TW201718376A - Chip transfer device and pickup machine - Google Patents

Abstract

The present invention suppresses the occurrence of wind pressure when picking up or releasing a chip. This chip transfer device 1, which transfers a chip 2 conveyed by a first conveyor 10 to a second conveyor 24, is equipped with: a travel guide 110 which is formed in a closed path shape as viewed from above, and is disposed in the vicinity of the first conveyor 10 and the second conveyor 24; a mobile unit 40 which travels along the travel guide 110; a clamping mechanism 50 which is provided on the mobile unit 40 so as to be openable and closable in the transverse direction; and an opening/closing operation cam 120 which is provided along the travel guide 110 so as to open and close the clamping mechanism 50. When the mobile unit 40 travels on the first conveyor 10 side of the travel guide 110, the opening/closing operation cam 120 closes the clamping mechanism 50, and the clamping mechanism 50 grips the chip 2 conveyed by the first conveyor 10.

Description

Wafer transfer device and wafer picker

The present invention relates to a wafer transfer device for transferring a wafer transported by a first transporter to a second transporter, and to a pick-up device provided in the wafer transfer device.

Patent Document 1 discloses an electronic component mounting machine in which an electronic component is mounted on a circuit board. The electronic component mounting machine includes: an adsorption nozzle that picks up the electronic component, and a mobile device that moves the adsorption nozzle along a horizontal plane. When the adsorption nozzle is moved on the carrier by the moving means, a negative pressure is generated at the adsorption nozzle by the positive and negative pressure supply means, so that the electronic components on the carrier are adsorbed by the adsorption nozzle. On the other hand, when the adsorption nozzle moves on the circuit board by the moving device, a positive pressure is generated in the adsorption nozzle by the positive and negative pressure supply means, and the electronic component is detached from the adsorption nozzle, so that the electronic component is mounted on the circuit substrate. .

On the other hand, Patent Document 2 discloses a powder compression molding apparatus that produces a tablet by compressing the powder in the crucible using the upper and lower jaws.

[Practical Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Application Publication No. 2013-149639 (JP 2013-149639 A)

[Patent Document 2] Japanese Patent Laid-Open Publication No. 5448501 (JP 5448501 B)

However, it is required to embed a small piece (wafer) such as an electronic component into a tablet. In this case, the electronic component mounting machine of Patent Document 1 is applied to the powder compression molding apparatus of Patent Document 2, and the electronic component on the carrier tape is supplied to the electronic component mounting machine (however, this is not a known technique). ). However, since the powder compression molding apparatus processes the powder, the powder is attracted to the adsorption nozzle by the negative pressure of the adsorption nozzle, and the powder in the crucible is scattered by the positive pressure of the adsorption nozzle.

Here, the present invention is in view of the above circumstances. The problem to be solved by the present invention is to prevent wafers such as electronic components from being picked up without using an adsorption nozzle, and to suppress the occurrence of wind pressure during picking up and liberation of the wafer.

In order to solve the above problems, the wafer transfer device of the present invention The wafer transfer device that transfers the wafer transported by the first transporter to the second transporter has a shape that forms a closed path as seen from above, and has a transport path with the first transporter. a first parallel walking section, a guide having a second parallel section parallel to the transport path of the second transporter; and a moving body moving along the guide; and a moving body disposed in the lateral direction a cooker mechanism that is openably and closably provided; and an opening and closing operation cam that opens and closes the cookware mechanism along the guide; the moving body is in the first guide on the first conveyor side of the guide In the interval movement, the opening and closing operation cam closes the cookware mechanism, and the cookware mechanism holds the wafer conveyed by the first conveyor.

In order to solve the above problems, the pick-up machine that picks up the wafer along the closed path includes a moving body that moves along the closed path, and a moving body that is provided in the horizontal direction so as to be openable and closable. A cookware mechanism that holds the aforementioned wafer by closing.

Other features of the present invention will be apparent from the description and drawings described below.

According to the present invention, the cookware mechanism can be used instead of the suction nozzle, and the wafer of the electronic component or the like can be picked up by the cookware mechanism or the wafer can be released from the cookware mechanism by the opening and closing of the cookware mechanism. Since the cookware mechanism is a switcher, it is possible to suppress the occurrence of wind pressure during the operation of the cookware mechanism.

1‧‧‧ wafer transfer device

2‧‧‧ wafer

3‧‧‧ picker column

10‧‧‧First carrier

11‧‧‧Land

12‧‧‧Support

13‧‧‧Motor

20‧‧‧Processing machine

21‧‧‧臼

22‧‧‧臼孔

23‧‧‧臼 Feeding device

24‧‧‧Second carrier

30‧‧‧ Pickup Machine

31‧‧‧Slip ring

40‧‧‧Mobile

41‧‧‧Loader

42‧‧‧Roller

43‧‧‧Roller

44‧‧‧ pillar

45‧‧‧Bars

50‧‧‧ institutions

51‧‧‧Fixed fixture

52‧‧‧Fixed base

53‧‧‧Fixed jaw claws

53a‧‧‧ upper

53b‧‧‧Central

53c‧‧‧ lower

55‧‧‧ movable clamp

56‧‧‧ movable base

56a‧‧‧Rotary axis

56b‧‧‧left end

57‧‧‧arm

58‧‧‧ movable jaws

60‧‧‧挟持持机构

61‧‧‧Action lever

61a‧‧‧Rotary axis

62‧‧‧Support shaft

62a‧‧‧ head

63‧‧‧ Pushing spring (compression)

70‧‧‧Opening and closing lever

70a‧‧‧Rotary axis

71‧‧‧Crimp roller (crimping section)

72‧‧‧Cam followers

73‧‧‧Close the spring (close the push)

80‧‧‧Promoting Rod (Promotion Department)

81‧‧‧ lower

82‧‧‧Upper

90‧‧‧Linear guide mechanism

91‧‧‧Axis

92‧‧‧ Keeping body

93‧‧‧ bracket

94‧‧‧ bracket

95‧‧‧ Spring (lower push)

96‧‧‧ Spring (lower push)

97‧‧‧ Lifting roller (lifting section)

100‧‧‧ Lifting lever mechanism

101‧‧‧ Lifting lever

102‧‧‧Cam follower (second cam follower)

103‧‧‧Connected shaft

104‧‧‧Receiving components

104a‧‧‧Upper tab

104b‧‧‧Bottom tab

105‧‧‧ Pushing spring

110‧‧‧Travel guides

115‧‧‧Fixed cam groove members

116‧‧‧ Guide groove (guide)

120‧‧‧Opening and closing action cam

129‧‧‧ Curve

130‧‧‧ Lifting cam (second cam)

139‧‧‧ Curve

140‧‧‧Rotary motion drive

141‧‧ ‧motor

142‧‧‧Sprocket

140A‧‧‧Rotary motion drive

141A‧‧‧Motor

143A‧‧‧ rotating disk

[Fig. 1] A plan view of a wafer transfer device.

[Fig. 2] A side view of the pickup.

[Fig. 3] Top view of the pickup.

[Fig. 4] A plan view of the pickup.

[Fig. 5] A plan view of the pickup.

[Fig. 6] Front view of the pickup.

[Fig. 7] Front view of the pickup.

[Fig. 8] Front view of the pickup.

[Fig. 9] A bottom view of the pickup.

[Fig. 10] An explanatory view of the shape of the cam.

[Fig. 11] A plan view of a wafer transfer device according to a modification.

[12] A plan view of a wafer transfer device according to another modification.

[Fig. 13] A side view of a pickup machine provided in the wafer transfer device shown in Fig. 12.

At least the following matters can be understood from the description of the specification and the drawings described later.

The wafer transfer device of the present invention is a wafer transfer device that transfers a wafer conveyed by a first transporter to a second transporter, and has a shape that forms a closed path as seen from above, and has the same shape as described above. a first parallel section in which the transport path of the transporter is arranged, a guide that is parallel to the transport path of the second transporter; and a movable body that moves along the guide; and a moving body, a cooker mechanism that is openable and closable in a lateral direction; and an opening and closing operation cam that opens and closes the cookware mechanism along the guide; the moving body is on the first conveyor side of the guide When the first parallel movement is moved, the opening and closing operation cam closes the cookware mechanism, and the cookware mechanism holds the wafer conveyed by the first transporter.

As described above, in the state in which the wafer is held by the cookware mechanism, the moving body is moved from the first side of the first conveyor side to the second side of the second conveyor side together with the cooker mechanism. By walking in the interval, the wafer can be transferred to the second carrier.

Since the cooker mechanism is a person who opens and closes, it is possible to suppress the occurrence of wind pressure caused by the action of the cooker mechanism. Therefore, even if the powder is processed on the first conveyor side and the second conveyor side, scattering of the powder due to the operation of the cooker mechanism can be suppressed.

Preferably, the wafer transfer device further includes: a pusher portion that is provided on the movable body so as to be movable up and down so as to be held at a position of the wafer of the cookware mechanism; and a guide along the guide member a lifting/lowering cam for elevating and lowering the propelling portion; and when the moving body travels in the second parallel portion of the second conveyor side of the guide, the lifting and lowering cam lowers the pushing portion The pusher portion pushes down the aforementioned wafer to be held by the cooker mechanism.

As above, the wafer held by the fixture is used by When the propeller is pushed down, the wind pressure does not occur. Therefore, even if the powder is processed on the second conveyor side, the scattering of the powder caused by the operation of the pusher bar can be suppressed.

