TW201906009A - Film forming device - Google Patents

Abstract

The present invention discloses a film forming device comprising: a container capable of storing a substrate therein; an exhaust mechanism capable of exhausting the inside of the container to a vacuum state; a storage mechanism that stores a solution; a nozzle capable of discharging the solution onto the substrate; and a heating mechanism capable of heating the nozzle and/or the inside of the container. This film forming device makes it possible to reduce or remove liquid traces formed during film forming on the substrate.

Description

 Film forming device  

The present invention relates to the field of film formation, and more particularly to a film forming apparatus.

A wet method such as a coating method or a dipping method is known as a film forming method for forming a thin film, for example, an organic film or an inorganic film, on the surface of a substrate. For example, Patent Document 1 proposes a film forming method in which a mark (scratch) having a depth of 10 to 400 nm is formed on a surface of a substrate such as glass or plastic in the atmosphere to have a stripe having a predetermined direction. A fine uneven surface of a shape is formed, and then a coating liquid (diluted solution) prepared by a predetermined composition is applied and dried to form an antifouling film (organic film) having a predetermined composition on the fine uneven surface. Further, Patent Document 2 proposes a film forming method in which a titanium oxide particle is mixed in water to form a suspension, and further adjusted to a specific pH, the suspension is applied onto a support and dried, and This forms an inorganic titanium oxide film (inorganic film).

The coating liquid and the suspension used in the wet method use a dilute solution having a low solute concentration. Therefore, the density of the film obtained after heat drying is low, and there is a problem that the function of the formed film is likely to disappear. For example, in the antifouling film coated by the wet method, the film formed on the outermost surface is easily scraped off by wiping, and the oil repellency sometimes disappears.

On the other hand, a film forming method of forming a thin film on a substrate by a vacuum deposition method (dry method) is also considered. When this method is used, it is necessary to form a high vacuum condition at the time of film formation, and an expensive vacuum exhaust system is required. As a result, it is difficult to achieve film formation at a low cost.

Prior art literature

Patent Document 1: Japanese Patent Laid-Open No. Hei 9-309745

Patent Document 2: Japanese Patent Laid-Open No. Hei 6-293519

In order to solve the above problems, the Chinese patent application "2015800002404" proposes a film forming method and a film forming apparatus, and a film forming method and a film forming apparatus of the film include a solution containing two or more materials based on each material constituting the solution. The vapor pressure is applied to the substrate under the pressure of the set pressure to form a film, which not only improves the durability of the film, but also reduces the manufacturing cost. In this patent application, the film-forming material in the solution is discharged to the substrate under the action of a nozzle to form a film, and other materials in the solution are rapidly vaporized when entering the container, thereby being separated from the film-forming material and not participating in the formation. The film, in turn, forms a film with better durability.

However, when the substrate is taken after film formation, it is found that the liquid trace 200 as shown in FIG. 2 is present on the substrate, which causes contamination of the substrate on which the thin film is formed. To remove the liquid trace 200, it is necessary to erase by manual or mechanical means. Not only does it increase manufacturing costs, but it also reduces production efficiency and sometimes affects film quality.

According to the above problems, the inventors have conducted many tests and analysis and found that other materials in the solution are rapidly vaporized when entering the container, which ensures that the film can be formed solely from the film-forming material without being contaminated. However, other materials absorb a large amount of heat during the gasification process, causing the temperature around the gasification position to be low, causing some of the liquid to condense at a lower temperature, and finally forming droplets on the substrate to form a liquid in the container. Trace 200.

Considering that most of the material just enters the container and gasification occurs, the gasification phenomenon is carried out in the vicinity of the nozzle, so that the temperature of the nozzle and its surroundings is low, so that some of the liquid will gradually condense in the vicinity of the nozzle, and finally the liquid is formed. The droplets fall on the substrate to form a liquid track 200.

In view of the above technical problems, it is necessary for the present invention to provide a film forming apparatus capable of reducing or eliminating liquid traces formed by a substrate during film formation.

