TW201729656A - 製造印刷電路板所使用積層板之修改方法 - Google Patents

製造印刷電路板所使用積層板之修改方法 Download PDF

Info

Publication number: TW201729656A
Authority: TW; Taiwan
Prior art keywords: laminate; printed circuit; copper; weight; circuit board
Prior art date: 2015-11-13

Application number

TW105136579A

Other languages

English (en)

Chinese (zh)

Inventor

沃伊切赫斯多喜

亞瑟斯庫

Original Assignee

斯庫系統太陽能股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2015-11-13

Filing date

2016-11-10

Publication date

2017-08-16

2016-11-10 Application filed by 斯庫系統太陽能股份有限公司 filed Critical 斯庫系統太陽能股份有限公司

2017-08-16 Publication of TW201729656A publication Critical patent/TW201729656A/zh

Links

238000000034 method Methods 0.000 title claims abstract description 106
238000004519 manufacturing process Methods 0.000 title claims abstract description 25
238000012986 modification Methods 0.000 title abstract description 4
230000004048 modification Effects 0.000 title abstract description 4
239000000654 additive Substances 0.000 claims abstract description 33
239000000126 substance Substances 0.000 claims abstract description 20
230000000996 additive effect Effects 0.000 claims abstract description 16
229920005989 resin Polymers 0.000 claims abstract description 16
239000011347 resin Substances 0.000 claims abstract description 16
238000011161 development Methods 0.000 claims abstract description 6
239000010949 copper Substances 0.000 claims description 48
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 47
229910052802 copper Inorganic materials 0.000 claims description 45
229910010413 TiO 2 Inorganic materials 0.000 claims description 19
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
238000001994 activation Methods 0.000 claims description 13
239000011941 photocatalyst Substances 0.000 claims description 13
229910052751 metal Inorganic materials 0.000 claims description 12
239000002184 metal Substances 0.000 claims description 12
239000010936 titanium Substances 0.000 claims description 10
229910052719 titanium Inorganic materials 0.000 claims description 10
230000004913 activation Effects 0.000 claims description 9
230000005855 radiation Effects 0.000 claims description 9
238000001035 drying Methods 0.000 claims description 7
239000000463 material Substances 0.000 claims description 7
229920001187 thermosetting polymer Polymers 0.000 claims description 7
KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 6
WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 6
229910052797 bismuth Inorganic materials 0.000 claims description 5
229910052710 silicon Inorganic materials 0.000 claims description 5
229910052721 tungsten Inorganic materials 0.000 claims description 5
229910052725 zinc Inorganic materials 0.000 claims description 5
229910000365 copper sulfate Inorganic materials 0.000 claims description 4
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 4
238000007772 electroless plating Methods 0.000 claims description 4
239000003822 epoxy resin Substances 0.000 claims description 4
XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
239000000203 mixture Substances 0.000 claims description 4
150000002940 palladium Chemical class 0.000 claims description 4
229920002120 photoresistant polymer Polymers 0.000 claims description 4
229920000647 polyepoxide Polymers 0.000 claims description 4
ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical group N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 claims description 3
239000003795 chemical substances by application Substances 0.000 claims description 3
150000001879 copper Chemical class 0.000 claims description 3
239000002657 fibrous material Substances 0.000 claims description 3
238000000465 moulding Methods 0.000 claims description 3
SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 2
NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
239000004925 Acrylic resin Substances 0.000 claims description 2
230000003213 activating effect Effects 0.000 claims description 2
238000000576 coating method Methods 0.000 claims description 2
239000005011 phenolic resin Substances 0.000 claims description 2
229920001568 phenolic resin Polymers 0.000 claims description 2
238000003384 imaging method Methods 0.000 claims 1
238000007654 immersion Methods 0.000 claims 1
BYGOPQKDHGXNCD-UHFFFAOYSA-N tripotassium;iron(3+);hexacyanide Chemical compound [K+].[K+].[K+].[Fe+3].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] BYGOPQKDHGXNCD-UHFFFAOYSA-N 0.000 claims 1
GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 abstract description 22
230000003197 catalytic effect Effects 0.000 abstract description 9
239000000243 solution Substances 0.000 description 14
239000002131 composite material Substances 0.000 description 7
239000002245 particle Substances 0.000 description 7
238000007747 plating Methods 0.000 description 7
239000004408 titanium dioxide Substances 0.000 description 7
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
239000000758 substrate Substances 0.000 description 6
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
230000015572 biosynthetic process Effects 0.000 description 5
238000005520 cutting process Methods 0.000 description 5
238000009713 electroplating Methods 0.000 description 5
239000003989 dielectric material Substances 0.000 description 4
230000000694 effects Effects 0.000 description 4
230000001699 photocatalysis Effects 0.000 description 4
QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
239000001257 hydrogen Substances 0.000 description 3
229910052739 hydrogen Inorganic materials 0.000 description 3
239000001301 oxygen Substances 0.000 description 3
229910052760 oxygen Inorganic materials 0.000 description 3
229920000642 polymer Polymers 0.000 description 3
OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
229910015902 Bi 2 O 3 Inorganic materials 0.000 description 2
UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
-1 Potassium ferricyanide Chemical compound 0.000 description 2
229910004298 SiO 2 Inorganic materials 0.000 description 2
239000012190 activator Substances 0.000 description 2
239000003054 catalyst Substances 0.000 description 2
239000011889 copper foil Substances 0.000 description 2
238000000151 deposition Methods 0.000 description 2
238000005516 engineering process Methods 0.000 description 2
239000000945 filler Substances 0.000 description 2
239000007789 gas Substances 0.000 description 2
239000011521 glass Substances 0.000 description 2
230000005291 magnetic effect Effects 0.000 description 2
239000002923 metal particle Substances 0.000 description 2
239000002105 nanoparticle Substances 0.000 description 2
229910052763 palladium Inorganic materials 0.000 description 2
230000035945 sensitivity Effects 0.000 description 2
238000012360 testing method Methods 0.000 description 2
XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 2
TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
239000004593 Epoxy Substances 0.000 description 1
MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
206010034972 Photosensitivity reaction Diseases 0.000 description 1
229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
230000001133 acceleration Effects 0.000 description 1
239000012298 atmosphere Substances 0.000 description 1
239000012267 brine Substances 0.000 description 1
239000003093 cationic surfactant Substances 0.000 description 1
238000004140 cleaning Methods 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
230000006835 compression Effects 0.000 description 1
238000007906 compression Methods 0.000 description 1
238000005238 degreasing Methods 0.000 description 1
230000008021 deposition Effects 0.000 description 1
239000006185 dispersion Substances 0.000 description 1
238000005553 drilling Methods 0.000 description 1
230000009977 dual effect Effects 0.000 description 1
239000003792 electrolyte Substances 0.000 description 1
238000000265 homogenisation Methods 0.000 description 1
150000002431 hydrogen Chemical class 0.000 description 1
229910052738 indium Inorganic materials 0.000 description 1
238000009776 industrial production Methods 0.000 description 1
150000002500 ions Chemical class 0.000 description 1
229910044991 metal oxide Inorganic materials 0.000 description 1
150000004706 metal oxides Chemical class 0.000 description 1
238000002715 modification method Methods 0.000 description 1
230000006911 nucleation Effects 0.000 description 1
238000010899 nucleation Methods 0.000 description 1
238000012856 packing Methods 0.000 description 1
PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
230000005298 paramagnetic effect Effects 0.000 description 1
230000036211 photosensitivity Effects 0.000 description 1
239000000049 pigment Substances 0.000 description 1
239000011148 porous material Substances 0.000 description 1
238000002360 preparation method Methods 0.000 description 1
238000011112 process operation Methods 0.000 description 1
239000012266 salt solution Substances 0.000 description 1
HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
235000015096 spirit Nutrition 0.000 description 1
239000001119 stannous chloride Substances 0.000 description 1
235000011150 stannous chloride Nutrition 0.000 description 1
YONPGGFAJWQGJC-UHFFFAOYSA-K titanium(iii) chloride Chemical compound Cl[Ti](Cl)Cl YONPGGFAJWQGJC-UHFFFAOYSA-K 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0236—Plating catalyst as filler in insulating material
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/125—Inorganic compounds, e.g. silver salt
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Manufacturing Of Printed Wiring (AREA)
Laminated Bodies (AREA)
Chemically Coating (AREA)

