defining the standard height of the center line of the grinding wheel, and then correcting the height of the center line of each bit to be ground.

於是,本發明專利申請案係利用發明人豐富的經驗,以極富創意的構思,設計出簡單卻能充分解決習知技術的問題。因此,本發明專利申請案的功能,確實符合具有新穎性與進步性的專利要件。 Thus, the patent application of the present invention utilizes the inventor's rich experience to design a simple but fully problematic solution to the conventional technology with a very creative concept. Therefore, the function of the patent application of the present invention does meet the patent requirements of novelty and progress.

唯以上所述者,僅為本發明之較佳實施例,當不能以之限制本發明範圍。即大凡依本發明申請專利範圍所做之均等變化及修飾,仍將不失本發明之要義所在,亦不脫離本發明之精神和範圍,故都應視為本發明的進一步實施狀況。 The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto. It is to be understood that the scope of the present invention is not limited by the spirit and scope of the present invention, and should be considered as a further embodiment of the present invention.

1‧‧‧砂輪承載裝置 1‧‧‧Wheel carrier

11‧‧‧底座 11‧‧‧Base

11a‧‧‧上平面 11a‧‧‧Upper plane

12、12’‧‧‧砂輪座 12, 12'‧‧‧ wheel seat

120a、120b‧‧‧砂輪 120a, 120b‧‧‧ grinding wheel

121‧‧‧第一砂輪 121‧‧‧First grinding wheel

121a‧‧‧第一研磨面 121a‧‧‧First ground surface

122‧‧‧第二砂輪 122‧‧‧Second grinding wheel

122a‧‧‧第二研磨面 122a‧‧‧Second ground surface

13‧‧‧第一驅動裝置 13‧‧‧First drive

14‧‧‧第二驅動裝置 14‧‧‧Second drive

15‧‧‧驅動軸 15‧‧‧Drive shaft

2‧‧‧鑽頭進退裝置 2‧‧‧Drill advance and retreat device

20‧‧‧旋轉機構 20‧‧‧Rotating mechanism

21‧‧‧鑽頭座 21‧‧‧ bit holder

21a‧‧‧第一鑽頭座 21a‧‧‧First bit holder

21b‧‧‧第二鑽頭座 21b‧‧‧Second bit holder

210‧‧‧支架 210‧‧‧ bracket

22‧‧‧迴轉軸裝置 22‧‧‧Rotary shaft device

23‧‧‧Z軸大行程位移裝置 23‧‧‧Z-axis large stroke displacement device

24‧‧‧Z軸微調位移裝置 24‧‧‧Z-axis fine-tuning displacement device

25‧‧‧X軸向位移裝置 25‧‧‧X axial displacement device

26‧‧‧旋轉軸 26‧‧‧Rotary axis

3‧‧‧調校裝置 3‧‧‧ Calibration device

30‧‧‧位移單元 30‧‧‧displacement unit

31‧‧‧第一影像擷取調校單元 31‧‧‧First image capture tuning unit

311‧‧‧第一攝像器 311‧‧‧First camera

312‧‧‧第一電荷耦合器 312‧‧‧First charge coupler

32‧‧‧第二影像擷取調校單元 32‧‧‧Second image capture adjustment unit

321‧‧‧第二攝像器 321‧‧‧Second camera

3211‧‧‧環狀光源結構 3211‧‧‧Circular light source structure

322‧‧‧第二電荷耦合器 322‧‧‧Second charge coupler

4‧‧‧進退料裝置 4‧‧‧Incoming and unloading device

41‧‧‧鑽頭翻轉單元 41‧‧‧Drilling unit

42‧‧‧鑽頭交換單元 42‧‧‧Drill Exchange Unit

5‧‧‧輸送裝置 5‧‧‧Conveyor

51‧‧‧入料輸送帶 51‧‧‧Feed conveyor belt

52‧‧‧機械手臂 52‧‧‧ Robotic arm

53‧‧‧出料輸送帶 53‧‧‧Feed conveyor belt

9、9’、9a‧‧‧鑽頭 9, 9', 9a‧‧‧ drill bit

90‧‧‧研磨部 90‧‧‧ Grinding Department

90a‧‧‧端面 90a‧‧‧ end face