The present invention achieves the above object of the invention by the following technical solutions: a film forming apparatus comprising: a container capable of accommodating a substrate therein; an exhaust mechanism capable of exhausting the inside of the container to a vacuum state; a storage mechanism of the storage solution; Discharging the solution to a nozzle on the substrate; a heating mechanism capable of heating the nozzle and/or the interior of the container.

As a preferred embodiment, the heating mechanism is disposed in the container.

As a preferred embodiment, the heating mechanism is disposed adjacent to the nozzle.

As a preferred embodiment, the heating mechanism comprises a resistance wire.

As a preferred embodiment, a temperature measuring mechanism is further included which is capable of measuring the temperature of the nozzle or the inside of the container.

As a preferred embodiment, the temperature measuring mechanism is located inside the container and is disposed on the nozzle.

As a preferred embodiment, there is further included a temperature adjustment mechanism coupled to the heating mechanism that is capable of adjusting the amount of heating temperature provided by the heating mechanism.

As a preferred embodiment, the controller further includes a controller connected to the heating mechanism, wherein the controller is capable of controlling the heating mechanism to be heated to the first set temperature and after the nozzle starts to spray after the nozzle starts to spray The heating mechanism is controlled to be heated to a second set temperature.

As a preferred embodiment, the second set temperature is higher than the first set temperature.

As a preferred embodiment, the heating mechanism has a heating temperature of ±100 ° C of the boiling point of the solvent in the solution at normal temperature and normal pressure.

In the present invention, the heating mechanism can heat the nozzle and/or the inside of the container to compensate for the heat loss caused by the vaporization of the non-film forming material, and prevent the condensation liquid from dripping on the substrate due to the decrease in the temperature inside the container. Trace problem.

Specific embodiments of the present invention are disclosed in detail, with reference to the following description and drawings, which illustrate the manner in which the principles of the invention may be employed. It should be understood that the embodiments of the invention are not limited in scope. The embodiments of the present invention include many variations, modifications, and equivalents within the scope of the spirit and scope of the appended claims.

Features described and/or illustrated with respect to one embodiment may be used in the same or similar manner in one or more other embodiments, in combination with, or in place of, features in other embodiments.

It should be emphasized that the term "comprising" or "comprises" or "comprising" or "comprising" or "an"

1‧‧‧ film forming device

10‧‧‧heating mechanism

11‧‧‧ Container

13‧‧‧ Pipes

14‧‧‧ Temperature measuring mechanism

15‧‧‧Exhaust mechanism

16‧‧‧ Controller

17‧‧‧Nozzles

18‧‧‧ Pressure detection unit

19‧‧‧Exporting Department

21‧‧‧Storage solution

23‧‧‧Storage agency

25‧‧‧ Infusion tube

27‧‧‧ gas pipeline

29‧‧‧ gas supply

31‧‧‧Substrate support

33‧‧‧roll

100‧‧‧Substrate

200‧‧‧ liquid traces

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description of the embodiments or the description of the prior art will be briefly introduced. Obviously, the illustrations in the following description are only Some embodiments of the invention may be further illustrated by those skilled in the art based on these illustrations without the inventive labor.

FIG. 1 is a schematic structural view of a film forming apparatus according to an embodiment of the present invention.

Fig. 2 is a picture of a substrate after film formation by a conventional film forming apparatus.

Fig. 3 is a picture of a substrate after film formation using the film forming apparatus of the present invention.

In order to make those skilled in the art better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described in the following with reference to the embodiments in the embodiments of the present invention. The embodiments are only a part of the embodiments of the invention, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of the present invention.

It should be noted that when an element is referred to as being "disposed on" another element, it may be directly on the other element or the element may be present. When an element is considered to be "connected" to another element, it can be directly connected to the other element or. The terms "vertical," "horizontal," "left," "right," and the like, as used herein, are for the purpose of illustration and are not intended to be the only embodiment.