Preferably, the wafer transfer device further includes a grip force generating mechanism provided in the cooker mechanism to apply a holding force to the cookware mechanism, wherein the movable body travels on the first conveyor side of the guide member In the first parallel movement section, the opening and closing operation cam generates a holding force by the holding force generating mechanism, and the wafer is held by the cookware mechanism by the holding force, and the moving body is from the first conveyor When the first parallel running section of the side is traveling toward the second parallel section on the second conveyor side, the opening and closing operation cam is a state in which the holding force of the gripping force generating mechanism is maintained and the closing of the cooker mechanism In a state in which the moving body travels in the second parallel section on the second conveyor side of the guide, the holding force is reduced in a state in which the opening and closing cam holds the closed state of the cooker mechanism. After the holding force of the mechanism, the lowering of the pushing portion and the pushing of the wafer by the lifting and lowering cam are performed.

Further preferably, when the cooker mechanism is closed by the opening and closing operation cam, the lifting and lowering cam lowers the pushing portion, and the pushing portion is the wafer that is transported by the first conveyor. The aforementioned wafer is supported above.

As described above, when the moving body travels in the first parallel section on the first conveyor side, since the holding force is given to the cookware mechanism by the holding force generating mechanism, the wafer can be surely picked up by the cookware mechanism.

When the moving body travels from the first parallel section on the first conveyor side to the second parallel section on the second conveyor side, since the holding force is given to the cookware mechanism by the holding force generating mechanism, it can be prevented The wafer is detached from the cookware mechanism.

When the moving body travels in the second parallel section on the second conveyor side, the wafer is held in a stable posture because the wafer held by the cookware mechanism is pushed down by the pushing portion in a state where the holding force is reduced. Dropped towards the second carrier.

Preferably, the wafer transfer device further includes: a pusher portion that is provided on the movable body so as to be movable up and down so as to be held at a position of the wafer of the cookware mechanism; and a guide along the guide member a lifting/lowering cam for raising and lowering the pushing portion; when the cooker mechanism is closed by the opening and closing operation cam, the lifting and lowering cam lowers the pushing portion, and the pushing portion is from the first carrying The wafer is supported above the wafer to be transported.

As described above, since the wafer transported by the first transporter is supported from above by the pusher portion, the cooker mechanism can prevent the wafer from scattering by the cookware mechanism when the wafer is held.

In order to solve the above problems, the pick-up machine that picks up the wafer along the closed path includes a moving body that travels along the closed path, and a movable body that is provided in the horizontal direction so as to be openable and closable in the lateral direction. A cookware mechanism that holds the aforementioned wafer by closing.

According to the above, since the cooker mechanism is a person who opens and closes, it is possible to suppress the occurrence of wind pressure caused by the operation of the cooker mechanism. because Thereby, the scattering of the powder by the action of the cooker mechanism can be suppressed.

Preferably, the pick-up machine further includes: a gripping force generating mechanism provided in the cooker mechanism to impart a holding force to the cooker mechanism that holds the wafer.

According to the above, since the holding force is imparted to the cookware mechanism by the holding force generating mechanism, the wafer can be surely picked up by the cookware mechanism.

Further preferably, the cooker mechanism includes: a fixed base portion fixed to the movable body; and a fixed cooker claw extending from the fixed base portion; and a rotatably provided at the fixed base portion a movable base portion; and extending from the movable base portion, wherein the fixed base member is disengaged by rotation of the movable base portion, and the wafer is inserted into the fixed base by approaching the fixed cooker claw a movable jaw member having a claw; the holding force generating mechanism includes: an operation lever that is rotatably provided on the movable base portion to engage an end surface of the movable base portion; and the operation operation The lever pushes the action operating lever toward the pressing end portion of the movable base portion.

According to the above, in the state where the wafer is held between the fixed cooker claw and the movable cooker claw, if the action lever is pressed against the movable base by the pushing force of the pressing portion, the pushing force of the pressing portion is a permeation operation. The rod acts on the movable base portion and the movable cooker claw to cause the holding force to occur. Conversely, when the operating lever is approached from the movable base by the pushing force of the pushing portion, the holding force is reduced.

Further preferably, the pick-up machine further includes: An intermediate portion is coupled to the fixed base portion, an opening and closing operation lever rotatably provided around the intermediate portion; a pressure contact portion provided at one end portion of the opening and closing operation lever; and the other end of the opening and closing operation lever a cam follower that is in contact with the cam; and a closing and pressing portion that urges the opening and closing operating lever to urge the cam follower toward the cam; the cooker mechanism is in the action lever Further, the position of the fixed base portion side away from the fixed base portion further includes an arm portion provided in the movable base portion, and the pressure contact portion is inserted between the arm portion and the action operating lever, and the pressing force is caused by the closing and pressing portion The joint is urged from the side of the action lever toward the side of the arm.

According to the above, when the operation lever is pressed by the pressure contact portion by the rotation of the opening and closing operation lever, the movable base portion is rotated to approach the movable cooker claw toward the fixed cooker claw. Thereby, the wafer is held between the fixed cooker claw and the movable cookware claw. Further, when the operating lever is pressed by the crimping portion by the rotation of the opening and closing lever, since the acting lever is biased against the pressing portion away from the movable base, the pushing force of the pushing portion is transmitted. The action lever acts on the movable base portion and the movable cooker claw to cause the holding force to occur. Thereafter, when the rotation of the opening and closing operation lever is reversed, the operating lever is approached from the movable base by the pressing force of the pressing portion, and the holding force is released. When the rotation of the opening/closing operation lever is reversely rotated, the arm portion is pressed by the crimping portion, and the movable base portion is rotated to move the movable jaw claw away from the fixed cooker claw.

Further preferably, the distance between the operation lever and the arm portion when the operation lever is in contact with the end surface of the movable base portion is larger than the diameter of the pressure contact portion.

According to the above, the crimping portion may be in a state of not being in contact with the operating lever or the arm portion. Therefore, the wafer is held between the fixed cooker claw and the movable cookware claw, and can be surely released from the gripping force.

Preferably, the pick-up machine includes: a pushing unit; and a guiding mechanism provided on the moving body to guide the pushing unit up and down so as to be held by the position of the wafer of the cooker mechanism And a lower pressing portion that pushes the pushing portion downward toward the guiding mechanism; and a lifting portion that is guided up and down by the guiding mechanism together with the pushing portion; and the lifting portion a receiving member that is vertically movably disposed; and a lifting and lowering lever that is movable up and down together with the receiving member; and a second cam follower that is disposed on the lifting and lowering lever and in contact with the second cam; and Pushing the second cam follower toward the second cam by pushing the lifting lever, and pushing the receiving member to urge the receiving member toward the second pushing portion of the lifting portion .

According to the above, when the raising/lowering lever is raised, the lifting member is pushed upward by the receiving member, and the pushing portion is raised against the pushing force of the lower pressing portion. Thereafter, when the elevation operating lever is lowered, the pushing portion and the lifting portion are lowered by the pressing force of the lower pressing portion, and the pushing portion is brought into contact with the wafer. Here, when the wafer is not supported, the elevating lever is further lowered, and the pushing portion and the elevating portion are further lowered by the pushing force of the lower pressing portion, so that the wafer is pushed down from the cooker mechanism. On the other hand, if the wafer is supported, even if the lifting lever is further lowered, the receiving member will Keep away from the lifting section so that the propulsion section and the lifting section do not fall further. Therefore, even if errors and variations occur in the thickness and posture of the wafer, the wafer is not pushed excessively downward.

Here, even if the pusher is raised and lowered, the wind pressure hardly occurs. Therefore, it is possible to suppress the scattering of the powder caused by the lifting operation of the pusher bar.

[Examples]

Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, in the following embodiments, the present invention is not limited to the following embodiments and examples.

1. Outline of wafer transfer device (wafer supply device)

FIG. 1 is a plan view of the wafer transfer device 1.

On the front side and the rear side of the wafer transfer device 1, the first carrier 10 and the processor 20 are separately provided. Further, the wafer transfer apparatus 1 sequentially transfers the wafers 2 sequentially delivered by the first conveyor 10 at equal intervals to the second conveyor 24 of the processor 20. Here, although the wafer 2 is an electronic component, a small piece other than the electronic component may be used.

The first conveyor 10 is a belt conveyor type conveyor. The first conveyor 10 includes a ring-shaped belt 11, a plurality of support portions 12, a motor 13, and a plurality of pulleys. The plurality of pulleys are arranged in the left-right direction as seen from the direction shown in Fig. 1, and the rotation axes of the pulleys extend in the front-rear direction, and the ring-shaped belts 11 are supported by the pulleys. Any of the belts The wheel is driven by the motor 13, and the ring-shaped belt 11 is circulated, the upper portion of the ring-shaped belt 11 is transferred in the direction of the arrow A, and the lower portion of the ring-shaped belt 11 is transferred in the opposite direction of the arrow A. In the outer peripheral surface of the ring-shaped belt 11 (the upper surface of the upper portion of the ring-shaped belt 11 and the lower surface of the lower portion of the ring-shaped belt 11), the plurality of support portions 12 are arranged at equal intervals along the longitudinal direction of the belt 11. These support portions 12 are constituted by adsorption nozzles. The tip end of the adsorption nozzle is provided to protrude outward from the belt 11, and a suction port is provided at the tip end thereof. The wafer 2 is a suction port that is placed on the support portion 12 that moves in the direction of the arrow A, and the support portion 12 adsorbs the wafer 2 by a negative pressure.