TW105136579A 2015-11-13 2016-11-10 製造印刷電路板所使用積層板之修改方法 TW201729656A (zh)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
PL414778A PL414778A1 (pl)	2015-11-13	2015-11-13	Sposób modyfikacji laminatów stosowanych do wytwarzania obwodów drukowanych

Publications (1)

Publication Number	Publication Date
TW201729656A true TW201729656A (zh)	2017-08-16

Family

ID=57681709

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW105136579A TW201729656A (zh)	2015-11-13	2016-11-10	製造印刷電路板所使用積層板之修改方法

Country Status (4)

Country	Link
AR (1)	AR106668A1 (pl)
PL (1)	PL414778A1 (pl)
TW (1)	TW201729656A (pl)
WO (1)	WO2017082744A1 (pl)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN117623812A (zh) *	2023-02-10	2024-03-01	上海交通大学	一种氮化铝基覆铜板及其制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4666735A (en) *	1983-04-15	1987-05-19	Polyonics Corporation	Process for producing product having patterned metal layer
IES990569A2 (en)	1998-07-17	2000-07-12	Procter & Gamble	Detergent tablet
JP2007027312A (ja) *	2005-07-14	2007-02-01	Fujifilm Holdings Corp	配線基板の製造方法および配線基板
US7468175B2 (en)	2006-12-13	2008-12-23	Worthington Technologies, Llc	Highly photosensitive titanium dioxide and process for forming the same
EP2165583A4 (en) *	2007-06-18	2012-05-16	Technologies Llc Vectraone	AUTOMATED DIRECT EMULSION PROCESS FOR THE MANUFACTURE OF PCB AND MULTILAYER PCB
US10148006B2 (en) *	2012-09-14	2018-12-04	Mitsubishi Engineering-Plastics Corporation	Thermoplastic resin composition, resin molded article, and method for manufacturing resin molded article having a plated layer

2015
- 2015-11-13 PL PL414778A patent/PL414778A1/pl unknown
2016
- 2016-11-08 WO PCT/PL2016/000122 patent/WO2017082744A1/en not_active Ceased
- 2016-11-10 TW TW105136579A patent/TW201729656A/zh unknown
- 2016-11-11 AR ARP160103453A patent/AR106668A1/es unknown

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN117623812A (zh) *	2023-02-10	2024-03-01	上海交通大学	一种氮化铝基覆铜板及其制备方法
CN117623812B (zh) *	2023-02-10	2026-03-24	上海交通大学	一种氮化铝基覆铜板及其制备方法

Also Published As

Publication number	Publication date
PL414778A1 (pl)	2017-05-22
AR106668A1 (es)	2018-02-07
WO2017082744A4 (en)	2017-06-29
WO2017082744A1 (en)	2017-05-18

Publication	Publication Date	Title
EP0787224B1 (de)	1998-09-16	Verfahren zur abscheidung von metallschichten
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