All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. The terminology used in the description of the present invention is for the purpose of describing particular embodiments and is not intended to limit the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Please refer to FIG. 1 , which is a schematic structural view of a film forming apparatus 1 according to an embodiment of the present invention. In the present embodiment, the film forming apparatus 1 includes: a container 11 capable of accommodating the substrate 100 therein; an exhaust mechanism 15 capable of exhausting the inside of the container 11 to a vacuum state; a storage mechanism 23 of the storage solution 21; The solution 21 can be discharged to the nozzle 17 on the substrate 100; a heating mechanism 10 capable of heating the nozzle 17 and/or the inside of the container 11.

In the present embodiment, the container 11 has a vacuum chamber that houses the substrate 100 as a film formation object, thereby providing a vacuum environment for film formation. In the present embodiment, the container 11 may be a substantially rectangular parallelepiped hollow body, but the invention is not limited to this shape, and accordingly, the shape of the vacuum chamber may be matched with the container 11 to provide a preferred film formation. space. Of course, the shape of the vacuum chamber in the present invention is not limited to this point.

In the present embodiment, the container 11 may be provided with an exhaust mechanism 15 communicating with the inside (vacuum chamber), and the exhaust mechanism 15 sucks out the gas in the container 11 by suction, thereby maintaining the air pressure in the container 11 Need value.

Specifically, the exhaust mechanism 15 may be a vacuum pump 15. An exhaust port (not shown) for exhausting may be provided in the vicinity of the lower end of the side wall of the container 11. The exhaust port may be connected to one end of the pipe 13, and the other end of the pipe 13 is connected to the vacuum pump 15.

In the present embodiment, the vacuum pump 15 may be a pump capable of producing a vacuum state of about atmospheric pressure to medium vacuum (0.1 Pa to 100 Pa), for example, a rotary pump (oil rotary vacuum pump). Although a turbo molecular pump (TMP), an oil diffusion pump, or the like can produce a vacuum state of a high vacuum (less than 0.1 Pa), it is not necessary to use a pump that introduces a high cost. Therefore, in the present embodiment, the apparatus can be made inexpensive.

The vacuum pump 15 is operated in accordance with an instruction from the controller 16 (control unit), and the degree of vacuum (pressure) in the container 11 is lowered by the pipe. The container 11 is provided with a pressure detecting unit 18 (for example, a pressure gauge or the like) that detects the pressure inside the container 11. The information of the pressure in the container 11 detected by the pressure detecting unit 18 is sequentially output to the controller 16. When the controller 16 determines that the pressure in the container 11 has reached a predetermined value, it transmits an operation command to the gas supply source 29 (see below).

In addition, for example, a flow rate adjustment unit such as a mass flow controller (Mass Flow Controller: MFC) is monitored under the supervision of a pressure control unit (not shown) such as an automatic pressure controller (APC). The gas inside the container 11 can be controlled by introducing a gas such as argon into the container. Further, it is also possible to adopt a configuration in which a valve (not shown) is provided in a line connecting the exhaust port of the container 11 and the pipe of the pump, and the pressure in the container 11 is controlled by adjusting the opening degree of the valve in a state in which the pump is operated. .

In the present embodiment, the nozzle 17 as a member for discharging the solution 21 may be disposed at the top of the container 11, so that the solution 21 is sprayed from the top to the bottom. Of course, the position of the nozzle 17 is not fixed, and it is only necessary to arrange the nozzle 17 so that the solution 21 can be discharged downward (vertically downward or obliquely downward).

Specifically, one end of the nozzle 17 is inserted downward above the inside of the container 11, and the other end of the nozzle 17 can be exposed outside the container 11. The nozzle 17 existing inside the container 11 has a discharge portion 19 at one end. It should be noted that the number (number) of the nozzles 17 inserted into the container 11 is not limited. Depending on the size of the container 11, two or more nozzles 17 are sometimes used in the single container 11.