The processor 20 is a tablet processor. Specifically, the tablet is formed by embedding the wafer 2 by solidification with the wafer 2 supplied from the wafer transfer device 1 by compression. The processor 20 includes a plurality of cymbals 21, a top cymbal (not shown), a lower jaw (not shown), and a cymbal feeding device 23 as wafer receiving portions. As seen from above, the plurality of turns 21 are arranged along a closed path (e.g., an elliptical shaped path) that is rotated by the feed device 23 along a closed path. The device having the weir feeding device 23 and the weirs 21 is the second carrier 24.

In each of the jaws 21, the bore 22 is vertically penetrated, and the lower jaw and the upper jaw are provided so as to be movable up and down along the direction in which the bore 22 passes.臼21 is a period of one cycle along the closed path, and the wafer 2 is supplied to the bore 22 by the wafer transfer device 1, and the powder is supplied to the bore 22 by the powder supply device, and the powder in the bore 22 and Wafer 2 is by means of The crucible and the lower jaw are held up and down, and the powder in the bore 22 is solidified by the pressure of the upper and lower jaws. When the rear side of the wafer transfer device 1 passes the direction of the arrow B, the lower jaw is in a state in which the pupil 22 is inserted from the lower side of the crucible 21, and the upper jaw is separated from the pupil 22 upward. The wafer 2 is supplied from the upper side of the crucible 21 to the pupil 22 by the wafer transfer device 1. Further, the closed path of the trajectory of the crucible 21 is an elliptical shape, and when the crucible 21 moves in a linear section of a part of the closed path, the wafer 2 is supplied to the pupil 22 by the wafer transfer device 1.

The wafer transfer device 1 includes a pickup row 3, a traveling guide 110, an opening and closing operation cam 120, a lifting operation cam 130, a revolving motion driving device 140, and the like.

The traveling guide 110 is a guide rail that forms a closed path. More specifically, as seen from above, since the traveling guide 110 is formed in an elliptical shape (a rectangular shape), the linear portion of the front side and the semi-circular conveyance section 110c and the rear side of the left side are provided. The linear cross section 110b and the right semicircular return section 110d are formed. The front side travel section 110a is a section (first parallel section) in which the transport path of the first transporter 10 (the wafer 2 is transported linearly in the direction of the arrow A in the transport path). The rear side section 110b is a section (second parallel section) in which the conveyance path of the second conveyor 24 (the 臼21 is linearly moved in the direction of the arrow B in the conveyance path). The left ends of the parallel sections 110a and 110b are connected to each other by the transport section 110c, and the right ends of the sections 110a and 110b are connected to each other by the return section 110d.

The pickup row 3 is a multi-pickup machine 30 (see FIGS. 2 to 8) which is modularized. These are formed by arranging the pickups 30 at equal intervals along the traveling guides 110. Although the pick-up machine 30 is arranged across the entire circumference of the traveling guide 110, in the first drawing, in order to facilitate the observation of the traveling guide 110, the opening and closing operation cam 120, and the lifting operation cam 130, a part of the illustration is shown. Picker 30.

These pickers 30 are supported on the walking guide 110 and guided along the walking guide 110. The revolving motion driving device 140 applies power to the pickup machine 30, and causes the pickup machine 30 to travel in a clockwise direction as seen from above. Thereby, the pickup 30 is wound along the traveling guide 110. The traveling speed of the pickup 30 is equivalent to the traveling speed of the belts 11 and 21.

The opening and closing operation cam 120 is an actuator that opens and closes the pickup machine 30 in association with the movement of the pickup machine 30. The lifting/lowering cam 130 is a squeaking operation of the wafer 2 with respect to the pickup 30 by the movement of the pickup 30. When the pickup machine 30 travels in the parallel section 110a in parallel with the support portion 12, the pickup machine 30 picks up the wafer 2 by the opening and closing operation cam 120, and the pickup machine 30 suppresses the wafer 2 from above. The action is performed by the lifting and lowering motion cam 130. Thereafter, when the pickup machine 30 travels from the walking section 110a toward the walking section 110b in the conveyance section 110c, the pickup 30 maintains the state in which the wafer 2 is picked up. Thereafter, when the picker 30 is walking in the parallel section 110b in parallel with the crucible 21, the picking machine 30 pushes the wafer 2 down by the lift. The lowering action cam 130 is performed. Thereafter, when the pickup machine 30 travels from the walking section 110b toward the walking section 110a in the return section 110d, the pickup 30 is maintained in the open state.

2. The composition of the pickup

The pickup 30 will be described in detail with reference to Figs. 2 to 8 . 2 is a side view of the pickup 30, FIGS. 3 to 5 are plan views of the pickup 30, and FIGS. 6 to 8 are front views of the pickup 30. Further, the front surface of the pickup machine 30 refers to the surface facing the outside of the traveling guide 110, and the rear surface of the pickup machine 30 refers to the surface facing the inside of the traveling guide 110.

The pickup machine 30 includes a moving body (traveling body) 40, a cooker mechanism 50, a gripping force generating mechanism 60, an opening and closing operation lever 70, a pusher (propulsion unit) 80, a linear guide mechanism 90, a lifting lever mechanism 100, and the like.

(1) Mobile body 40

As shown in FIGS. 2 and 6 to 8 , the movable body 40 has a mounting frame 41 , travel rollers 42 and 43 , and a stay 44 . In the upper surface of the mounting frame 41, the stay 44 is set up to be erected, and in the lower surface of the mounting frame 41, the traveling rollers 42, 43 are rotatably attached. The travel mount 41 is disposed on the travel guide 110, and the rotation axes of the travel rollers 42 and 43 extend downward from the lower surface of the mount 41, and the travel rollers 42 and 43 are respectively disposed on the travel guide. The outer side and the inner side of the member 110. The traveling roller 42 and the traveling roller 43 are inserted between the walking guides 110 by these. The moving body 40 is supported on the walking guide 110. The traveling rollers 42, 43 are rotated about the traveling guide 110, thereby causing the moving body 40 to travel along the traveling guide 110.

(2) Cookware organization 50

In the upper end of the stay 44, a cooker mechanism 50 that opens and closes in the lateral direction (horizontal direction) and holds the wafer 2 is attached. As shown in FIGS. 3 to 5, the cooker mechanism 50 includes a fixing jig 51, a movable jig 55, and the like.

The fixing jig 51 has a fixed base portion 52 and a fixed cooker claw 53. This fixed base portion 52 is fixed in a state of being placed on the upper end surface of the stay 44. As seen from above, the fixed base portion 52 is larger than the upper end surface of the stay 44, and the fixed base portion 52 protrudes forward and left from the upper surface of the stay 44. The fixed cooker claw 53 is provided at the front end of the fixed base portion 52. Here, as shown in Fig. 2, the fixed cooker claw 53 is formed in a crank shape as seen from the lateral side, and the upper portion 53a of the fixed cooker claw 53 is suspended from the front end of the fixed base portion 52 to fix the middle portion of the cooker claw 53. 53b is bent forward from the lower end of the upper portion 53a, and the lower portion 53c of the fixed cooker claw 53 is bent downward from the front end of the middle portion 53b.

As shown in FIGS. 3 to 5, the movable jig 55 is assembled in the fixing jig 51. The movable jig 55 has a movable base portion 56, an arm portion 57, and a movable cooker claw 58. The movable base portion 56 is coupled to the fixed base portion 52 of the fixing jig 51 by a rotating shaft 56a extending in the vertical direction, and the movable base portion 56 is rotatably centered on the rotating shaft 56a. Settings. The movable base portion 56 protrudes leftward from the left edge 52a of the fixed base portion 52, and a movable cooker claw 58 is provided at the front end of the protruding portion. The movable cooker claw 58 is formed to have almost the same shape as the fixed cooker claw 53 (refer to FIG. 2) when viewed in the lateral direction (the second drawing is referred to), and the upper portion of the movable cooker claw 58 is the front end of the movable base portion 56. Hanging down, the middle portion of the movable cooker claw 58 is bent from the upper portion toward the front side, and the lower portion of the movable cooker claw 58 is bent downward from the middle portion.

The movable cooker claw 58 is disengaged from the fixed cooker claw 53 by the rotation of the movable base portion 56. Here, the lower portion of the movable cooker claw 58 and the lower portion 53c of the fixed cooker claw 53 face each other in the circumferential direction of the rotary shaft 56a, and recesses 58d, 53d are formed in the mutually facing portions thereof ( Figure 3 refers to). The movable cooker claw 58 is close to the fixed cooker claw 53 (refer to FIGS. 4 and 5), and the wafer 2 is held between the cooker claws 58 and 53 so as to be receivable in the recesses 58d and 53d.

In the rear end of the movable base portion 56, the arm portion 57 is provided to protrude rearward from the rear end of the movable base portion 56. When the movable cooker claw 58 is away from the fixed cooker claw 53 (refer to FIG. 3), the arm portion 57 overlaps with the fixed base portion 52 of the fixed jig 51, and the movable cooker claw 58 approaches the fixed cooker claw 53 ( 4 and 5, the arm portion 57 protrudes leftward from the left edge 52a of the fixed base portion 52.