A‧‧‧第一圓心 A‧‧‧First Center

B‧‧‧第二圓心 B‧‧‧Second center

AB、L‧‧‧假想連接線 AB, L‧‧‧ imaginary cable

A6A7‧‧‧線段 A6A7‧‧ ‧ line segment

d、d’‧‧‧距離 d, d’‧‧‧ distance

A1、A2、A3、A4、A6、A7‧‧‧點 A1, A2, A3, A4, A6, A7‧‧

B1、B2、B3、B4‧‧‧點 B1, B2, B3, B4‧‧ points

C1、C2、C3、C4‧‧‧點 C1, C2, C3, C4‧‧ points

D1、D2、D3、D4‧‧‧點 D1, D2, D3, D4‧‧ points

H、h、h1‧‧‧高度 H, h, h1‧‧‧ height

M‧‧‧中間位置 M‧‧‧ intermediate position

O‧‧‧中心處 O‧‧‧ Center

T1‧‧‧第一研磨面 T1‧‧‧ first ground surface

T2‧‧‧第二研磨面 T2‧‧‧Second ground surface

T3‧‧‧第三研磨面 T3‧‧‧ third polished surface

T4‧‧‧第四研磨面 T4‧‧‧4th grinding surface

α‧‧‧第一角度 Α‧‧‧first angle

β‧‧‧第二角度 Β‧‧‧second angle

Y‧‧‧假想長軸 Y‧‧‧ imaginary long axis

r、r’‧‧‧高度值 r, r’‧‧‧ height value

θ 1、θ 2、θ 3角度 θ 1, θ 2, θ 3 angle

(1)~(8)‧‧‧係步驟編號 (1)~(8)‧‧‧ is the step number

第1A、1B圖係本發明之研磨鑽頭系統之不同實施例之立體與局部側視示意圖;第2圖係第1A圖之局部上視示意圖;第3圖係第1A圖之局部側視示意圖;第4A圖至第4D圖係本發明之研磨鑽頭系統之所形成之鑽頭端面之步驟圖;第5圖係本發明之研磨鑽頭方法之步驟流程圖;第6圖係習知鑽頭之中心線高度於理想狀態下等於假想連接線之高度之相對位置關係示意圖;第7圖係習知鑽頭研磨後之端面之中心線高度高於假想連接線之高度之相對位置關係示意圖; 第8圖係習知鑽頭研磨後之端面之中心線高度低於假想連接線之高度之相對位置關係示意圖;第9圖係習知技術中,於調整左砂輪後之假想連接線之位移差示意圖;以及第10圖係習知技術中,於調整右砂輪後之假想連接線之位移差示意圖。 1A and 1B are schematic perspective views of a different embodiment of a grinding bit system of the present invention; FIG. 2 is a partial top plan view of FIG. 1A; and FIG. 3 is a partial side elevational view of FIG. 1A; 4A to 4D are diagrams showing the steps of the end face of the drill bit formed by the grinding bit system of the present invention; Fig. 5 is a flow chart showing the steps of the method for grinding the drill bit of the present invention; and Fig. 6 is the center line height of the conventional drill bit A schematic diagram of the relative positional relationship of the height of the imaginary connecting line in an ideal state; FIG. 7 is a schematic diagram showing the relative positional relationship between the height of the center line of the end face after grinding of the drill bit and the height of the imaginary connecting line; Figure 8 is a schematic diagram showing the relative positional relationship between the height of the center line of the end face after the grinding of the drill bit is lower than the height of the imaginary connecting line; Fig. 9 is a schematic view showing the displacement difference of the imaginary connecting line after adjusting the left grinding wheel in the prior art. And Figure 10 is a schematic diagram of the displacement difference of the imaginary connecting line after adjusting the right grinding wheel in the prior art.