In the present embodiment, when the extending direction of the nozzle 17 is the central axis, the discharge portion 19 can be configured such that the film forming agent solution 21 can be formed at an angle θ of, for example, 30 degrees or more and 80 degrees or less with respect to the center axis. Cone or fan shape spray. The solution 21-like particles having a size of, for example, several hundred μm are discharged from the discharge portion 19.

In the present embodiment, the nozzle 17 and the storage mechanism 23 are connected by the infusion tube 25. Among them, the storage mechanism 23 is a container 11 that stores the film forming agent solution 21, which can supply the solution 21 to the nozzle 17, and is sprayed by the nozzle 17.

As shown in Fig. 1, the other end of the nozzle 17 exposed to the outside of the container 11 is connected to one end of the infusion tube 25, and the other end of the infusion tube 25 is inserted into the inside of the storage mechanism 23 in which the film-forming agent solution 21 is sealed. A valve for on-off control can be provided on the infusion tube 25. When the valve is opened, the (film-forming agent) solution 21 is discharged from the storage mechanism 23 through the infusion tube 25, and then discharged from the discharge portion 19 of the nozzle 17 to the inside of the container 11.

In the present embodiment, the inside of the storage mechanism 23 is continuously pressurized by the input gas to discharge the solution 21 inside thereof from the infusion tube. As shown in Fig. 1, the storage mechanism 23 (which may also be referred to as a storage container) has a gas delivery tube 27 and an infusion tube 25, respectively, and the inflow of the infusion tube 25 is located below the liquid level of the solution 21, and the gas delivery tube 27 is extended. The enthalpy of the solution is located above the level of the solution 21.

The other end of the gas pipe 27 can be connected to the gas supply source 29. The gas supply source 29 is operated in accordance with a command from the controller 16, and supplies a gas to the storage mechanism 23 to push down the liquid level of the storage mechanism 23. Thus, in the embodiment, the gas supply source 29 is supplied with gas to the storage mechanism 23 through the gas delivery pipe 27 to be pressed against the liquid surface of the storage mechanism 23, whereby the film forming agent solution 21 is pressure-fed into the infusion tube 25. In the present invention, the method of outputting the solution 21 by such pressure is not limited.

In the present embodiment, the substrate 100 as a film-forming object may be adapted to the position of the nozzle 17, which may be located below the nozzle 17, or may be located on the opposite side of the nozzle 17. In the present embodiment, the positions of the nozzles 17 and the substrate 100 in the container 11 are adapted to each other, and the film forming material sprayed by the nozzles 17 can be formed on the substrate 100. Of course, as a preferred or common, the nozzle 17 is located at the top of the container 11, and the substrate 100 is located at the bottom of the container 11. In the present embodiment, the film forming apparatus 1 may be provided with an in line method of transporting the substrate 100, thereby performing film formation by an automated method to improve production efficiency.

Specifically, a substrate holder 31 that holds the substrate 100 as a film formation article may be disposed below the inside of the container 11. In the present embodiment, the substrate holder 31 is supported by a transport mechanism including two or more rollers 33, 33, ..., etc., and the substrate holder 31 can be moved inside the container 11 by the operation of the transport mechanism. It should be noted that, in addition to the movement of the straight line (this embodiment), the movement here also includes rotation. In the case of rotation, for example, the substrate holder 31 may be configured in the form of a turntable or the like. The inner surface of the substrate holder 31 has a concave substrate 100 holding surface, and when the film is formed, the back surface of the substrate 100 (either single or two or more) as a film formation is brought into contact with the substrate 100 to hold the substrate 100.

In the present invention, the distance D between the discharge portion 19 and the substrate 100 is not particularly limited as long as the film forming agent solution 21 discharged from the discharge portion 19 in a liquid form can reach the substrate 100 in a liquid form. This is because the film forming agent solution 21 can reach the substrate 100 from the discharge portion 19 by the direction of the discharge portion 19, the initial velocity of the film forming agent solution 21 when discharged from the discharge portion 19, and the film forming agent solution 21. The non-film-forming material contained therein changes in various causes such as vapor pressure (P2) at normal temperature.