(3) Holding force generation mechanism 60

The grip generating mechanism 60 is assembled in the movable jig 55. The holding force generating mechanism 60 is held on the wafer 2 by the fixed jaws 53 and In the state between the movable cooker claws 58 (refer to FIG. 4), the force that holds the wafer 2 is generated by pressing the movable cooker claws 58 toward the fixed cooker claws 53 side. The grip generating mechanism 60 has an operating lever 61, a support shaft 62, and a biasing spring (urging portion) 63.

The base end of the operation lever 61 is coupled to the left end portion of the movable base portion 56 by a rotation shaft 61a extending in the vertical direction, and the operation lever 61 is rotatably provided around the rotation shaft 61a. The operation lever 61 extends rearward from the rotation shaft 61a, and the operation lever 61 and the arm portion 57 are juxtaposed at intervals. The support shaft 62 is a bolt member, and the base end of the support shaft 62 is fixed to the left end surface 56b of the movable base portion 56, and the support shaft 62 extends leftward from the left end surface 56b of the movable base portion 56 and penetrates through the operation The lever 61 passes the support shaft 62 through a coil spring, that is, a push spring 63 that is held between the head portion 62a of the support shaft 62 and the action lever 61.

(4) Opening and closing the operating lever 70

The movable jig 55 is rotated by the opening and closing operation lever 70. The intermediate portion of the opening and closing operation lever 70 is coupled to the rear end portion of the fixed base portion 52 of the fixing jig 51 by a rotation shaft 70a extending in the vertical direction. The opening and closing operation lever 70 is rotatably centered on the rotation shaft 70a. Settings. A portion on one end side of the opening and closing operation lever 70 extends forward from the rotation shaft 70a, and a pressure contact roller 71 is provided at one end portion of the opening and closing operation lever 70. This pressure roller 71 is inserted between the arm portion 57 and the operation lever 61. Here, the operation of the case where the operation lever 61 abuts against the left end surface 56b of the movable base portion 56 is operated. The interval between the rod 61 and the arm portion 57 is larger than the diameter of the crimping roller 71.

On the other hand, a portion on the other end side of the opening and closing operation lever 70 extends rearward from the rotation shaft 70a, and a cam follower 72 is provided at the other end portion of the opening and closing operation lever 70.

One end of a closing spring (closing the pressing portion) 73 is connected to the opening and closing operation lever 70. The other end of the closing spring 73 is connected to the fixed base portion 52 of the fixing jig 51. As seen from the illustrated directions of FIGS. 3 to 5, the opening and closing operation lever 70 is urged in the counterclockwise direction by the closing spring 73, whereby the cam follower 72 is abutted against the opening and closing operation cam. 120. As shown in FIGS. 3 to 5, the opening and closing operation lever 70 is rotated by the opening and closing operation cam 120, and the cooker mechanism 50 is opened and closed. The opening and closing operation of the cooker mechanism 50 will be described in detail later.

(5) Push rod 80

As shown in Fig. 2, a pusher bar 80 is disposed on the upper side of the fixed cooker claw 53. As shown in Fig. 4 and Fig. 5, as seen from above, the lower portion 81 of the pusher bar 80 overlaps with the gap between the recesses 53d and 58d of the cookware claws 53, 58 when the cookware mechanism 50 is closed.

(6) Linear guide mechanism 90

As shown in FIG. 2 and FIG. 6 to FIG. 8, the pusher bar 80 is a fixed base portion 52 that is assembled to the fixing jig 51 so as to be movable up and down by the linear guide mechanism 90. The linear guide mechanism 90 is to push the rod 80 toward The leader in the up and down direction. Thereby, the lower portion 81 of the pusher bar 80 passes through the position of the wafer 2 in the case where the wafer 2 can be held between the cooker claws 58 and 53 so that the wafer 2 can be accommodated in the recesses 58d and 53d. Here, the linear guide mechanism 90 has a shaft 91, a holding body 92, a bracket 93, and a bracket 94. The holder 92 is provided on the fixed base portion 52. The shaft 91 is a vertically penetrating holding body 92 and a fixed base portion 52, and is supported by the holding body 92 so as to be movable up and down. A bracket 93 is attached to the upper end of the shaft 91, and a bracket 94 is attached to the lower end of the shaft 91. A lifting roller (lifting portion) 97 is provided in the bracket 94 on the lower side. On the other hand, as shown in FIGS. 3 to 5, the bracket 93 on the upper side is bent forward from the upper end surface of the holding body 92 to the left, and the upper end of the pusher bar 80 is fixed to the tip end portion of the bracket 93. 82.

As shown in FIGS. 2 and 6 to 8 , the spring 95 is provided between the upper portion of the holding body 92 and the bracket 93 , and is provided between the fixed base portion 52 of the fixing jig 51 and the bracket 94 . Spring 96. Since the bracket 93, the shaft 91, the bracket 94, and the pusher bar 80 are urged downward by the combination of the spring 95 and the spring 96, the combination of the spring 95 and the spring 96 is a lower pressing portion.

(7) Lifting lever mechanism 100

The pusher bar 80, the bracket 93, the bracket 94, and the lift roller 97 are lifted and lowered by the lift lever mechanism 100. As shown in FIGS. 6 to 8 , the elevation operating lever mechanism 100 includes an elevation operating lever 101 , a cam follower 102 , a connecting shaft 103 , a receiving member 104 , and a pushing spring (second pressing portion) 105 . . The connecting shaft 103 is attached to the pillar by a bearing or the like 44. The radial load of the connecting shaft 103 is received by the bearing and the strut 44. The connecting shaft 103 penetrates the pillars 44 in the front-rear direction, and connects the connecting shaft 103 to the base end portion of the elevation operating lever 101 on the rear side of the pillar 44, and connects the connecting shaft 103 to the receiving member 104 on the front side of the pillar 44. The receiving member 104 and the elevation operating lever 101 are rotated about the connecting shaft 103.

The elevation operating lever 101 extends outward from the connecting shaft 103 in the radial direction of the connecting shaft 103 (more specifically, the right side of FIGS. 6 to 8), and a cam is provided in the tip end portion of the lifting lever 101. Follower 102. The cam follower 102 is in contact with the lifting/lowering cam 130.

In the receiving member 104, a pair of upper and lower tabs 104a and 104b are provided. These protruding pieces 104a and 104b project outward from the connecting shaft 103 in the radial direction of the connecting shaft 103 (more specifically, the right side of FIGS. 6 to 8). The upper tab 104a is spaced upward from the lower tab 104b, and the lifting roller 97 is inserted therebetween. The interval between the upper tab 104a and the lower tab 104b is larger than the diameter of the lift roller 97.

An upper end portion of the pushing spring 105 is connected to the receiving member 104, and a lower end portion of the pushing spring 105 is connected to the stay 44. Therefore, as seen from the illustrated directions of FIGS. 6 to 8 , the receiving member 104 and the lifting lever 101 are urged in the counterclockwise direction by the spring 105. Thereby, the lower tab 104b of the receiving member 104 abuts against the lifting roller 97.

Further, the force that urges the spring 105 to swing the receiving portion 104 and the elevation operating lever 101 upward in the counterclockwise direction is stronger than the force by which the springs 95 and 96 push the lifting roller 97 downward. Therefore, the underside of the receiving member 104 When the tab 104b abuts against the lifting roller 97, the lowering of the lifting roller 97 is restricted. Further, the cam follower 102 is abutted against the elevating operation cam 130 by the force of the biasing spring 105, and the elevating operation lever 101 swings upward and downward. Here, when the elevation operating lever 101 and the receiving member 104 are swayed downward in the clockwise direction by the force of the urging spring 105 by the lifting/lowering cam 130, the lifting roller 97 is by the springs 95, 96. The elasticity is followed by the lowering of the lower tab 104b. On the other hand, when the elevation operating lever 101 and the receiving member 104 are swung upward in the counterclockwise direction by the lifting and lowering motion cam 130 and the pushing spring 105, the lifting roller 97 is the lower projection by the receiving member 104. 104b was elected.

Further, the upper end portion of the pushing spring 105 may be connected to the elevation operating lever 101.

As shown in FIGS. 6 to 8, the elevation operating lever 101 is rotated by the lifting/lowering cam 130, and the bracket 93, the shaft 91, the bracket 94, and the pusher bar 80 are also raised and lowered together with the lifting roller 97. Here, since the diameter of the lifting roller 97 is smaller than the interval between the upper tab 104a and the lower tab 104b, if the lifting and lowering of the lifting roller 97 and the pusher bar 80 are restricted, the lower tab 104b can be Move away from the lifting roller 97 downward.

3. Pickup link

The plurality of pickers 30 configured as above are arranged in an elliptical shape. The moving body 40 (especially the mounting frame 41) of the adjacent pick-up machine 30 is connected by the connecting slip ring 31 as shown in the bottom view of FIG. Knot.

4. Rotating motion drive device

Next, the wrap motion driving device 140 will be described with reference to Fig. 1 . The revolving motion driving device 140 has a motor 141 and a drive sprocket 142. The output shaft of the motor 141 is coupled to the drive sprocket 142.

On the other hand, as shown in FIGS. 2 and 8, two pins 143 are erected on the upper surface of the movable body 40. More specifically, the pin 143 is provided so as to be coaxial with the rotation shaft of the connection slip ring 31. Since the above-described multi-pickup machine 30 is arranged in an elliptical shape, the number of pins 143 of the number twice the number of the pickups 30 is arranged in an elliptical shape, and the rows of the pins 143 are engaged with the drive sprocket 142. When the motor 141 is actuated, the row of the pins 143 and the row of the moving body 40 are wound along the traveling guide 110.

