TW201614376A - Positive type photosensitive resin composition and cured film - Google Patents

Positive type photosensitive resin composition and cured film

Info

Publication number: TW201614376A
Authority: TW; Taiwan
Prior art keywords: cured film; photosensitive resin; resin composition; positive type; type photosensitive
Prior art date: 2014-08-12

Application number

TW104120178A

Other languages

English (en)

Other versions

TWI667542B (zh

Inventor

Yoshinori Tadokoro

Shigeru Suzuki

Original Assignee

Tokyo Ohka Kogyo Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2014-08-12

Filing date

2015-06-23

Publication date

2016-04-16

2015-06-23 Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd

2016-04-16 Publication of TW201614376A publication Critical patent/TW201614376A/zh

2019-08-01 Application granted granted Critical

2019-08-01 Publication of TWI667542B publication Critical patent/TWI667542B/zh

Links

239000011342 resin composition Substances 0.000 title abstract 2
239000000758 substrate Substances 0.000 abstract 2
239000003431 cross linking reagent Substances 0.000 abstract 1
125000003700 epoxy group Chemical group 0.000 abstract 1
239000007788 liquid Substances 0.000 abstract 1
239000000203 mixture Substances 0.000 abstract 1
229920003986 novolac Polymers 0.000 abstract 1
125000003566 oxetanyl group Chemical group 0.000 abstract 1
239000003504 photosensitizing agent Substances 0.000 abstract 1
229920005989 resin Polymers 0.000 abstract 1
239000011347 resin Substances 0.000 abstract 1
238000007789 sealing Methods 0.000 abstract 1
238000000638 solvent extraction Methods 0.000 abstract 1

Landscapes

Epoxy Resins (AREA)
Materials For Photolithography (AREA)
Compositions Of Macromolecular Compounds (AREA)
Optical Filters (AREA)
Electroluminescent Light Sources (AREA)
Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

TW104120178A 2014-08-12 2015-06-23 Positive photosensitive resin composition and cured film TWI667542B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2014164493A JP2016040577A (ja)	2014-08-12	2014-08-12	ポジ型感光性樹脂組成物及び硬化膜
JP2014-164493		2014-08-12

Publications (2)

Publication Number	Publication Date
TW201614376A true TW201614376A (en)	2016-04-16
TWI667542B TWI667542B (zh)	2019-08-01

Family

ID=55540927

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW104120178A TWI667542B (zh)	2014-08-12	2015-06-23	Positive photosensitive resin composition and cured film

Country Status (2)

Country	Link
JP (1)	JP2016040577A (zh)
TW (1)	TWI667542B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN107870516A (zh) *	2016-09-22	2018-04-03	奇美实业股份有限公司	正型感光性树脂组成物、图案化膜及凸块的制造方法

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JP6968535B2 (ja) *	2016-12-28	2021-11-17	東京応化工業株式会社	組成物、硬化物、パターン形成方法、化合物、重合体、及び化合物の製造方法
JP7289204B2 (ja) *	2019-03-06	2023-06-09	第一工業製薬株式会社	含フッ素共重合体含有組成物
KR102863895B1 (ko)	2019-11-14	2025-09-23	메르크 파텐트 게엠베하	알칼리-가용성 아크릴 수지를 포함하는 dnq-타입 포토레지스트 조성물
JP7509080B2 (ja) *	2020-04-30	2024-07-02	Jsr株式会社	感放射線性組成物、硬化膜の製造方法、半導体素子及び表示素子
CN114326300B (zh) *	2020-09-30	2026-01-27	上海飞凯材料科技股份有限公司	一种正型光刻胶组合物及制备方法和光刻胶图形形成方法
KR102904849B1 (ko) *	2020-12-31	2025-12-26	주식회사 동진쎄미켐	저온 경화가 가능하며 굴절률이 낮은 네가티브 감광성 수지 조성물
TW202242550A (zh) *	2021-02-03	2022-11-01	日商日產化學股份有限公司	正型感光性樹脂組成物
CN115960303B (zh) *	2022-12-30	2024-09-13	阜阳欣奕华新材料科技股份有限公司	具有热交联结构的树脂及其制备方法、光敏性树脂组合物、微透镜及其制备方法和光学设备

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JPH0743899A (ja) *	1993-07-28	1995-02-14	Japan Synthetic Rubber Co Ltd	感放射線性樹脂組成物
JP2001242616A (ja) *	2000-02-29	2001-09-07	Fujifilm Arch Co Ltd	ポジ型感光性樹脂組成物
JP5173543B2 (ja) *	2008-04-08	2013-04-03	東京応化工業株式会社	ポジ型感光性樹脂組成物
JP5466375B2 (ja) *	2008-04-08	2014-04-09	東京応化工業株式会社	樹脂パターンの製造方法
JP2010008851A (ja) *	2008-06-30	2010-01-14	Toray Ind Inc	ポジ型感光性樹脂組成物
KR20110129692A (ko) *	2010-05-26	2011-12-02	삼성전자주식회사	포토레지스트 조성물 및 이를 이용한 포토레지스트 패턴의 형성 방법
JP2012220855A (ja) *	2011-04-13	2012-11-12	Nagase Chemtex Corp	感放射線性樹脂組成物
JP5516484B2 (ja) *	2011-04-13	2014-06-11	ダイキン工業株式会社	ポジ型撥液レジスト組成物
US10175577B2 (en) *	2012-02-07	2019-01-08	Hitachi Chemical Company, Ltd.	Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component
KR101998447B1 (ko) *	2012-03-09	2019-07-09	에이지씨 가부시키가이샤	포지티브형 감광성 수지 조성물, 격벽 및 광학 소자
JP5981739B2 (ja) *	2012-03-14	2016-08-31	旭化成株式会社	感光性樹脂組成物、及び硬化レリーフパターンの製造方法
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2014
- 2014-08-12 JP JP2014164493A patent/JP2016040577A/ja active Pending
2015
- 2015-06-23 TW TW104120178A patent/TWI667542B/zh active

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN107870516A (zh) *	2016-09-22	2018-04-03	奇美实业股份有限公司	正型感光性树脂组成物、图案化膜及凸块的制造方法
CN107870516B (zh) *	2016-09-22	2022-08-02	奇美实业股份有限公司	正型感光性树脂组成物、图案化膜及凸块的制造方法

Also Published As

Publication number	Publication date
JP2016040577A (ja)	2016-03-24
TWI667542B (zh)	2019-08-01

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