In the present embodiment in which the discharge direction of the film forming agent solution 21 is directed downward, by adjusting the arrangement of the discharge portion 19 and the substrate holder 31, the distance D is about 300 mm or less, and it is easy to obtain a sufficient film strength of the obtained film, and it is easy to make Its durability level is improved.

In the present embodiment in which the discharge direction of the film forming agent solution 21 faces downward, by arranging the discharge portion 19 so that the distance D to the substrate 100 is 150 mm or more, a sufficient effective discharge range of the film forming agent solution 21 can be secured, which is advantageous. The useless use of the film forming agent solution 21 is suppressed, and as a result, the cost reduction of the film formation can be more advantageous.

In the case of the present embodiment in which the discharge direction of the film-forming agent solution 21 is downward, when the distance D is too long, the diluent (solvent) of the film-forming agent solution 21 is volatilized during the discharge to reach the substrate. The flattening after 100 becomes difficult to occur, whereby the film distribution becomes uneven, and the film properties sometimes decrease. When the distance D is too close, the effective discharge region becomes narrow, and thus the useless consumption of the film-forming agent solution 21 increases, and film spots may also occur.

First, the controller 16 is provided with a pressure control function in the container 11, and the vacuum pump 15 and the pressure detecting unit 18 are operated to adjust the degree of vacuum inside the container 11 (that is, the pressure at the start of film formation) to an appropriate state. At the same time, it also has a liquid level pressure control function for adjusting the pressure applied to the gas supplied from the gas supply source 29 to the liquid level in the storage mechanism 23. In addition, the controller 16 also has a function of controlling the operation and stop of the transport mechanism including two or more rollers 33 and the like.

In the present embodiment, the heating mechanism 10 can heat the nozzle 17 and/or the inside of the container 11 to compensate for heat loss caused by vaporization of the non-film forming material, and prevent condensation from falling due to a decrease in temperature in the container 11. The problem of the liquid track 200 is generated on the substrate 100.

Considering that the gasification is carried out inside the vessel 11, thereby lowering the temperature inside the vessel 11, even if the temperature of a certain region in the vessel 11 is largely decreased, the region absorbs heat from the vicinity, which may affect the interior of the entire vessel 11. temperature. Based on this consideration, the heating mechanism 10 can heat the inside of the container 11. At this time, the heating mechanism 10 can heat the entire interior of the container 11, or can heat a certain area inside the container 11, and the embodiment is not particularly limited. . Preferably, however, the heating mechanism 10 heats the region of the interior of the vessel 11 adjacent the nozzle 17 as a preferred embodiment of the invention.

The heating mechanism 10 heats the inside of the container 11 (vacuum chamber), thereby inputting heat to the inside of the container 11, which can compensate for the heat lost due to vaporization of the material, thereby reducing the amount of droplets formed by condensation, and eliminating the amount of droplets on the substrate 100. Liquid trace 200.

It is considered that a large amount of the solution 21 is vaporized when the nozzle 17 (the discharge portion 19) is ejected, so that the temperature in the vicinity of the nozzle 17 and the nozzle 17 is largely decreased, and the solution 21 is easily condensed in the vicinity of the nozzle 17 at the time of discharge. The droplets are attached to the exposed surface of the area near the nozzle 17. Generally, the discharge portion 19 of the nozzle 17 is the discharge position of the solution 21, which is also the gasification occurrence position or the gasification generation position, so that the temperature drop at the (discharge portion 19) of the nozzle 17 is also conspicuous, resulting in partial film formation. The mist formed by the material condenses on the outer surface of the nozzle 17 to form droplets.