(1)~(8)‧‧‧係步驟編號 (1)~(8)‧‧‧ is the step number

Claims (10)

一種研磨鑽頭方法,係包括:(一)將一裝設於鑽頭座上之鑽頭進行研磨,以定義出設於一座體上之兩砂輪之圓心間之一假想連接線之一高度;(二)定位作業,使該鑽頭之中心線之高度與該假想連接線之高度相同,以定義出該鑽頭座、座體或砂輪之標準高度;(三)將待研磨之另一鑽頭裝設於該鑽頭座,並依該標準高度檢測出該另一鑽頭之中心線高度;(四)校正作業,使該另一鑽頭之中心線高度與該假想連接線之高度相同;(五)研磨該另一鑽頭;以及(六)判斷是否有其它鑽頭需研磨,若有,則進行步驟(三)至(五)。 A method for grinding a drill bit, comprising: (1) grinding a drill bit mounted on a drill bit seat to define a height of one of the imaginary connecting lines between the centers of the two grinding wheels disposed on the body; Positioning operation such that the height of the center line of the drill bit is the same as the height of the imaginary connecting line to define a standard height of the bit holder, the seat body or the grinding wheel; and (3) mounting another drill bit to be ground to the drill bit Seat, and the height of the center line of the other bit is detected according to the standard height; (4) correcting operation so that the center line height of the other bit is the same as the height of the imaginary connecting line; (5) grinding the other bit And (6) to determine whether there are other drill bits to be ground, if any, proceed to steps (3) to (5). 如申請專利範圍第1項所述之研磨鑽頭的方法,其中,步驟(一)之流程係包括:(1)將該待研磨之鑽頭裝設於一鑽頭座,並將該鑽頭送至該兩砂輪之間作研磨,並完成研磨;及(2)利用該鑽頭之四個研磨面定義出該假想連接線之高度。 The method of grinding a drill bit according to claim 1, wherein the step (1) includes: (1) mounting the drill to be ground to a drill bit, and sending the drill to the two Grinding between the grinding wheels and completing the grinding; and (2) defining the height of the imaginary connecting line by using the four grinding faces of the drill bit. 如申請專利範圍第1項所述之研磨鑽頭的方法,其中,步驟(二)之流程係包括:(1)判斷該鑽頭之中心線高度是否與該假想連接線 之高度相同,若不同,進入步驟(2),若相同,進入步驟(6);(2)判斷該鑽頭之中心線高度係高於或低於該假想連接線之高度,若高於,則進入步驟(3),若低於,則進入步驟(4);(3)調高該假想連接線之高度,並進入步驟(5);(4)降低該假想連接線之高度,並進入步驟(5);(5)將該鑽頭送至該兩砂輪之間進行再研磨,並於完成研磨之後,進入步驟(1);以及(6)定義出該標準高度。 The method for grinding a drill bit according to claim 1, wherein the step (2) includes: (1) determining whether the center line height of the drill bit is connected to the imaginary connection line The height is the same. If it is different, go to step (2). If it is the same, go to step (6); (2) judge that the center line height of the bit is higher or lower than the height of the imaginary connecting line. If it is higher, then Go to step (3), if it is lower, go to step (4); (3) increase the height of the imaginary connection line, and go to step (5); (4) lower the height of the imaginary connection line, and enter the step (5); (5) sending the drill bit between the two grinding wheels for regrind, and after completing the grinding, proceeding to step (1); and (6) defining the standard height. 如申請專利範圍第1項所述之研磨鑽頭的方法,其中,步驟(三)係調整至少一該砂輪至該標準高度,且檢測該待研磨之另一鑽頭之中心線之高度。 The method of grinding a drill bit according to claim 1, wherein the step (3) adjusts at least one of the grinding wheels to the standard height, and detects a height of a center line of the other drill bit to be ground. 如申請專利範圍第1項所述之研磨鑽頭的方法,其中,步驟(四)之流程係包括:(1)判斷該另一鑽頭之中心線之高度是否與該假想連接線之高度相同,若不相同,進入步驟(2),若相同,進入步驟(五);(2)判斷該另一鑽頭之中心線高度係高於或低於該假想連接線之高度,若高於,則進入步驟(3),若低於,則進入步驟(4);(3)調高該假想連接線之高度至與該另一鑽頭之中心線高度相同,並進入步驟(五);及(4)降低該假想連接線之高度至與該另一鑽頭之中 心線高度相同,並進入步驟(五)。 The method of grinding a drill bit according to claim 1, wherein the step (4) includes: (1) determining whether the height of the center line of the other drill bit is the same as the height of the imaginary connecting line; If not, proceed to step (2). If they are the same, go to step (5); (2) determine that the height of the center line of the other bit is higher or lower than the height of the imaginary connection line. If it is higher, proceed to the step. (3) If it is lower, proceed to step (4); (3) increase the height of the imaginary connecting line to the same height as the center line of the other bit, and proceed to step (5); and (4) lower The height of the imaginary connection line is among the other drill bits The height of the heart line is the same and proceeds to step (5). 