5. Opening and closing action cam

The opening and closing operation cam 120 is a driver that converts the power during the traveling of the pickup machine 30 into the rotational motion of the opening and closing operation lever 70. As shown in FIG. 1, the opening and closing operation cam 120 is provided along the traveling guide 110 in the circumferential direction. As shown in FIG. 2, the cam follower 72 is in contact with the opening and closing operation cam 120 from the outer side in the radial direction of the opening and closing operation cam 120.

As seen from above, the interval from the traveling guide 110 to the opening and closing operation cam 120 is not constant, but the position corresponding to the circumferential direction is set. Therefore, the cam follower 72 is by the walking edge of the moving body 40 When the opening/closing operation cam 120 slides in the circumferential direction, the cam follower 72 is displaced from the upper side toward the vertical intersecting direction of the traveling guide 110, thereby rotating the opening and closing operation lever 70. More specifically, it will be described with reference to FIG.

Here, in the tenth graph, a curve 129 indicated by a solid line is a graph showing the shape of the opening and closing operation cam 120. That is, the curve 129 is a curve showing the relationship between the position of the moving body 40 and the displacement of the cam follower 72, and the horizontal direction of Fig. 10 is the position of the moving body 40 along the traveling guide 110, Fig. 10 The longitudinal direction indicates the displacement of the cam follower 72 generated by the opening and closing operation cam 120. Further, the position P21 shown in Fig. 10 corresponds to the position of the joint between the walking section 110a and the return section 110d shown in Fig. 1, and the position P22 shown in Fig. 10 is the one shown in Fig. 1. The position of the joint between the section 110a and the conveyance section 110c is the position of the boundary portion of the section 110b and the conveyance section 110c shown in Fig. 10, as shown in Fig. 10 The position P13 is the position of the boundary portion between the section 110b and the return section 110d shown in Fig. 1 . The position P1 to the position P6 are located in the parallel section 110a, and the position P7 to the position P12 are located in the parallel section 110b.

As shown in Fig. 10, the moving body 40 travels between the positions from the position P13 to the position P21 to the position P2, and the displacement of the cam follower 72 is maintained at the first reference by the opening and closing operation cam 120. Value (zero). Therefore, the rotation of the opening and closing operation lever 70 is restricted.

The moving body 40 is traveling from the position P2 to the position P5. Between the sections, the displacement of the cam follower 72 is increased from the first reference value to the first maximum value by the opening and closing operation cam 120. Therefore, as seen from above (refer to FIGS. 3 to 5), the opening and closing operation lever 70 is rotated in the clockwise direction.

The moving body 40 travels between the sections from the position P5 to the position P7, and the displacement of the cam follower 72 is maintained at the first maximum value by the opening and closing operation cam 120. Therefore, the rotation of the opening and closing operation lever 70 is restricted.

The moving body 40 is between the positions from the position P7 to the position P9, and the displacement of the cam follower 72 is from the first maximum value to the first predetermined value by the opening and closing operation cam 120 (the first predetermined value is a ratio The first reference value is larger, smaller than the first maximum value) decreases. Therefore, as seen from above (refer to FIGS. 3 to 5), the opening and closing operation lever 70 is rotated in the counterclockwise direction.

The moving body 40 travels between the sections from the position P9 to the position P11, and the displacement of the cam follower 72 is maintained at the first predetermined value by the opening and closing operation cam 120. Therefore, the rotation of the opening and closing operation lever 70 is restricted.

The moving body 40 travels between the sections from the position P11 to the position P13, and the displacement of the cam follower 72 is reduced from the first predetermined value toward the first reference value by the opening and closing operation cam 120. Therefore, as seen from above, the opening and closing operation lever 70 is rotated in the counterclockwise direction.

6. Lifting action cam

The lifting operation cam 130 is a driver that converts the power of the pickup 30 during traveling into a rotational motion of the elevation lever mechanism 100. As shown in FIG. 1, the lifting/lowering cam 130 is provided along the traveling guide 110 in the circumferential direction. As shown in FIG. 2, the cam follower 102 comes into contact with the elevating operation cam 130 from below the elevating operation cam 130.

The position of the vertical movement cam 130 in the vertical direction (for example, based on the height of the traveling guide 110) is not constant, but the position corresponding to the circumferential direction is set. Therefore, when the cam follower 102 slides in the circumferential direction along the elevating operation cam 130 by the movement of the moving body 40, the cam follower 102 is displaced in the vertical direction, thereby rotating the elevating operation lever 101. More specifically, it will be described with reference to FIG.

Here, in the tenth graph, the curve 139 indicated by the solid line indicates the shape of the lifting/lowering operation cam 130. That is, the curve 139 is a curve showing the relationship between the position of the moving body 40 and the displacement of the cam follower 102, and the lateral direction of Fig. 10 is the position indicating the moving body 40 along the traveling guide 110, Fig. 10 The longitudinal direction indicates the displacement of the cam follower 102 generated by the lifting and lowering motion cam 130. Further, as the position of the cam follower 102 becomes lower, the displacement of the cam follower 102 is increased.

As shown in Fig. 10, the moving body 40 travels between the positions from the position P12 to the position P21 to the position P1, and the displacement of the cam follower 102 is maintained at the second reference by the lifting/lowering cam 130. Value (zero). Therefore, the rotation of the elevation lever 101 is restricted.

The moving body 40 is traveling from the position P1 to the position P3. Between the sections, the displacement of the cam follower 102 is caused by the raising/lowering cam 120 from the second reference value to the second predetermined value (the second predetermined value is larger than the second reference value, and is larger than the second maximum described later) The value is smaller) increase. Therefore, as seen from the front (refer to Figs. 6 to 8), the elevation operating lever 101 is swung downward in the clockwise direction.

The moving body 40 is between the positions from the position P3 to the position P4, and the displacement of the cam follower 102 is maintained at the second predetermined value by the lifting/lowering cam 130. Therefore, the rotation of the elevation lever 101 is restricted.

The moving body 40 is between the positions from the position P4 to the position P6, and the displacement of the cam follower 102 is reduced from the second predetermined value toward the second reference value by the lifting/lowering cam 130. Therefore, as seen from the front (refer to Figs. 6 to 8), the elevation operating lever 101 swings upward in the counterclockwise direction.

The moving body 40 travels between the sections from the position P6 to the position P8, and the displacement of the cam follower 102 is maintained at the second reference value by the lifting/lowering cam 130. Therefore, the rotation of the elevation lever 101 is restricted.

The moving body 40 is between the positions from the position P8 to the position P10, and the displacement of the cam follower 102 is increased from the second reference value to the second maximum value by the raising/lowering cam 130. Therefore, as seen from the front (refer to Figs. 6 to 8), the elevation operating lever 101 is swung downward in the clockwise direction.

The moving body 40 is traveling from the position P10 to the position P11. The displacement of the cam follower 102 between the sections is maintained at the second maximum value by the lifting and lowering cam 130. Therefore, the rotation of the elevation lever 101 is restricted.

The moving body 40 is between the positions from the position P11 to the position P12, and the displacement of the cam follower 102 is reduced from the second maximum value toward the second reference value by the lifting/lowering cam 130. Therefore, as seen from the front (refer to Figs. 6 to 8), the elevation operating lever 101 swings upward in the counterclockwise direction.

7. Action of the wafer transfer device

Next, the operation of the wafer transfer device 1 will be described.

When the motor 141 of the revolving motion driving device 140 is controlled at a constant speed by the constant speed control circuit, the moving body 40 of the pickup machine 30 is rotated along the traveling guide 110. The moving body 40 passes through the position P21, the positions P1 to P6, and the position P22 in sequence, in parallel with the support portion 12, in the direction of the arrow A of the first figure along the parallel section 110a of the traveling guide 110. Here, since the moving body 40 passes the support portion 12 through the position P21 in synchronization with the passing position P21, the lower end of the pusher bar 80 of the pickup 30 in the position P21 is positive with the wafer 2 supported by the support portion 12. Overlap.

Further, the moving body 40 is parallel to the crucible 21, and moves straight along the direction of the arrow Bb of the first figure along the parallel section 110b of the traveling guide 110, and sequentially passes through the position P23 and the position P7 to the position P13. Here, since the crucible 21 passes the position P23 in synchronization with the moving body 40 by the position P23, the lower end of the pusher bar 80 of the pickup 30 is overlapped in the position P23. The pupil 22 of 21 is directly above.

Hereinafter, the moving body 40 is an operation of the pickup 30 during one week along the traveling guide 110.

(1) The state before the arrival of the position P1

Before the moving body 40 of the pickup machine 30 reaches the position P1, the cooker mechanism 50, the gripping force generating mechanism 60, and the opening and closing operation lever 70 of the pickup machine 30 are in the state shown in Fig. 3. In other words, since the displacement of the cam follower 72 is the first reference value (refer to FIG. 10) by the opening and closing operation cam 120, the pressure roller 71 provided on the opening and closing operation lever 70 is abutted. The arm portion 57, the movable cooker claw 58 is away from the fixed cooker claw 53, and the cooker mechanism 50 is in an open state. Further, the pressure roller 71 is moved away from the action lever 61, and the action lever 61 is brought into contact with the left end surface 56b of the movable base portion 56 by the push spring 63.