Based on this consideration, the heating mechanism 10 can heat (partially) the nozzle 17 (located within the container 11). Wherein, the nozzle 17 receives the heat transferred from the heating mechanism 10 without being affected by the gasification to lower the temperature, maintaining a preferred temperature state; at the same time, the nozzle 17 itself can transfer heat (non-absolute vacuum) to the nearby area, maintaining the vicinity. The temperature of the zone is constant so that by heating the nozzle 17, the heat lost due to vaporization of the material can be compensated for, thereby reducing the amount of droplets formed by condensation, eliminating the liquid traces 200 on the substrate 100.

It should be noted that the heating mechanism 10 provided in the present embodiment solves the technical problem by heating the inside of the nozzle 17 or the container 11 to compensate for the heat absorbed by the vaporization of the non-film forming material inside the container 11. Any modifications made by those skilled in the art in light of the above teachings and spirits of the present invention are intended to be included within the scope of the present invention.

In the present embodiment, the heating mechanism 10 may be disposed in the container 11 or may be disposed outside the container 11. For example, the heating mechanism 10 may be disposed outside the container 11, by heating the container 11 to raise the temperature inside the container 11, thereby reducing droplets formed by condensation due to temperature decrease; or, the heating mechanism 10 is located outside the container 11 through the heating nozzle 17. In part, the heat is transferred to the portion of the nozzle 17 located inside the container 11 by heat transfer, thereby heating (the portion) of the nozzle 17 (in the container 11).

In the present embodiment, preferably, the heating mechanism 10 is disposed in the container 11. The heating mechanism 10 may be fixed to the inner wall of the container 11 or may be fixed to components inside the container 11. The fixing mechanism 10 may be welded, screwed, plugged, or the like, and is not particularly limited in the present invention, and only the heating mechanism 10 is located in the container 11.

In view of the above description, it is considered that the nozzle 17 and its vicinity are the droplets (mainly) generating regions, and the heating mechanism is required to transfer the heat generated by the heating mechanism 10 to the heat required for gasification. 10 is placed close to the nozzle 17. At this time, the heating mechanism 10 can heat the nozzle 17 and its surrounding area.

Accordingly, the proximity of the heating mechanism 10 to the nozzle 17 is a relative concept. As shown in Fig. 1, the heating mechanism 10 (the resistance wire 10 described below) may not come into contact with the nozzle 17, but is both sensory (or visually) The interval is very close. Referring to the structure shown in Fig. 1, the heating mechanism 10 is visually closer to the nozzle 17 with respect to the side wall of the container 11, the substrate 100, and the like.

Specifically, the heating mechanism 10 may include a resistance wire 10. Here, the electric resistance wire 10 may be wound around the nozzle 17 in the form of a coil as shown in Fig. 1 to form a heating coil, thereby raising the heating area for heating the nozzle 17, and increasing the heating area.

Of course, the resistance wire 10 and the nozzle 17 may not be in contact with each other to prevent the temperature of the nozzle 17 from being too high to affect the film formation performance of the solution 21. At the same time, the position where the electric resistance wire 10 is disposed may be located above the conical spray area formed by the nozzle 17, thereby avoiding interference with the traveling trajectory of the ejected liquid and interfering with the formation of the film.

In the present embodiment, the resistance wire 10 may be connected to a power supply mechanism through a wire. The power supply mechanism (not shown) may be a power plug or a battery pack provided in the film forming apparatus 1 itself, and the present invention is not particularly limited.

In the present embodiment, in order to facilitate the knowledge of the heating temperature of the heating mechanism 10, the film forming apparatus 1 may further include a temperature measuring mechanism 14 (temperature sensor) capable of measuring the temperature of the nozzle 17 or the inside of the container 11. Preferably, the temperature measuring mechanism 14 may be located inside the container 11 and disposed on the nozzle 17.

