TW201614376A - Positive type photosensitive resin composition and cured film - Google Patents

Positive type photosensitive resin composition and cured film

Info

Publication number
TW201614376A
TW201614376A TW104120178A TW104120178A TW201614376A TW 201614376 A TW201614376 A TW 201614376A TW 104120178 A TW104120178 A TW 104120178A TW 104120178 A TW104120178 A TW 104120178A TW 201614376 A TW201614376 A TW 201614376A
Authority
TW
Taiwan
Prior art keywords
cured film
photosensitive resin
resin composition
positive type
type photosensitive
Prior art date
Application number
TW104120178A
Other languages
Chinese (zh)
Other versions
TWI667542B (en
Inventor
Yoshinori Tadokoro
Shigeru Suzuki
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW201614376A publication Critical patent/TW201614376A/en
Application granted granted Critical
Publication of TWI667542B publication Critical patent/TWI667542B/en

Links

Landscapes

  • Epoxy Resins (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Optical Filters (AREA)
  • Electroluminescent Light Sources (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

This invention provides a positive type photosensitive resin composition and a cured film capable of forming a cured film with partitioning liquid repellency and substrate lipophilicity and having excellent sealing property with the substrate. This invention relates to a composition comprising novolak resin (A), photo-sensitizing agent (B), fluororesin (C) having at least one chosen from a group which consists of a an epoxy group and an oxetanyl group, and a cross-linking agent (D).
TW104120178A 2014-08-12 2015-06-23 Positive photosensitive resin composition and cured film TWI667542B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014164493A JP2016040577A (en) 2014-08-12 2014-08-12 Positive photosensitive resin composition and cured film
JP2014-164493 2014-08-12

Publications (2)

Publication Number Publication Date
TW201614376A true TW201614376A (en) 2016-04-16
TWI667542B TWI667542B (en) 2019-08-01

Family

ID=55540927

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104120178A TWI667542B (en) 2014-08-12 2015-06-23 Positive photosensitive resin composition and cured film

Country Status (2)

Country Link
JP (1) JP2016040577A (en)
TW (1) TWI667542B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107870516A (en) * 2016-09-22 2018-04-03 奇美实业股份有限公司 Positive photosensitive resin composition, patterned film and method for producing bumps

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6968535B2 (en) * 2016-12-28 2021-11-17 東京応化工業株式会社 Compositions, cured products, pattern forming methods, compounds, polymers, and methods for producing compounds.
JP7289204B2 (en) * 2019-03-06 2023-06-09 第一工業製薬株式会社 Composition containing fluorine-containing copolymer
KR102863895B1 (en) 2019-11-14 2025-09-23 메르크 파텐트 게엠베하 DNQ-type photoresist composition comprising alkali-soluble acrylic resin
JP7509080B2 (en) * 2020-04-30 2024-07-02 Jsr株式会社 Radiation-sensitive composition, method for producing cured film, semiconductor device, and display device
CN114326300B (en) * 2020-09-30 2026-01-27 上海飞凯材料科技股份有限公司 Positive photoresist composition, preparation method and photoresist pattern forming method
KR102904849B1 (en) * 2020-12-31 2025-12-26 주식회사 동진쎄미켐 Negative photosensitive resin composition capable of low temperature curing and low refractive index
TW202242550A (en) * 2021-02-03 2022-11-01 日商日產化學股份有限公司 Positive-acting photosensitive resin composition
CN115960303B (en) * 2022-12-30 2024-09-13 阜阳欣奕华新材料科技股份有限公司 Resin having heat-crosslinking structure, method for producing the same, photosensitive resin composition, microlens, method for producing the same, and optical device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0743899A (en) * 1993-07-28 1995-02-14 Japan Synthetic Rubber Co Ltd Radiation-sensitive resin composition
JP2001242616A (en) * 2000-02-29 2001-09-07 Fujifilm Arch Co Ltd Positive type photosensitive resin composition
JP5173543B2 (en) * 2008-04-08 2013-04-03 東京応化工業株式会社 Positive photosensitive resin composition
JP5466375B2 (en) * 2008-04-08 2014-04-09 東京応化工業株式会社 Manufacturing method of resin pattern
JP2010008851A (en) * 2008-06-30 2010-01-14 Toray Ind Inc Positive photosensitive resin composition
KR20110129692A (en) * 2010-05-26 2011-12-02 삼성전자주식회사 Photoresist composition and method of forming photoresist pattern using the same
JP2012220855A (en) * 2011-04-13 2012-11-12 Nagase Chemtex Corp Radiation-sensitive resin composition
JP5516484B2 (en) * 2011-04-13 2014-06-11 ダイキン工業株式会社 Positive-type liquid repellent resist composition
US10175577B2 (en) * 2012-02-07 2019-01-08 Hitachi Chemical Company, Ltd. Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component
KR101998447B1 (en) * 2012-03-09 2019-07-09 에이지씨 가부시키가이샤 Positive photosensitive resin composition, partition wall and optical element
JP5981739B2 (en) * 2012-03-14 2016-08-31 旭化成株式会社 Photosensitive resin composition and method for producing cured relief pattern
JP5999938B2 (en) * 2012-03-14 2016-09-28 旭化成株式会社 Photosensitive resin composition and method for producing cured relief pattern
JP2016018691A (en) * 2014-07-09 2016-02-01 Jsr株式会社 Display or lighting device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107870516A (en) * 2016-09-22 2018-04-03 奇美实业股份有限公司 Positive photosensitive resin composition, patterned film and method for producing bumps
CN107870516B (en) * 2016-09-22 2022-08-02 奇美实业股份有限公司 Positive photosensitive resin composition, patterned film and method for manufacturing bump

Also Published As

Publication number Publication date
JP2016040577A (en) 2016-03-24
TWI667542B (en) 2019-08-01

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