Further, before the moving body 40 reaches the position P1, the pusher bar 80, the linear guide mechanism 90, and the lift lever mechanism 100 of the pickup machine 30 are in the state shown in Fig. 6. In other words, since the displacement of the cam follower 102 is the second reference value (refer to FIG. 10) by the elevation operation cam 130, the elevation operation lever 101 is in a state of being swung upward, and the lift roller 97 is lifted. It is a state in which the lower protruding piece 104b of the receiving member 104 is pushed. Further, the pusher bar 80 is in a raised state, and the lower end of the pusher bar 80 is moved upward from the wafer 2 on the support portion 12. The position of the pusher bar 80 at this time is referred to as the uppermost position.

(2) Suppression operation interval from position P1 to position P3

When the movable body 40 moves from the position P1 to the position P3, the pusher bar 80, the linear guide mechanism 90, and the lift lever mechanism 100 change from the state of Fig. 6 to the state of Fig. 8.

Specifically, the cam follower 102 is displaced from the second reference value by a second predetermined value by the lifting/lowering cam 130, and accordingly, since the raising/lowering lever 101 is swayed downward against the elastic force of the pushing spring 105, Therefore, the tabs 104a, 104b of the receiving member 104 are lowered. In this way, in a state where the lifting roller 97 abuts against the protruding piece 104b of the receiving member 104, the lifting roller 97 and the pushing rod 80 are lowered by the elastic force of the springs 95, 96. Further, the lower end of the pusher bar 80 is in contact with the wafer 2, and the wafer 2 is restrained by the pusher bar 80 from above.

After the lower end of the push rod 80 abuts against the wafer 2, the lift operating lever 101 is also swung downward by the lift operation cam 130. However, since the lowering of the pusher bar 80 and the lifting roller 97 is restricted by the wafer 2 and the support portion 12, the protruding piece 104b of the receiving member 104 is moved downward from the lifting roller 97 (refer to Fig. 8). Therefore, even if there is an error or a difference in the thickness and posture of the wafer 2, the wafer 2 is not excessively pressed downward by the elevating operation cam 130.

Further, when the wafer 2 is thin, when the displacement of the cam follower 102 reaches the second predetermined value, since the lower end of the pusher bar 80 abuts against the wafer 2, the tab 104b of the receiving member 104 is also possible. It is not moved away from the lifting roller 97.

(3) Inhibition maintenance interval from position P3 to position P4

When the moving body 40 is moved from the position P3 to the position P4, the displacement of the cam follower 102 is maintained at the second predetermined value by the raising/lowering operation cam 130, and the raising/lowering lever 101 is kept swinging downward. status. Further, the lower end of the pusher bar 80 is held in contact with the wafer 2 by the elastic force of the springs 95 and 96 (refer to Fig. 8).

(4) Closing action interval from position P2 to position P5

When the movable body 40 moves from the position P2 to the position P5, the cookware mechanism 50, the gripping force generating mechanism 60, and the opening and closing operation lever 70 are changed from the state of Fig. 3 to the state of Fig. 4.

Specifically, since the cam follower 72 is displaced from the first reference value to the first maximum value by the opening and closing operation cam 120, the opening and closing operation lever 70 is rotated in the clockwise direction against the closing spring 73. In this case, since the action lever 61 is pressed by the pressure roller 71, the movable clamp 55 is rotated counterclockwise about the rotation shaft 56a, and the movable jaw claw 58 is close to the fixed jaw claw. 53. Further, when the wafer 2 is held between the movable cooker claw 58 and the fixed cooker claw 53, the rotation of the movable jig 55 is stopped. Here, since the wafer 2 is restrained by the pusher bar 80 as described above, it is possible to prevent the movable cooker claw 58 from scattering by the impact force when it comes into contact with the wafer 2. Further, the position of the moving body 40 in the time when the wafer 2 is held between the movable cooker claw 58 and the fixed cooker claw 53 is slightly upstream than the position P4.

The wafer 2 is held on the movable jaws 58 and the fixed cookware At the time between the claws 53, the displacement of the cam follower 72 has not yet reached the first maximum value. Therefore, after the wafer 2 is held between the movable cooker claw 58 and the fixed cooker claw 53, the opening and closing operation lever 70 is also rotated clockwise by the opening and closing operation cam 120. In this case, the operation lever 61 is rotated about the rotation shaft 61a, and the thrust spring 63 is compressed (refer to FIG. 4). The elastic force of the compressed pushing spring 63 acts on the operating lever 61 and the movable jig 55, and the movable cooker claw 58 is pressed toward the fixed cooker claw 53 side. Thereby, the holding force is given to the cooker mechanism 50, and the wafer 2 is held by the holding force.

(5) Suppression release operation interval from position P4 to position P6

When the movable body 40 moves from the position P4 to the position P6, the pusher bar 80, the linear guide mechanism 90, and the lift lever mechanism 100 change from the state of Fig. 8 to the state of Fig. 6.

Specifically, the cam follower 102 is displaced from the second predetermined value toward the second reference value by the raising/lowering cam 130, and accordingly, the raising/lowering lever 101 is swung upward by the elastic force of the pushing spring 105. The tabs 104a, 104b of the receiving member 104 rise. In this case, the protruding piece 104b of the receiving member 104 abuts against the lifting roller 97.

In the point at which the tab 104b abuts the lifting roller 97, the displacement of the cam follower 102 does not reach the second reference position. Therefore, after the protruding piece 104b of the receiving member 104 and the lifting roller 97 abut, the lifting operation lever 101 is also swung upward by the lifting operation cam 130 and the pushing spring 105. In this case, the lifting roller 97 is protruded by the receiving member 104. The sheet 104b is pushed up, and the pusher bar 80 is raised to move the lower end of the pusher bar 80 upward from the wafer 2. Further, when the moving body 40 reaches the position P6, since the displacement of the cam follower 102 reaches the second reference value, the upward swing of the raising/lowering lever 101 is stopped, and the pusher bar 80 reaches the uppermost position.

Further, when the lower end of the pusher bar 80 is moved upward from the wafer 2, the wafer 2 is placed between the movable cooker claw 58 and the fixed cooker claw 53, and the holding force is generated from the holding force. The mechanism 60 is in a state of being given to the cookware mechanism 50.

(6) The holding force from the position P5 to the position P7 is given to the state maintaining interval

When the movable body 40 moves from the position P5 to the position P7, since the displacement of the cam follower 72 is maintained at the first maximum value by the opening and closing operation cam 120, the position of the opening and closing operation lever 70 is The opening and closing operation cam 120 is held (refer to FIG. 4). Therefore, the wafer 2 is held in a state of being held between the movable cooker claw 58 and the fixed cooker claw 53. Further, the compressed state of the urging spring 63 is held, and the state in which the urging force is given from the urging spring 63 to the cooker mechanism 50 is also maintained.

Since the wafer 2 is held by the cooker mechanism 50, the movable body 40 is moved from the position P5 to the position P7, and the wafer 2 is transported from the position P5 to the position P7.

Further, the left portion (downstream portion) of the position P6 shown in Fig. 1 among the belts 11 is slightly inclined downward. And the support 12 is slightly lowered when moving from the position P6 toward the downstream side. Therefore, when the moving body 40 changes from the linear motion to the revolving motion at the position P22 on the downstream side from the position P6, the interference of the upper ends of the cookware claws 58, 53 and the support portion 12 can be prevented.

(7) Sustaining release state maintenance section from position P6 to position P8

When the moving body 40 moves from the position P6 to the position P8, the displacement of the cam follower 102 is maintained at the second reference value by the raising/lowering cam 130. Therefore, the elevation operating lever 101 is held in a state of being swung upward, and the position of the pusher bar 80 is held at the uppermost position.

(8) The reduction ratio of the holding force from the position P7 to the position P9

When the movable body 40 moves from the position P7 to the position P9, the cookware mechanism 50, the gripping force generating mechanism 60, and the opening and closing operation lever 70 are changed from the state of Fig. 4 to the state of Fig. 5.

Specifically, since the cam follower 72 is displaced from the first maximum value toward the first predetermined value by the opening and closing operation cam 120, the opening and closing operation lever 70 is rotated counterclockwise by the elastic force of the closing spring 73. . In this case, the operating lever 61 is followed by the crimping roller 71 by the elastic force of the biasing spring 63. At this time, the movable jig 55 is stopped, the cookware mechanism 50 is held in a closed state, and the wafer 2 is held between the movable cooker claw 58 and the fixed cooker claw 53. However, since the elastic force of the urging spring 63 is reduced by the restoration of the urging spring 63, the holding force for the wafer 2 is also reduced.

When the cam follower 72 is displaced from the first maximum value toward the first predetermined value by the opening and closing operation cam 120, the operation lever 61 is brought into contact with the left end surface 56b of the movable base portion 56. The operation of the operating lever 61 is stopped. After the operation lever 61 is stopped, the opening and closing operation lever 70 is also rotated in the counterclockwise direction by the opening and closing operation cam 120 and the closing spring 73. Further, before the pressure roller 71 is moved away from the operation lever 61 and abuts against the arm portion 57, since the cam follower 72 reaches the first predetermined value, the opening and closing operation lever 70 is stopped (refer to FIG. 5).

In the state shown in Fig. 5, the pushing spring 63 is not compressed, and the elastic force does not act from the pushing spring 63 toward the movable jig 55. Therefore, the holding force for the wafer 2 is almost released to zero, and the wafer 2 is supported between the movable cooker claw 58 and the fixed cooker claw 53 by friction or the like.