Wherein, the temperature measuring mechanism 14 can be coupled to the controller 16 to instantaneously transfer the temperature obtained by the measurement to the controller 16, which regulates the heating mechanism 10 based on the temperature measured by the temperature measuring mechanism 14. As shown in FIG. 1, the temperature measuring mechanism 14 and the heating mechanism 10 (resistance wire 10) can be connected to the controller 16, and the controller 16 can instantly control the heating temperature of the heating mechanism 10 according to the temperature fed back by the temperature measuring mechanism 14. To provide a better film formation environment.

The heating temperature of the heating mechanism 10 cannot be too high, so that the film forming material is not formed on the substrate 100. Of course, the heating temperature provided by the heating mechanism 10 cannot affect the discharge of the solution 21 in the nozzle 17. Preferably, the heating temperature of the heating mechanism 10 is ±100 ° C of the boiling point of the solvent in the solution 21 at normal temperature and normal pressure.

In the present embodiment, the film forming apparatus 1 may further include a temperature adjusting mechanism (reference numeral 16 in the drawing) connected to the heating mechanism 10, which is capable of adjusting the heating temperature provided by the heating mechanism 10.

Among them, the temperature adjustment mechanism can control the heating temperature of the heating mechanism 10 by controlling the magnitude of the current and voltage supplied to the heating mechanism 10. Further, when the heating mechanism 10 is the resistive heating mechanism 10, the temperature adjusting mechanism can directly adjust the magnitude of the resistance of the heating mechanism 10, thereby controlling the heating temperature of the heating mechanism 10. Illustratively, for example, the heating mechanism 10 includes a plurality of heat generating resistors, and the temperature adjusting mechanism can adjust a series-parallel relationship between the plurality of heat-generating resistors or cut off a portion of the heat-generating resistor.

The temperature adjustment mechanism and the controller 16 described above may be the same component or different components. For example, the temperature adjustment mechanism may be a switch, and the operator may change the heating temperature by switching the switch; or the temperature adjustment mechanism 16 and the controller 16 may be a CPU (or PLC) or the like, which may be according to the temperature measuring mechanism 14 The feedback automatically adjusts the heating temperature of the heating mechanism 10.

In the present embodiment, in order to preferably eliminate the liquid traces 200 on the substrate 100, the film forming apparatus 1 may further include a controller 16 connected to the heating mechanism 10. The controller 16 can control the heating mechanism 10 to be heated to a first set temperature before the nozzle 17 starts to spray, and control the heating mechanism 10 to be heated to a second set temperature after the nozzle 17 starts to spray liquid; The second set temperature is higher than the first set temperature. Wherein the second set temperature is higher than the first set temperature.

After the liquid discharge is started, the heating mechanism 10 can gradually raise the temperature to the second set temperature, or can raise the temperature to the second set temperature in a shorter time. Specifically, the heating rate of the first set temperature and the second set temperature of the heating mechanism 10 can be matched with the temperature drop rate when the heating mechanism 10 is not actually disposed, so that the heat provided by the heating mechanism 10 and the heat absorbed by the gasification are increased. Match.

It should be noted that the controller 16, the control unit, and the temperature adjustment mechanism may be a combination of a hardware, a soft body, or a soft body and a hardware. For example, the controller 16, the control unit, and the temperature adjustment mechanism may each be a CPU, a PLC, a circuit board, or a computer, and thus have a physical structure; or may have multiple functional modules (eg, a data module, a determination module, Software program for computing modules, etc.). Further, the controller 16, the control unit, and the temperature adjustment mechanism may be the same member or different members, and the present invention is not limited thereto.

Please refer to FIG. 2 and FIG. 3 , wherein FIG. 1 is a picture of a substrate 100 with a film formed by a (decompression spray) film forming apparatus 1 of the prior art, and FIG. 2 is a view of the embodiment. A picture of the substrate 100 with a film formed by the film device 1. Among them, the film forming conditions of the two are the same, and the film forming apparatus 1 of the present embodiment has the heating mechanism 10 (resistance wire 10) which is heated during the film forming process. As can be seen from the comparison of Fig. 2 and Fig. 3, the film forming apparatus 1 provided in the present embodiment can effectively eliminate the liquid traces 200 formed on the substrate 100 during film formation.