一種研磨鑽頭系統,係包括:一砂輪承載裝置,係包含一座體、設於該座體上之一第一砂輪及一第二砂輪,該第一砂輪具有一第一研磨面及與該第一研磨面位於同側之一第一圓心,且該第二砂輪具有一第二研磨面及與該第二研磨面位於同側之一第二圓心,而該第一圓心與第二圓心之間係假想相連而定義為一假想連接線,又該砂輪承載裝置係沿該假想連接線之方向作往復式移動;一鑽頭進退裝置,係以旋轉方式位移鑽頭,該鑽頭進退裝置包含至少二用以固定鑽頭之鑽頭座,當其中一鑽頭座移至該第一與第二砂輪進行研磨時,其它鑽頭座將位於一預備處;以及一調校裝置,係用以對固定於該些鑽頭座上之已研磨或待研磨之鑽頭進行監測與調整;及當研磨一鑽頭時,利用該調校裝置進行校正,使該鑽頭之中心線高度與該假想連接線之高度相同,以定義出一標準高度,俾供後續研磨其它鑽頭時,該研磨鑽頭系統以該標準高度進行對位。 A grinding bit system includes: a grinding wheel carrying device comprising a body, a first grinding wheel and a second grinding wheel disposed on the seat body, the first grinding wheel having a first grinding surface and the first The grinding surface is located at a first center of the same side, and the second grinding wheel has a second grinding surface and a second center on the same side as the second grinding surface, and the first center and the second center are The imaginary connection is defined as an imaginary connecting line, and the grinding wheel carrying device moves reciprocally along the direction of the imaginary connecting line; a drill advance and retreat device rotates the drill bit in a rotating manner, and the drill advance and retreat device comprises at least two for fixing a drill bit holder, when one of the bit holders is moved to the first and second grinding wheels for grinding, the other bit holders are located at a preparation point; and a adjusting device is fixed to the bit holders The drill bit that has been ground or to be ground is monitored and adjusted; and when grinding a drill bit, the calibration device is used for correction so that the height of the center line of the drill bit is the same as the height of the imaginary connection line to define Standard height, while other serve for subsequent milling drill, the milling bit system the height of a standard bit. 如申請專利範圍第6項所述之研磨鑽頭系統,其中,該座體具有設置該第一及第二砂輪之一平面,且該第一及第二研磨面與該平面呈傾斜。 The grinding bit system of claim 6, wherein the seat body has a plane in which the first and second grinding wheels are disposed, and the first and second grinding surfaces are inclined with respect to the plane. 如申請專利範圍第6項所述之研磨鑽頭系統,其中,該調校裝置包含位移單元,以調整該第一或第二砂輪。 The grinding bit system of claim 6, wherein the adjusting device comprises a displacement unit to adjust the first or second grinding wheel. 如申請專利範圍第6項所述之研磨鑽頭系統,其中,該調校裝置包含第一影像擷取調校單元與第二影像擷取調校單元,該第一影像擷取調校單元係用以從垂直該座體的方向監測該些鑽頭座上之鑽頭,且該第二影像擷取調校單元係用以從平行該座體的方向監測該些鑽頭座上之鑽頭。 The grinding bit system of claim 6, wherein the adjusting device comprises a first image capturing and adjusting unit and a second image capturing and adjusting unit, wherein the first image capturing and adjusting unit is used The drill bits on the drill bits are monitored from a direction perpendicular to the base, and the second image capture adjustment unit is configured to monitor the drill bits on the drill bits from a direction parallel to the base. 如申請專利範圍第6項所述之研磨鑽頭系統,復包括進退料裝置,係用以於一鑽頭取放處取放該鑽頭座上之鑽頭。 The grinding bit system of claim 6, wherein the grinding and unloading device comprises a feeding and unloading device for picking up and placing the bit on the bit holder at a bit pick and place.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014101484A1 (en) * 2012-12-25 2014-07-03 Chiu Po Horng Drill grinding method and drill grinding system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014101484A1 (en) * 2012-12-25 2014-07-03 Chiu Po Horng Drill grinding method and drill grinding system

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