(9) Release state maintenance interval from position P9 to position P11

When the movable body 40 moves from the position P9 to the position P11, since the displacement of the cam follower 72 is maintained at the first predetermined value by the opening and closing operation cam 120, the position of the opening and closing operation lever 70 is opened and closed. The moving cam 120 is held (refer to Fig. 5). At this time, the wafer 2 is pushed down by the pusher bar 80 as will be described later.

(10) Push-down action interval from position P8 to position P10

When the movable body 40 moves from the position P8 to the position P10, the pusher bar 80, the linear guide mechanism 90, and the lift lever mechanism 100 change from the state of Fig. 6 to the state of Fig. 7.

Specifically, since the cam follower 102 is displaced from the second reference value toward the second maximum value by the raising/lowering cam 130, the lifting lever 101 is biased downward against the elastic force of the pushing spring 105. The oscillating motion is such that the tabs 104a, 104b of the receiving member 104 are lowered. In this way, in a state where the lifting roller 97 abuts against the protruding piece 104b of the receiving member 104, the lifting roller 97 and the pushing rod 80 are lowered by the elastic force of the springs 95, 96. Further, the lower end of the pusher bar 80 is in contact with the wafer 2, and the wafer 2 is pushed down by the pusher bar 80. The wafer 2 is dropped toward the bore 22 of the crucible 21.

When the wafer 2 is pushed down by the pusher bar 80, the force of breaking the wafer 2 as described above becomes almost zero. Therefore, when the wafer 2 is detached from the cooker claws 53, 58, the force acting on the wafer 2 from the cookware claws 53, 58 is small, and the wafer 2 is dropped from a stable posture.

(11) The lowest position maintenance interval from the position P10 to the position P11

When the moving body 40 moves from the position P10 to the position P11, since the displacement of the cam follower 102 is maintained at the second maximum value by the lifting and lowering motion cam 130, the elevation operating lever 101 is held down. In the swing state, the height of the pusher bar 80 is maintained (refer to Fig. 7).

(12) Return action interval from position P11 to position P12

When the movable body 40 moves from the position P11 to the position P12, the pusher bar 80, the linear guide mechanism 90, and the lift lever mechanism 100 change from the state of Fig. 7 to the state of Fig. 6.

Specifically, the cam follower 102 is displaced from the second maximum value toward the first reference value by the elevating operation cam 130, and the elevating operation lever 101 is moved by the elevating operation cam 130 and the pushing spring 105. Swing up. In this case, the lifting roller 97 is pushed by the tab 104b of the receiving member 104, and the pusher bar 80 is raised. Further, when the moving body 40 reaches the position P12, since the displacement of the cam follower 102 reaches the second reference value, the upward swing of the raising/lowering lever 101 is stopped, and the pusher bar 80 reaches the uppermost position (Fig. 6). Reference).

(13) Opening action interval from position P11 to position P13

When the movable body 40 moves from the position P11 to the position P13, the cookware mechanism 50, the gripping force generating mechanism 60, and the opening and closing operation lever 70 are changed from the state of FIG. 4 to the state of FIG.

Specifically, since the cam follower 72 is displaced from the first predetermined value to the first reference value by the opening and closing operation cam 120, the opening and closing operation lever 70 is turned counterclockwise by the elastic force of the closing spring 73. Rotate. In this case, the arm portion 57 is pressed by the pressure roller 71, and the movable jig 55 is rotated clockwise about the rotation shaft 56a. Therefore, the cookware mechanism 50 is opened, and the movable cooker claw 58 is away from the fixed cooker claw 53.

When the moving body 40 reaches the position P13, since the cam follower 72 reaches the first reference value, the opening and closing operation lever 70 is stopped, and the movable jig 55 is also stopped (refer to FIG. 3).

(14) The interval from the position P12 to the position P13 and the position P1 to the position P2

When the moving body 40 is moved from the position P12 to the position P1, since the displacement of the cam follower 102 is maintained at the second reference value by the lifting and lowering operation cam 130, the elevation operating lever 101 is kept swinging upward. status. Thereby, the position of the pusher bar 80 is held at the uppermost position (refer to FIG. 6).

When the moving body 40 is moved from the position P13 to the position P2, since the displacement of the cam follower 72 is maintained at the first reference value by the opening and closing operation cam 120, the position of the opening and closing operation lever 70 is The opening and closing operation cam 120 is held. Thereby, the cooker mechanism 50 is kept in an open state (refer to FIG. 3).

8. Effects, advantages

In the above embodiments, the following effects and advantages are obtained.

(1) Although the cooker mechanism 50 and the pusher bar 80 are used in the pickup machine 30, the suction nozzle is not employed. When the wafer 2 held by the cooker mechanism 50 is pushed down by the pusher bar 80, the wind pressure against the crucible 21 and the bore 22 does not occur. Therefore, powder scattering in the pupil 22 can be suppressed.

(2) In the section from the position P9 to the position P11, since the wafer 2 is supported by the cookware mechanism 50 only by the slight frictional force without using the elastic force of the urging spring 63, even if the wafer 2 is at the position P10 The vicinity of the rod 80 is pushed down, and the wafer 2 can still be stabilized. The posture fell.

(3) The pickup machine 30 moves linearly from the position P9 to the position P11. At this time, even if the holding force of the wafer 2 is released, the wafer 2 can be prevented from being detached from the pickup claws 53, 58.

In particular, since the pickup 30 is moving at a constant speed, the inertial force does not act on the wafer 2. Therefore, the wafer 2 can be prevented from being detached from the pickup claws 53, 58.

(4) From the position P2 to the position P5, the wafer 2 is held by the cooker mechanism 50 while being supported by the pusher bar 80. Therefore, scattering of the wafer 2 can be prevented.

(5) After the wafer 2 is restrained by the lower end of the pusher bar 80 in the vicinity of the position P2, the pusher bar 80 is blocked from the lift operation cam 130. Therefore, even if an error or a variation occurs in the thickness of the wafer 2, the wafer 2 can be suppressed by an appropriate force.

9. Change example

The embodiments of the present invention have been described above, but the above embodiments are intended to facilitate the understanding of the present invention and are not intended to limit the scope of the invention. Modifications and improvements can be made without departing from the spirit of the invention, and the invention also includes equivalents thereof. The points of change from the above embodiments will be described below. It is also possible to apply the respective change points described below in combination. The following modifications (1) to (7) are the same as those of the above-described embodiment except for the points of change described below, and thus the descriptions other than the points of change are omitted.

(1) In the above embodiment, the adjacent pickers 30 are coupled by the joint slip ring 31. For this, the multi-pickup machine 30 may be connected by a loop leather belt. In this case, instead of the sprocket 142, a pulley can be provided, and the endless belt can be rotated by the pulley.

(2) The action between the operation lever 61 and the left end surface 56b of the movable base portion 56 may be equal to the diameter of the pressure roller 71. In this case, when the moving body 40 reaches the position P9, the pressure roller 71 comes into contact with the arm portion 57, and the operation lever 61 abuts against the left end surface 56b of the movable base portion 56.

(3) The diameter of the lifting roller 97 is almost equal to the interval between the upper tab 104a and the lower tab 104b of the receiving member 104, and the lifting roller 97 is held by the upper tab 104a and the lower tab 104b. It can also be between. In this case, when the moving body 40 reaches the position P3 (the point at which the displacement of the cam follower 102 reaches the second predetermined value), the lower end of the push rod 80 abuts against the wafer 2.

(4) In the above embodiment, the traveling guide 110 has an elliptical shape, and the walking section 110b is linear. As shown in FIG. 11, the parallel section 110b may be an arcuate shape that is concave toward the inner side of the traveling guide 110. In this case, the arc-shaped section which is a part of the closed path of the track of the crucible 21 is the parallel section 110b which is arranged in parallel with the traveling guide 110. Further, the crucible 21 is moved along the circle by the crucible feeding device 23, and the closed path which becomes the locus of the crucible 21 is preferably a circular shape.

(5) In the above embodiment, the traveling guide 110 is a rail member, and the moving body 40 is configured to travel on the traveling guide 110. for The fixed groove cam member is disposed under the picker row 3, and the guide groove is recessed in the fixed groove cam member. As seen from above, the guide groove is formed into a uniform shape with the planar shape of the walking guide 110 or Similar shapes are also possible. In this case, instead of the traveling rollers 42, 43 being provided on the lower surface of the moving body 40 (particularly, the mounting frame 41), the sliding member formed of a pin or the like is provided on the moving body 40 (for example, protrudingly protruding downward). In particular, the mounting frame 41) has its sliding member inserted into the guide groove. In this case, since the movement of the sliding member in the width direction of the guide groove is restricted by the guide groove, the movable body 40 travels along the guide groove together with the sliding member.

(6) In the above embodiment, the running section 110a and the running section 110b of the traveling guide 110 are longer than the conveying section 110c and the return section 110d. The length of the parallel section 110a and the parallel section 110b may be equal to or less than the length of the transport section 110c and the return section 110d.