Any numerical value recited herein includes all values of the lower and upper values in increments of one unit from the lower limit to the upper limit, and at least two unit intervals between any lower value and any higher value. Just fine. For example, if the value of a component or process variable (eg, temperature, pressure, time, etc.) is stated to be from 1 to 90, preferably from 20 to 80, more preferably from 30 to 70, the purpose is to illustrate Values such as to 85, 22 to 68, 43 to 51, 30 to 32 are also explicitly recited in the description. For values less than 1, one unit is appropriately considered to be 0.0001, 0.001, 0.01, 0.1. These are only examples of what is intended to be expressly stated, and all possible combinations of the values recited between the minimum and the maximum value are considered to be explicitly described in the specification in a similar manner.

All ranges include endpoints and all digits between the endpoints unless otherwise indicated. "About" or "approximately" as used in connection with a range is suitable for the two endpoints of this range. Thus, "about 20 to 30" is intended to cover "about 20 to about 30", including at least the indicated endpoints.

All articles and references disclosed, including patent applications and publications, are hereby incorporated by reference for all purposes. The term "consisting essentially of" to describe a combination shall include the identified elements, components, components or steps and other elements, components, components or steps that do not substantially affect the basic novel features of the combination. The use of the terms "comprising" or "comprises" or "comprises" or "comprises" or "comprising" or "comprising" or "comprising" or "comprises" By using the term "may" herein, it is intended to mean that any of the attributes described as "may" are optional.

Multiple elements, components, components or steps can be provided by a single integrated element, component, component or step. Alternatively, a single integrated component, component, component or step may be divided into separate components, components, components or steps. The use of the <RTI ID=0.0> </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt;

It is to be understood that the above description is for the purpose of illustration and not limitation. Many embodiments and many applications beyond the examples provided will be apparent to those skilled in the art from this description. Therefore, the scope of the present teachings should be determined by referring to the above description, and the scope of the appended claims and the scope of the equivalents of the claims. The disclosures of all articles and references, including patent applications and publications, are hereby incorporated by reference in its entirety for all purposes. The omitting of any aspect of the subject matter disclosed herein is not intended to be a disclaiming of the subject matter, and the inventor is not considered to be a part of the disclosed inventive subject matter.

Claims (10)

 A film forming apparatus comprising: a container capable of accommodating a substrate therein; an exhaust mechanism capable of exhausting the inside of the container to a vacuum state; a storage mechanism for storing the solution; capable of discharging the solution to the inside a nozzle on the substrate; and a heating mechanism capable of heating the nozzle and/or the interior of the container.    The film forming apparatus of claim 1, wherein the heating mechanism is disposed in the container.    The film forming apparatus of claim 2, wherein the heating mechanism is disposed adjacent to the nozzle.    The film forming apparatus of claim 1, wherein the heating mechanism comprises a resistance wire.    The film forming apparatus of claim 1, further comprising a temperature measuring mechanism capable of measuring a temperature of the nozzle or the inside of the container.    The film forming apparatus of claim 5, wherein the temperature measuring mechanism is located inside the container and disposed on the nozzle.    The film forming apparatus of claim 1, further comprising a temperature adjusting mechanism connected to the heating mechanism, which is capable of adjusting a heating temperature provided by the heating mechanism.    The film forming apparatus of claim 1, further comprising a controller connected to the heating mechanism, wherein the controller is capable of controlling the heating mechanism to be heated until the nozzle starts to spray liquid The heating mechanism is controlled to be heated to a second set temperature after a set temperature and after the nozzle starts to spray.    The film forming apparatus of claim 8, wherein the second set temperature is higher than the first set temperature.    The film forming apparatus according to claim 1, wherein the heating means has a heating temperature of ± 100 ° C of a boiling point of the solvent in the solution at normal temperature and normal pressure.