TW201800438A - 環氧樹脂、硬化性樹脂組成物及其硬化物 - Google Patents

環氧樹脂、硬化性樹脂組成物及其硬化物 Download PDF

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Publication number
TW201800438A
TW201800438A TW106104886A TW106104886A TW201800438A TW 201800438 A TW201800438 A TW 201800438A TW 106104886 A TW106104886 A TW 106104886A TW 106104886 A TW106104886 A TW 106104886A TW 201800438 A TW201800438 A TW 201800438A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
resin
epoxy
group
resin composition
Prior art date
Application number
TW106104886A
Other languages
English (en)
Chinese (zh)
Inventor
高橋歩
秋元源祐
Original Assignee
迪愛生股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 迪愛生股份有限公司 filed Critical 迪愛生股份有限公司
Publication of TW201800438A publication Critical patent/TW201800438A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW106104886A 2016-02-23 2017-02-15 環氧樹脂、硬化性樹脂組成物及其硬化物 TW201800438A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2016-032057 2016-02-23
JP2016032057 2016-02-23

Publications (1)

Publication Number Publication Date
TW201800438A true TW201800438A (zh) 2018-01-01

Family

ID=59685577

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106104886A TW201800438A (zh) 2016-02-23 2017-02-15 環氧樹脂、硬化性樹脂組成物及其硬化物

Country Status (3)

Country Link
JP (1) JP6900949B2 (fr)
TW (1) TW201800438A (fr)
WO (1) WO2017145772A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112236477A (zh) * 2018-09-21 2021-01-15 Dic株式会社 树脂组合物、硬化物及层叠体

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114945268B (zh) * 2021-02-15 2025-11-21 拓自达电线株式会社 电磁波屏蔽膜和带电磁波屏蔽膜印刷布线板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61112066A (ja) * 1984-11-05 1986-05-30 Dainippon Ink & Chem Inc エポキシ樹脂の製法
JPS63174981A (ja) * 1987-01-14 1988-07-19 Yuka Shell Epoxy Kk エポキシ化合物の精製方法
JP2874547B2 (ja) * 1994-03-24 1999-03-24 住友化学工業株式会社 エポキシ樹脂の製造方法
JP4496441B2 (ja) * 1999-07-28 2010-07-07 Ｄｉｃ株式会社 高純度エポキシ樹脂の製造方法
JP2004131636A (ja) * 2002-10-11 2004-04-30 Dainippon Ink & Chem Inc エポキシ樹脂組成物、プリプレグ及びその硬化物
JP2008074898A (ja) * 2006-09-19 2008-04-03 Nippon Kayaku Co Ltd エポキシ樹脂組成物
WO2015146504A1 (fr) * 2014-03-25 2015-10-01 Dic株式会社 Résine époxy, procédé de production de résine époxy, composition de résine durcissable et produit durci de celle-ci, matériau composite renforcé par des fibres et article moulé

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112236477A (zh) * 2018-09-21 2021-01-15 Dic株式会社 树脂组合物、硬化物及层叠体

Also Published As

Publication number Publication date
WO2017145772A1 (fr) 2017-08-31
JP6900949B2 (ja) 2021-07-14
JPWO2017145772A1 (ja) 2018-12-13

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