(7) In the above embodiment, the adjacent pick-up machines 30 are coupled by the joint slip ring 31, and the power of the motor 141 for revolving the motion driving device 140 is driven by the drive sprocket 141 and the pin 143. The power of the revolving motion of the pickup machine 30 is configured to be driven toward the pickup machine 30. The revolving motion driving device 140 may be changed to the revolving motion driving device 140A as shown in the plan view of Fig. 12 . Hereinafter, the wrap motion driving device 140A will be described in detail. However, since the change points in the modified examples (4) to (6) are also used in the first place, the first description will be given. Moreover, in order to make it easy to see the multi-pickup machine 30 arranged in the circumferential direction, in the twelfth figure, the opening and closing operation cam 120 and the lifting operation The illustration of the cam 130 is omitted.

In the description of the modification of the above (4), the parallel section 110b is an arcuate shape that is concave toward the inside of the traveling guide 110, and an arcuate section that is a part of the closed path of the rail of the crucible 21 is juxtaposed on the walking. The parallel section 110b of the guide 110 is moved along the circle by the feed device 23, and the closed path of the trajectory of the cymbal 21 is circular. Further, as described in the modification of the above (6), the running section 110a and the running section 110b of the traveling guide 110 are longer than the conveyance section 110c and the return section 110d. Therefore, the number of the pickups 30 is the case of Fig. 12 is less than that of the first figure or the eleventh figure, and the radius of the circular trajectory of the 臼21 is the case of Fig. 12 than the first figure or the eleventh The picture is shorter. Therefore, a small and low-cost device can be provided.

As described in the modification of the above (5), the moving body 40 of the pickup machine 30 is guided in the circumferential direction by the guide groove 116 having a shape similar to that of the traveling guide 110. Specifically, as shown in Fig. 13, one end portion of the rod 45 is fixed to the moving body 40 of the pickup 30, and the rod 45 is extended from the moving body 40 toward the opposite side of the fixed cooker claw 53. As shown in Fig. 12, the sliding member 46 is protruded downward at the other end portion of the rod 45, and the sliding member 46 is inserted into the guide groove 116, and the movement of the sliding member 46 in the width direction of the guide groove 116 is borrowed. It is restrained by the guide groove 116. Here, a fixed groove cam member 115 is provided below the rotary disk 143A to be described later, and a guide groove 116 is formed in the fixed groove cam member 115. As seen from above, the guide groove 116 and the travel guide 110 are arranged concentrically. . The section 116a, the section 116b, and the section 116c of the guide groove 116 The return section 116d is a parallel section 111a, a parallel section 111b, a conveyance section 111c, and a return section 111d corresponding to the travel guide 111.

Next, the wrap motion driving device 140A will be described in detail. The revolving motion driving device 140A has a motor 141A and a rotating disk 143A. The output shaft 142A of the motor 141A is coupled to the rotary disk 143A, and the rotary disk 143A is rotationally driven by the motor 141A. In the rotary disk 143A, the plurality of bars 45 are radially mounted around the output shaft of the motor 141A. These rods 45 are movably provided in the radial direction of the output shaft of the motor 141A by a linear bearing or the like. Therefore, when the rotary disk 143A is rotated, the moving body 40 and the bar 45 of the pickup 30 are rotated around the output shaft of the motor 141A, and the diameter of the corresponding guide groove 116 and the traveling guide 110 toward the output shaft of the motor 141A. Directional displacement. Thereby the moving body 40 is traveling along the walking guide 110.

Further, since the moving body 40 is guided by the guide groove 116, the traveling guide 110 may not be provided.

1‧‧‧ wafer transfer device

2‧‧‧ wafer

3‧‧‧ picker column

10‧‧‧First carrier

11‧‧‧Land

12‧‧‧Support

13‧‧‧Motor

20‧‧‧Processing machine

21‧‧‧臼

22‧‧‧臼孔

23‧‧‧臼 Feeding device

24‧‧‧Second carrier

30‧‧‧ Pickup Machine

110‧‧‧Travel guides

110a‧‧‧Linear and interval

110b‧‧‧Linear and interval

110c‧‧‧ semi-arc conveying section

110d‧‧‧ semi-arc return interval

120‧‧‧Opening and closing action cam

130‧‧‧ Lifting cam (second cam)

140‧‧‧Rotary motion drive

141‧‧ ‧motor

142‧‧‧Sprocket

P1~P13, P21~P23‧‧‧ position

Claims (12)

A wafer transfer device is a wafer transfer device that transfers a wafer transported by a first transporter to a second transporter, and has a shape that forms a closed path as seen from above, and has the first transport a first parallel section in which the transport path of the machine is arranged, a guide having a second parallel section parallel to the transport path of the second transporter; and a moving body that moves along the guide; and the moving body a cooker mechanism that is openable and closable in a lateral direction; and an opening and closing operation cam that opens and closes the cookware mechanism along the guide; the moving body is the aforementioned one of the guides on the first conveyor side When the first parallel movement is moved, the opening and closing operation cam closes the cookware mechanism, and the cookware mechanism holds the wafer conveyed by the first transporter. The wafer transfer device according to the first aspect of the invention, further comprising: a propelling portion that is provided on the movable body and that is movable up and down so as to be held at a position of the wafer of the cookware mechanism; The guide member is provided with a lifting/lowering cam for lifting and lowering the propulsion portion; and when the moving body moves in the second parallel portion of the second conveyor side of the guide, the lifting and lowering cam is to advance the The portion is lowered, and the pushing portion is pushed down by the wafer held by the cooker mechanism. The wafer transfer device according to claim 2, further comprising: a holding force generating mechanism provided in the cooker mechanism to apply a holding force to the cookware mechanism, wherein the movable body is in the guide When the first parallel movement section moves on the side of the conveyor, the opening and closing operation cam generates a holding force by the holding force generating mechanism, and the wafer is held by the cookware mechanism by the holding force, and the moving body is When the first parallel movement section on the first conveyor side moves toward the second parallel section on the second conveyor side, the opening and closing operation cam is a state in which the holding force of the gripping force generating mechanism is maintained and the aforementioned state In the closed state of the cooker mechanism, when the moving body moves in the second parallel section on the second conveyor side among the guides, the opening and closing operation cam holds the closed state of the cookware mechanism. After reducing the holding force of the holding force generating mechanism, the lowering of the pushing portion and the wafer generated by the lifting and lowering cam are performed. Push down. The wafer transfer device according to claim 2, wherein when the cooker mechanism is closed by the opening and closing operation cam, the lifting and lowering cam lowers the pushing portion, and the pushing portion is borrowed The wafer is supported by the upper side of the wafer conveyed by the first conveyor. The wafer transfer device according to the first aspect of the invention, further comprising: a propelling portion that is provided on the movable body and that is movable up and down so as to be held at a position of the wafer of the cookware mechanism; The guide member is provided with a lifting and lowering cam for raising and lowering the pushing portion; when the cooker mechanism is closed by the opening and closing operation cam, the lifting and lowering cam lowers the pushing portion, and the pushing portion is used by The wafer is supported above the wafer on which the first conveyor is transported. In the wafer transfer device of the first aspect of the invention, the downstream portion of the first parallel section of the transport path of the first transporter is inclined downward toward the downstream side. A picker that moves along a closed path, and the pick-up machine that picks up the wafer includes: a moving body that moves along the closed path; and the moving body that is openably and closably disposed in the lateral direction, by being closed And the cookware mechanism that holds the aforementioned wafer. The pick-up machine of claim 7, further comprising: a gripping force generating mechanism provided to the cooker mechanism to impart a holding force to the cookware mechanism that holds the wafer. The picking machine of claim 8 wherein the aforementioned cookware mechanism has: a fixed base portion fixed to the movable body; and a fixed cooker claw extending from the fixed base portion; and a movable base portion rotatably provided on the fixed base portion; and the movable base Extending out, the rotation of the movable base portion is coupled to the fixed jaw, and the wafer is inserted into the movable jaw of the fixed jaw by approaching the fixed jaw; the holding force occurs The mechanism includes: an operating lever that is rotatably provided on the movable base portion to engage an end surface of the movable base portion; and a working lever that faces the working lever toward the movable base The pressing portion of the front end that is urged by the end face. The pickup machine according to claim 9, further comprising: an intermediate portion being an opening/closing operation lever that is coupled to the fixed base portion and rotatably provided around the intermediate portion; and an opening and closing operation lever provided on the opening and closing operation lever a crimping portion at one end; a cam follower provided to be in contact with the cam at the other end of the opening and closing lever; and a closing of the opening and closing lever to press the cam follower toward the cam The armor mechanism further includes an arm portion provided in the movable base portion at a position away from the action operating lever toward the fixed base portion side, wherein the crimping portion is inserted into the arm portion and The aforementioned action lever The pressing portion is urged from the side of the operating lever toward the side of the arm by the closing and pressing portion. The pick-up machine of claim 10, wherein an interval between the action lever and the arm portion when the action lever is in contact with the end surface of the movable base portion is larger than a diameter of the crimp portion Bigger. The pick-up machine according to claim 7, further comprising: a pushing unit; and the moving body, wherein the pushing unit guides the pushing unit so as to be held at a position of the wafer of the cooker mechanism a guiding mechanism for guiding, and a lower pressing portion for guiding the pushing portion downward by the guiding mechanism; and a lifting portion that is guided up and down by the guiding mechanism together with the pushing portion; a lifting member that is vertically movably supported by the lifting portion; a lifting and lowering lever that is vertically movable with the receiving member; and a second cam that is disposed on the lifting and lowering lever and that is in contact with the second cam a follower; and pushing the second cam follower toward the second cam by pushing the lift lever, and by pushing the receiving member The receiving member is a second pressing portion that is pressed toward the lifting portion.